The present invention relates to a multilayer film including at least one film surface which has an increased surface roughness achieved by protrusion creating particles. The at least one film surface may have a surface roughness characterized by a coefficient of roughness (CR) of ≥0.02 or a Parker Print Surf roughness of at least 2 μm.

The present invention relates to a polymer composition (I) comprising at least the following components: (A) 87.00 to 99.79 wt.-% based on the overall weight of the polymer composition (I) of a specific polymer, (B) 0.20 to 10 wt.-% based on the overall weight of the polymer composition (I) of a specific copolymer of ethylene and (C) 0.01 to 3.00 wt.-% based on the overall weight of the polymer composition (I) of a compound according to Formula (a), whereby components (A), (B) and (C) add up to 100 wt.-%. In addition, the present invention refers to a photovoltaic module comprising at least one layer comprising polymer composition (I), to a method for improving the storage stability and/or transport stability of polymer (A) and to the use of components (B) and (C) for improving the storage stability and/or transport stability of a polymer (A).

A multilayer film comprises an adhesive layer A comprising an HMPSA composition (a); a complexable thin layer B comprising a PolyEthylene (PE) composition (b); and a heat-sealable and breakable layer C comprising a PolyEthylene (PE) composition (c). Layers B and C are bonded together by layer A. The film is characterized in that (i) the melt flow indices of compositions (b) and (c), denoted MFI(b) and MFI(c), respectively, are each between 2.5 and 15 g/10 minutes; and (ii) the melt flow index of composition (a), denoted MFI(a), is such that the ratios MFI(a)/MFI(b) and MFI(a)/MFI(c) are each between 1.5 and 10. A process for manufacturing the film comprises flat sheet coextrusion of composition (a) and of compositions (b) and (c) at a temperature of between 150° C. and 250° C. The multilayer film can be used for the manufacture of resealable packaging.

A multilayer film comprises an adhesive layer A comprising an HMPSA composition (a); a complexable thin layer B comprising a PolyEthylene (PE) composition (b); and a heat-sealable and breakable layer C comprising a PolyEthylene (PE) composition (c). Layers B and C are bonded together by layer A. The film is characterized in that (i) the melt flow indices of compositions (b) and (c), denoted MFI(b) and MFI(c), respectively, are each between 2.5 and 15 g/10 minutes; and (ii) the melt flow index of composition (a), denoted MFI(a), is such that the ratios MFI(a)/MFI(b) and MFI(a)/MFI(c) are each between 1.5 and 10. A process for manufacturing the film comprises flat sheet coextrusion of composition (a) and of compositions (b) and (c) at a temperature of between 150° C. and 250° C. The multilayer film can be used for the manufacture of resealable packaging.

An object of the present invention is to provide a heat-resistant film that is suitable for protection of a surface provided with electrical conduction, decoration or the like in a plastic product, a glass product, a ceramic product, and the like, or that is suitable for holding a semiconductor, dies, and the like in producing dies through dicing and singulation. The film that solves the above object is a heat-resistant film comprising a thermoplastic resin, wherein (a) the thermoplastic resin is a polyester-based elastomer comprising a hard segment and a soft segment that are linked to each other, (b) the hard segment comprises a polyester unit constituted from an aromatic dicarboxylic acid and an aliphatic diol or an alicyclic diol, (c) the soft segment is constituted mainly from the prescribed polycarbonate, (d) a weight ratio of the hard segment contained in the polyester-based elastomer exceeds 50%, and (e) the film comprising the thermoplastic resin has an elastic modulus of 30 to 500 MPa, an elongation at break of 200 to 700%, and a ratio F50/F25 of 1.05 or more, the ratio F50/F25 being a ratio of a stress F50 at an elongation of 50% to a stress F25 at an elongation of 25%.

The present invention relates to an MDO heat-shrinkable film of a copolymer polyester having excellent thermal resistance. In particular, the present invention provides a copolymer polyester MDO (machine direction orientation) thermoresistant heat-shrinkable film that consists of a copolymer polyester resin including isosorbide and 1,4-cyclohexanedimethanol at an optimized content ratio as a diol component copolymerized with an acid component including terephthalic acid, and having a number average molecular weight of 18,000 g/mol or more, and can be used for labels, cap seals, direct packaging, etc. of various containers due to the high shrink initiation temperature.

The present invention relates to an MDO heat-shrinkable film of a copolymer polyester having excellent thermal resistance. In particular, the present invention provides a copolymer polyester MDO (machine direction orientation) thermoresistant heat-shrinkable film that consists of a copolymer polyester resin including isosorbide and 1,4-cyclohexanedimethanol at an optimized content ratio as a diol component copolymerized with an acid component including terephthalic acid, and having a number average molecular weight of 18,000 g/mol or more, and can be used for labels, cap seals, direct packaging, etc. of various containers due to the high shrink initiation temperature.

The present application provides an optical film. By controlling transmittance of a liquid crystal layer comprising a radical initiator for the maximum absorption wavelength of the radical initiator, the present application can provide an optical film having a liquid crystal layer having excellent resistance to external stimuli and excellent optical properties. Such an optical film can have various forms and can be used in various fields.

The present disclosure provides a fitment. In an embodiment, a fitment is provided and includes a top portion, a base, and a channel extending through the top portion and the base for passage of a flowable material. The fitment is composed of a polymeric composition. The polymeric composition includes (i) from 70 to 90 weight percent of a high density polyethylene (HDPE) having a density from 0.940 g/cc to 0.970 g/cc, a melt temperature, Tm, greater than 125° C., and a melt index from 1 g/10 min to 50 g/10 min; and (ii) from 30 to 10 weight percent of an olefin-based elastomer having a density from 0.860 g/cc to 0.905 g/cc, a melt index from 0.2 g/10 min to 50 g/10 min, and a Tm less than 125° C.

The present disclosure provides a fitment. In an embodiment, a fitment is provided and includes a top portion, a base, and a channel extending through the top portion and the base for passage of a flowable material. The fitment is composed of a polymeric composition. The polymeric composition includes (i) from 70 to 90 weight percent of a high density polyethylene (HDPE) having a density from 0.940 g/cc to 0.970 g/cc, a melt temperature, Tm, greater than 125° C., and a melt index from 1 g/10 min to 50 g/10 min; and (ii) from 30 to 10 weight percent of an olefin-based elastomer having a density from 0.860 g/cc to 0.905 g/cc, a melt index from 0.2 g/10 min to 50 g/10 min, and a Tm less than 125° C.