A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.

Provided is a windmill blade, comprising a core material formed of an acrylic resin expanded article and an outer skin covering the core material, in winch the outer skin is formed of a fiber-reinforced resin material including a carbon fiber and a resin, and the acrylic resin expanded article has a specified bending modulus.

A metal or composite component assembly includes a first metal or composite component, a second metal or composite component, and an adhesive layer arranged on an interface of the first and second components and bonding the first and second components. The adhesive layer comprises a fast-cure low-strength adhesive and a high-strength structural adhesive.

A method for producing a fiber composite laminate, including the steps of applying pressure and/or heat to a first preform, which has one or more dry fiber layers and a thermoplastic elastomer, such that the thermoplastic portion of the thermoplastic elastomer completely impregnates the dry fiber layers of the first preform in at least one first region and only partially impregnates the dry fiber layers in at least one second region and, in a thermosetting polymer matrix, impregnating and curing the fiber layers of the second region of the first preform that are still dry and have not been impregnated with the thermoplastic portion of the thermoplastic elastomer.

Provided is an electromagnetic wave shielding material that can exhibit improved electromagnetic wave shielding property, light-weight property and formability. The present invention relates to an electromagnetic wave shielding material comprising a laminate in which N number of metal foils each having a thickness of 5 to 100 μm and N+1 number of resin layers each having a thickness of 5 μm or more are alternately laminated or a laminate in which N+1 number of metal foils each having a thickness of 5 to 100 μm and N number of resin layers each having a thickness of 5 μm or more are alternately laminated, N being an integer of 2 or more, wherein thickness of the laminate is from 100 to 500 μm, and wherein, when a thickness center of the laminate is used as a reference, for all pairs of interfaces at which sequences of the resin layers and the metal foils on both upper and lower sides of the reference correspond to each other, distances from the reference to the interfaces have an error of within ±10%.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A composite epoxy resin board, made from a raw material which includes the following weight percentage of components: waste prepreg powders of 5% to 100%, and waste printed circuit board (PCB) powders of 0% to 95%, is disclosed. The present invention adopts the waste prepregs as the main preparation raw material, which not only recycles and reuses prepreg scraps, but also reduces or even eliminates the use of adhesives due to the high epoxy resin content in the prepregs, while also reducing the glue-mixing time in the forming process, thereby simplifying the forming technology.

A panel apparatus is described that includes a first sandwich panel and a second sandwich panel arranged substantially parallel to each other, and the first sandwich panel and the second sandwich panel each include a core material inserted between at least two skin layers. The panel apparatus also includes at least one mechanical fastener mechanically embedded into the first sandwich panel and the second sandwich panel. The at least one mechanical fastener at least extends through one skin layer and into the core material of the first sandwich panel and at least extends through one skin layer and into the core material of the second sandwich panel, and the at least one mechanical fastener is configured to accept insertion of an item. Methods of assembling the panel apparatus are also described.

Aluminum alloy foil that, when used for battery packaging material, unlikely to develop pinholes or cracks even during molding of battery packaging material, and can exhibit excellent moldability. Aluminum alloy foil, which is for use in battery packaging material, wherein, with respect to cross section obtained by cutting aluminum alloy foil in vertical direction to rolling direction of aluminum alloy foil, which is a vertical direction to surface of aluminum alloy foil, proportion of total area of a {111} plane in total area of crystal planes of face-centered cubic structure, obtained by performing crystal analysis using EBSD method, is 10% or more; and with respect to cross section, a number average grain diameter R (rpm) of crystals in face-centered cubic structure, obtained by performing crystal analysis using EBSD method, satisfies following equation: number average grain diameter R≤0.056X+2.0, where X=thickness (rpm) of aluminum alloy foil.

Described herein is flooring formed of an eco-friendly material, where the flooring has excellent heat resistance, durability, abrasion resistance and dimensional stability, and is formed of a non-PVC material and thus is recyclable via an extrusion processing at the time of disposal after use. Specifically, eco-friendly flooring is described in which a coating layer, an overlayer having ionomers, a printing layer, at least one middle layer, and at least one underlayer are laminated in order, where the overlayer of the flooring has ionomers, at least one of the middle layer and the underlayer has a thermoplastic polyolefin-based resin, a styrene-based resin, oil, and a filler, the thermoplastic polyolefin-based resin is contained in an amount of 50 to 150 parts by weight with respect to 100 parts by weight of the styrene-based resin, and the styrene-based resin may contain 25 to 45% styrene.