A mobile molding system, comprising a vehicle and one or more molds arranged on the vehicle configured for receiving one or more expandable nonwoven substrates, heating said one or more expandable nonwoven substrates so as to cause said one or more expandable nonwoven substrates to expand and fill the one or more molds with one or more expanded nonwoven containing articles of three dimensional shape, and releasing said one or more expanded nonwoven containing articles of three dimensional shape from the one or more molds is provided. Methods for manufacturing three dimensional objects using the mobile molding system are also provided.

A substrate laminating apparatus includes: a first holding mechanism configured to hold a first substrate; a second holding mechanism configured to hold a second substrate and change a distance between the first substrate and the second substrate; a load detecting mechanism configured to detect a load originated from a surface tension acting between the first substrate and the second substrate; and a driving mechanism configured to control a distance between the first substrate and the second substrate based on a detection value of the load detecting mechanism.

A bonding device includes: a stage and a pressing part, which is placed on the stage and is movable toward the stage. A first layer, which is disposed on an upper surface of the stage, includes a first flat portion and first bending portions. A second layer, which is disposed below a lower surface of the pressing part, includes a second flat portion and second bending portions. The first and second bending portions may be disposed between the stage and the pressing part, in a state bent with curvatures, respectively. The curvature of a lower surface of each of the second bending portions is smaller than the curvature of an upper surface of each of the first bending portions.

An overlay applicator tray including a cradle including a device slot. The device slot is configured to securely hold an electronic device in the cradle. The overlay applicator tray also can include an overlay applicator. The overlay applicator can include an overlay layer and an adhesive release liner. The overlay layer can include a top side and a bottom side. The bottom side is configured to be adhered to a screen of the electronic device. The adhesive release liner is removably attached to the bottom side of the overlay layer. The overlay applicator tray additionally can include an alignment piece coupling the cradle to the overlay applicator. The alignment piece aligns the overlay layer of the overlay applicator with the screen as the overlay layer is applied to the screen when the electronic device is securely held in the device slot. The overlay applicator tray further can include a first pull tab on the adhesive release liner. The first pull tab is configured to be pulled to remove the adhesive release liner from the bottom side of the overlay layer and expose an adhesive of the overlay layer. Other embodiments are described.

Disclosed is a buffer component and a pressing device, the buffer component is applied to the pressing device. The pressing device includes an anisotropic conductive film pressure knife, the buffer component includes an inserting part, which is made of a first elastic material, and the inserting part is configured to insert into a lower end of the anisotropic conductive film pressure knife; and a buffering part, which is made of a second elastic material, the buffering part is configured to closely attach to a lower end surface of the lower end of the anisotropic conductive film pressure knife.

The invention relates to a method for producing an adhesive bond between at least a first and a second, at least partially transparent planar component, in which the first component is laid onto a support plate, and an adhesive is applied to the first component at specified locations on the side of the first component facing away from the support plate, and the second component is laid onto the first component and is held parallel to the first component at a predefined distance, in such a way that the second component comes into contact with the adhesive on the first component.

A bonding apparatus includes a support including a cavity, and a window fixing chuck facing the support. The support includes a first part including a first through hole extending from the cavity, and a second part extending in a downward direction from the first part and including a second through hole extending from the cavity. A first distance between a first inner surface of the first part and a first outer surface of the first part is less than a second distance between a second inner surface of the second part and a second outer surface of the second part. The first inner surface of the first part and the second inner surface of the second part form the cavity.

The present disclosure relates to the technical field of film sticking, more particularly to a sticking film, a film-sticking tool and a film-sticking assembly. The sticking film includes a tempered film for attaching to the screen of an electronic product, and a release film layer attached to the tempered film. The release film layer is an electrostatic layer, the release film layer and the tempered film are separated when pasting, and the side of the release film layer that is attached to the tempered film generates static electricity to attract dust on the screen. Thus, static electricity can be generated when the release film layer and the tempered film are separated, which can attract dust on the screen of electronic products and clean the screen, and avoids dust particles from scratching the screen due to direct wiping of the screen, resulting in damage to the performance of the screen.

A sheet processing apparatus includes a sheet entrance portion, a post-processing device, and circuitry. The sheet entrance portion receives a sheet medium conveyed from an upstream apparatus. The post-processing device separates a two-ply sheet, inserts the sheet medium into the two-ply sheet, and performs a heating operation on the two-ply sheet in which the sheet medium is inserted. The circuitry causes the post-processing device to interrupt a post-processing operation, as one of a series of post-processing operations up to the heating operation, in response to an occurrence of an abnormal condition of the upstream apparatus, and resume the post-processing operation interrupted due to the abnormal condition of the upstream apparatus, in response to a recovery from the abnormal condition of the upstream apparatus.

According to the utility model, there is provided a film laminator for cell phones, useful for film lamination on a surface of a cell phone, including: a cell phone fixing plate, on which a through hole for receiving the cell phone is established, and a top surface of which is a horizontal face; with at least one position limiting plate for abutting the cell phone within the through hole being also fixed on the top surface. The film laminator for cell phones further includes: a film laminating plate for fixing a cell phone film; one end of which is hinged to the cell phone fixing plate, and the other end of which is movable freely so that the film laminating plate is bonded with the top surface of the cell phone fixing plate. With respect to the film laminator for cell phones according to the utility model, because the position limiting plate is provided on the cell phone fixing plate, the surface of the cell phone to which a film is to be attached can handily be kept in flush with the top surface of the cell phone fixing plate. Upon film lamination, the film laminating plate can contact with the top surface of the cell phone fixing plate and the surface of the cell phone to which a film is to be attached at the same time, so that the stress that is laid on it in the course of film lamination is very even, and a good effect of film lamination is obtained.