A composite laminate structure includes a cellular core and a first laminate layer coupled to the cellular core. The first laminate layer includes a first thermoplastic layer and a first fiber-reinforced polymer layer, where a first surface of the first fiber-reinforced polymer layer is thermally consolidated to a second surface of the first thermoplastic layer. A first surface of the first thermoplastic layer is directly in contact with and bound to a first surface of the cellular core by temperature reduction of the first thermoplastic layer below a glass transition temperature of the first thermoplastic layer while the cellular core is pressed against the first thermoplastic layer when the first thermoplastic layer is above the glass transition temperature of the first thermoplastic layer and the cellular core is below a temperature where materials of the cellular core flow or degrade.

Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.

A method of preparing a multi-layer assembly, or of protecting a surface of a multi-layer substrate from damage and/or contamination and/or debris, said method comprising the steps of: (i) providing a composite film comprising a polymeric base layer having a first and second surface and disposed on the first surface thereof a polymeric protective layer having a first surface and a second surface such that the first surface of the said base layer is in contact with the first surface of the polymeric protective layer, wherein said polymeric protective layer comprises an ethylene-based copolymer, and preferably wherein the polymeric base layer comprises a polyester derived from one or more diol(s) and one or more dicarboxylic acid(s); (ii) removing said polymeric protective layer from the first surface of said base layer; (iii) disposing on the exposed first surface of said base layer one or more functional layers to provide a multi-layer substrate, wherein the, or at least the uppermost, functional layer comprises zinc and/or tin in an amount of from about 5 to about 80 wt % of said functional layer; and (iv) disposing a polymeric protective layer comprising an ethylene-based copolymer onto the exposed surface of the, or at least the uppermost, functional layer comprising zinc and/or tin to provide a multi-layer assembly.

A retaining device, includes a base (51) extending in a longitudinal direction and presenting a top face (511) and a bottom face (512); and a plurality of retaining elements extending from the top face (511) of the base (51), each of the retaining elements being formed by a stem (52) surmounted by a head (53), the stem (52) having a bottom end (521) connected to the base (51), and a top end (522) opposite from the bottom end (521), the head (53) surmounting the top end (522) of the stem (52), and having a bottom face facing towards the base and a top face opposite from the bottom face.

To provide a laminated body in which wrinkles and delamination are suppressed, a method for its production, and a method for producing a flexible printed circuit board in which occurrence of wrinkles and delamination is suppressed. A method for producing a laminated body comprises disposing, on one side or both sides of a first substrate composed of either one or both of a heat-resistant substrate layer and a metal foil layer, a second substrate containing a fluororesin and having a first surface of which the wetting tension is from 30 to 60 mN/m and a second surface of which the wetting tension is smaller by at least 2 mN/m than the wetting tension of the first surface, so that the first surface faces the first substrate side; and while transporting the first substrate and the second substrate, pressing them in the thickness direction at a temperature T.sub.1 of from 0 to 100 C. for lamination, to obtain a laminated body I in which the first substrate and the second substrate are directly laminated.

A method of making a midsole for an article of footwear includes forming a plurality of foam layers, arranging the plurality of foam layers in a mold to form the midsole, piercing the plurality of foam layers with pins, and introducing heat with the pins to bond the plurality of layers together.

[PROBLEM TO BE SOLVED]

To provide a composite of thermally-modified polymer layer and inorganic substrate, a composite of polymer member and inorganic substrate, and production methods thereof.

[MEANS TO SOLVE THE PROBLEM]

The method of the present invention for producing a composite of thermally-modified polymer layer and inorganic substrate 110 or 120 includes forming a first polymer layer on an inorganic substrate 10, and heating and thermally modifying the first polymer layer in order to bond the first thermally-modified polymer layer 20 onto the inorganic substrate. In addition, the method of the present invention for producing a composite of polymer member and inorganic substrate 210 or 220 includes producing a composite of thermally-modified polymer layer and inorganic substrate by the method of the present invention and joining the polymer member to the first thermally-modified polymer layer so that the polymer member 30 is joined to an inorganic substrate via the first thermally-modified polymer layer.

Provided are laminates including polyethylene and an extruded web layer. The laminates can be adhesiveless and fully compatible with polyethylene recycling streams. They can exhibit improved, maintained, or desirable properties in comparison to existing laminate structures that are not fully compatible with polyethylene recycling streams. The laminate comprises a first film, an extruded web layer, and a second film, where the extruded web layer is between the first film and a lamination layer of the second film and the laminate is formed via extrusion lamination of the extruded web layer.

The present invention relates to a movable laminator and a plastic flooring laminating device applied by same. A laminating mechanism, a driving mechanism and a conveying mechanism assembled on a rack compose the laminator which can make continuous reciprocating movements. The movable laminator is then disposed in an automatic production line for plastic flooring to cooperate with an extruder, a rolling unit and a drawing mechanism to laminate a plastic flooring material composed of a substrate layer, a printed layer and a wear-resisting layer into a finished plastic flooring product in an automatic operation manner. Because the time of the lamination of the material by the movable laminator can match the speed at which the material is conveyed and moved, the laminating mechanism is driven by the second power source to move from the front section position to the rear section position on the rack.

The present invention is generally directed to prepreg composites, typically in the form of unidirectional tapes, which contain at least one reinforcing fiber and a thermoplastic polyester matrix. The prepreg composites can be thermally bonded to a wood-containing material in order to improve the structural performance of the material without requiring adhesives. The prepreg composite of the present invention can be applied to a wide range of wood substrates, including various hardwoods, softwoods, and engineered wood composites.