Embodiments generally relate to apparatus and methods for dismantling a hermetically sealed chamber. In one embodiment, an apparatus facilitating the opening of a hermetically sealed chamber in a device comprises a fixture configured to hold the device, and a system configured to create sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. In one embodiment, a method for opening a hermetic seal between first and second elements forming a chamber in a microfluidic chip comprises using a release technique creating sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. The release technique comprises introducing a tool to the vicinity of the interface without any contact between the tool and any material within the chamber. The breaking of the seal results in the complete separation of the first and second elements.

A glueless dustless composite flooring material system providing PVC-based flooring having waterproof layers providing different qualities of hardness, wear-resistance, sound deadening, and decorative patterns, avoiding the use of moisture-susceptible compressed cellulose-based filler, with layers fused together, avoiding the manufacturing complexity and delamination risks of using glue or adhesive, with a quickly-cured, UV-cured top coating providing long-lasting high performance and shortening and simplifying the manufacturing, which can be done in a sheet-form, essentially continuous-run manner, with an ability to quickly and simply change the optional design printing and texturing produced, and having an optional underlayment layer.

Methods for preparing multi-layer optical laminates include placing an optical film that is free form an adhesive layer between first and second glass substrates that are free of an adhesive layer, placing this laminate under vacuum, and then heating the laminate under pressure to a temperature above the softening temperature of the optical film. The glass substrates are free of an adhesive layer but may include a silane surface treatment. The resulting multi-layer laminate is optically clear and does not show scattering of reflected light by the optical film.

A laminator for high-precision solvent-bonding of retardation films is disclosed. The laminator is capable of producing laminates with high orientation repeatability and low in-plane stress which can otherwise create gaps between optimum theoretical performance and that which is physically realizable. Batch-mode laminators are scalable to large area mother-sheets and are suited to high-throughput manufacturing.

A method for producing a member for a semiconductor manufacturing apparatus includes (a) a step of providing an electrostatic chuck, a supporting substrate, and a metal bonding material, the electrostatic chuck being made of a ceramic and having a form of a flat plate, the supporting substrate including a composite material having a difference in linear thermal expansion coefficient at 40 to 570° C. from the ceramic of 0.2×10.sup.−6/K or less in absolute value, and (b) a step of interposing the metal bonding material between a concave face of the supporting substrate and a face of the electrostatic chuck opposite to a wafer mounting face, and thermocompression bonding the supporting substrate and the electrostatic chuck at a predetermined temperature to deform the electrostatic chuck to the shape of the concave face.

To provide a polyrotaxane composite formed body produced by strong bonding between a crosslinked polyrotaxane formed body and an elastomer formed body without intervention of an adhesive.

Provided is a method for producing a polyrotaxane composite formed body, the method including subjecting a surface of a crosslinked polyrotaxane formed body and a surface of an elastomer formed body to plasma treatment, and pressure joining the treated surfaces together, to thereby bond the formed bodies. Also provided is a polyrotaxane composite formed body including a crosslinked polyrotaxane formed body and an elastomer formed body, wherein these formed bodies are directly bonded together without being intermingled with each other in the absence of an adhesive layer between the formed bodies, an oxygen-rich layer is present between the bonding surfaces of the formed bodies, and the formed bodies exhibit a peel strength of 1 N/m or more.

A multilayer self-adhesive fouling release coating composition includes an optional removable underlying liner; an adhesive layer applied over and to the optional underlying liner when the latter is present; and a synthetic material layer applied over and to the adhesive layer. Optionally, an intermediate silicone tie coat is applied over and to the synthetic material layer. A silicone fouling release top coat is applied over and to the synthetic material layer, or, when present, over and to the intermediate silicone tie coat. Optionally, a removable polymeric film is applied over and to the fouling release top coat.

A laminate body of a rubber layer and a resin layer made of a resin, wherein the rubber layer includes a surface-treated superficial layer 4 directly united with the resin layer without any intervening adhesive layer.

A process for producing an adhesive-free laminate is described herein. The process includes printing an ink on a surface of a first film, exposure of the printed film to UV radiation such that the ink is at least partially cured, contacting the first film to a second film such that the ink is between the first and second film, and exposing the combination of the first film, the ink and the second film to a second UV radiation. It has been found that this process can produce a high-quality laminate, without the presence of an adhesive.

A method for assembling an assembly comprising a tape (100) of retaining elements and a substrate (200), said method comprising the following steps: a step of forming a tape of retaining elements by dispensing a molding material into a molding device (1), so as to form a tape (100) of retaining elements comprising a base (51) presenting a bottom face (511) and a top face (512), the top face (511) of the base (51) being provided with retaining elements; and a step of applying a substrate (200) against the bottom face (511) of the base (51) prior to said bottom face (512) of the base (51) solidifying in such a manner as to cause the substrate (200) to penetrate at least in part beyond a plane defined by the bottom face (511) of the base (51) of the tape (100).