A making plastic flooring having a backing contains: a body which has a substrate, a printing layer, and an anti-abrasion layer. A method of making the plastic flooring contains steps of: (A). producing a semi-finished plastic flooring, wherein the semi-finished plastic flooring has the substrate, the printing layer, and the anti-abrasion layer; (B). moving and positioning the semi-finished plastic flooring on a predetermined position of drop plastic equipment, wherein the semi-finished plastic flooring is faced upward; (C). molding the backing, wherein the backing material is melt and is spray onto a bottom of the substrate of the semi-finished plastic flooring by using drop plastic equipment, and the backing material is adhered on the bottom of the substrate of the semi-finished plastic flooring after being solidified; and (D). cutting, wherein the semi-finished plastic flooring having the backing is removed and is cut into a desired size, thus producing the body.

The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.

The invention relates to novel processes for the lamination of semi-crystalline, high-melting point, low glass transition polymeric films, which are extruded and subsequently laminated on various thermally sensitive substrates to form laminated medical device constructs in a specific time interval to allow low processing temperatures to avoid polymer film and/or substrate degradation or heat-related distortions. Also disclosed are laminated medical device constructs made from such processes.

Described herein is a process for preparing a flexible packaging material (6). The process may comprise: providing a base material (1) having a first surface (1a) and a second surface (1b), the first surface (1a) having an electrostatic ink composition (4) printed thereon; providing a sealant layer (3) on the second surface (1b) of the base material (1); providing a flexible substrate (4) on which a thermally activatable laminating layer (5) has been deposited; and contacting under conditions of heat and/or pressure the thermally activatable laminating layer (5) disposed on the flexible substrate (4) with the first surface (1a) of the base material (1) on which the electrostatic ink composition (4) is printed.

A protective assembly comprises a first region formulated and configured to provide protection from alpha, beta, and electromagnetic radiation and comprising a composite of particles and polymer; a second region formulated and configured to provide protection from ballistic impact and comprising a composite of fibers and polymer; and a third region formulated and configured to provide protection from thermal radiation and comprising a composite of particles, fiber, and polymer. The protective assembly may be provided on an aerospace structure. The protective assembly may be formed on the aerospace structure body using a co-curing process.

A laminate body of a rubber layer and a resin layer made of a resin, wherein the rubber layer includes a surface-treated superficial layer 4 directly united with the resin layer without any intervening adhesive layer.

The invention is a laminate having a resin layer containing a crystalline alicyclic structure-containing resin and a metal layer in direct contact with the resin layer, wherein an average linear expansion coefficient of the resin layer at 60 to 100° C. is 5 to 50 ppm/° C., and a ten-point average roughness (Rz) on an interface between the resin layer and the metal layer is 2.0 μm or less, and a method for producing the laminate, and a flexible printed circuit board using the laminate. One aspect of the invention provides a laminate which has a resin layer and a metal layer in direct contact with the resin layer and is suitably used as a substrate material, and a production method therefor, as well as a flexible printed circuit board using the laminate.

A retaining device includes a base (51) extending in a longitudinal direction and presenting a top face (511) and a bottom face (512); and a plurality of retaining elements extending from the top face (511) of the base (51), each of the retaining elements being formed by a stem (52) surmounted by a head (53), the stem (52) having a bottom end (521) connected to the base (51), and a top end (522) opposite from the bottom end (521), the head (53) surmounting the top end (522) of the stem (52), and having a bottom face facing towards the base and a top face opposite from the bottom face.

To provide a treated polymer production method which can be performed in a simplified manner and at low cost. In order to achieve the object, the treated polymer production method according to the present invention includes: reacting a surface of a polymer with a halogen oxide radical to surface-treat the polymer. The treated polymer is a metal-plated polymer, and the method further includes plating, with a metal, the surface of the polymer after the surface-treating, or the treated polymer is an adhesion laminate of the polymer and an adherend, and the method further includes adhering the adherend to the surface of the polymer after the surface-treating.

A method of making a midsole for an article of footwear includes forming a plurality of foam layers, arranging the plurality of foam layers in a mold to form the midsole, piercing the plurality of foam layers with pins, and introducing heat with the pins to bond the plurality of layers together.