Methods of forming semiconductor structures include providing a polymeric material over a carrier substrate, bonding another substrate to the polymeric material, and lowering a temperature of the polymeric material to below about 15° C. to separate the another substrate from the carrier substrate. Some methods include forming a polymeric material over a first substrate, securing a second substrate to the first substrate over the polymeric material, cooling the polymeric material to a temperature below a glass transition temperature of the polymeric material, and separating the second substrate from the first substrate. Semiconductor structures may include a polymeric material over at least a portion of a first substrate, an adhesive material over the polymeric material, and a second substrate over the adhesive material. The polymeric material may have a glass transition temperature of about 10° C. or lower and a melting point of about 100° C. or greater.

A resin film-laminated metal sheet includes a metal sheet and thermoplastic resin films that are fused to both surfaces of the metal sheet, the metal sheet is a steel sheet having a thickness of 0.08 mm or more or an aluminum sheet having a thickness of 0.15 mm or more, and, when a surface of the thermoplastic resin film opposite to a surface that is fused to the metal sheet is defined as a first surface, the surface tension on the first surface in at least one of the thermoplastic resin films is 50 mN/m or less, the surface tension on the surface that is fused to the metal sheet is 36 mN/m or more, and the amount of a wax attached to the first surface is more than 0 mg/m.sup.2 and 5.00 mg/m.sup.2 or less.

A decorative panel including a substrate material and a decorative top layer, wherein the decorative top layer includes at least one timber layer with a wood structure, wherein the timber layer is a compressed timber layer with naturally occurring vessels throughout a thickness of the wood structure, the vessels being collapsed.

Disclosed is a composite floor, comprising a wear-resistant layer, a polyvinyl chloride patterned fabric layer, a base material layer, a balance layer, and a muting layer that are sequentially arranged, the wear-resistant layer being a melamine wear-resistant paper layer. The composite floor has a clear and vivid pattern, and the wear and scratch resistance is far better than that of a conventional floor, the manufacturing process comprising laying, hot pressing, demolding and tempering steps. The manufacturing process has simple steps, and the obtained composite floor has high dimensional stability and good wear and scratch resistance.

Disclosed is a composite floor, comprising a wear-resistant layer, a polyvinyl chloride patterned fabric layer, a base material layer, a balance layer, and a muting layer that are sequentially arranged, the wear-resistant layer being a melamine wear-resistant paper layer. The composite floor has a clear and vivid pattern, and the wear and scratch resistance is far better than that of a conventional floor, the manufacturing process comprising laying, hot pressing, demolding and tempering steps. The manufacturing process has simple steps, and the obtained composite floor has high dimensional stability and good wear and scratch resistance.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

A technique comprising: providing an assembly temporarily adhered on opposite sides to respective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrier and/or to the assembly is partially reduced during said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers.

[Object] To provide a method for the production of a thin plate-like laminate having a film-like resin layer in which a concave/convex shape can stably be formed with high accuracy on the film-like resin layer laminated on a thin plate-like substrate.

[Achieving Means] There are provided a step of creating a mold retention structure 100 in which molds 110, which have been heated to a thermal deformation temperature of a film-like resin composition 84, are arranged on both surface sides of a workpiece 85, and a step of introducing the mold retention structure in which the heated molds are arranged between two compression rollers 52, 54 and compressing outer surfaces of the molds by rotating the compression rollers to integrally thermocompression-bond the film-like resin composition and a substrate 81 to form a thin plate-like laminate 80 having a film-like resin layer 82.

Composite articles comprising a porous prepreg or core layer and a powder coated layer thereon are described. In some instances, a thermoplastic composite article comprises a porous core layer comprising a web of reinforcing fibers held together by a thermoplastic material, and a powder coated layer disposed on the porous core layer, in which a particle size of the powder coated layer is selected to provide an interface between the powder coated layer and the porous core layer, wherein at least 50% by weight of the disposed powder coated layer is present above the interface.