Patent classifications
B32B37/12
Sheet attaching apparatus and method
A sheet attaching apparatus includes a gripping mechanism that grips one end portion, in a longitudinal direction, of a first sheet that has been drawn out from a first supply roll; a moving mechanism that allows the first sheet to be attached to a second sheet by moving the gripping mechanism to cause the first sheet to approach and contact the second sheet that passes through an attaching portion provided in a feeding path; and a releasing mechanism that releases a grip of the gripping mechanism on the first sheet, after the first sheet has contacted the second sheet.
Sheet attaching apparatus and method
A sheet attaching apparatus includes a gripping mechanism that grips one end portion, in a longitudinal direction, of a first sheet that has been drawn out from a first supply roll; a moving mechanism that allows the first sheet to be attached to a second sheet by moving the gripping mechanism to cause the first sheet to approach and contact the second sheet that passes through an attaching portion provided in a feeding path; and a releasing mechanism that releases a grip of the gripping mechanism on the first sheet, after the first sheet has contacted the second sheet.
Method for mitigating passive intermodulation
Materials and methods for mitigating passive intermodulation. A membrane for reducing passive intermodulation includes a first polymeric layer, a second polymeric layer, and a continuous metal layer encapsulated between the first and second polymeric layers. A self-adhesive radio frequency barrier tape includes a waterproof polymeric top layer, a metal-containing layer adhered by an adhesive layer to the polymeric top layer, a pressure sensitive adhesive layer adhered to the metal-containing layer, and a release liner on a bottom surface of the pressure sensitive adhesive layer. A method of mitigating passive intermodulation includes passing a probe over an area of interest, the probe being sensitive to an intermodulation frequency of interest, and identifying a suspected source of passive intermodulation when the amplitude of the probe output exceeds a threshold at the frequency of interest. The method further includes covering the suspected passive intermodulation source with a radio frequency barrier material.
Method for mitigating passive intermodulation
Materials and methods for mitigating passive intermodulation. A membrane for reducing passive intermodulation includes a first polymeric layer, a second polymeric layer, and a continuous metal layer encapsulated between the first and second polymeric layers. A self-adhesive radio frequency barrier tape includes a waterproof polymeric top layer, a metal-containing layer adhered by an adhesive layer to the polymeric top layer, a pressure sensitive adhesive layer adhered to the metal-containing layer, and a release liner on a bottom surface of the pressure sensitive adhesive layer. A method of mitigating passive intermodulation includes passing a probe over an area of interest, the probe being sensitive to an intermodulation frequency of interest, and identifying a suspected source of passive intermodulation when the amplitude of the probe output exceeds a threshold at the frequency of interest. The method further includes covering the suspected passive intermodulation source with a radio frequency barrier material.
Heat bonding of low energy surface substrates
A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.
Heat bonding of low energy surface substrates
A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.
Method of manufacturing curved thin glass sheet having functional layer and method of manufacturing curved joined glass sheet having functional layer
The present invention relates to a method capable of easily manufacturing a curved thin glass sheet and a curved joined glass sheet to which functionality is added.
Method of manufacturing curved thin glass sheet having functional layer and method of manufacturing curved joined glass sheet having functional layer
The present invention relates to a method capable of easily manufacturing a curved thin glass sheet and a curved joined glass sheet to which functionality is added.
Non-cohesive designs for heat transfer sheets and methods for forming non-cohesive designs
The present invention provide a multi-layered heat transfer sheet comprising a plurality of distinct pieces forming one or more consecutive patterns that form shapes or objects having discontinuous peripheries, as well as a method for producing and/or making said item. The method for forming the heat transfer decorations includes ablating one or more layers of a heat transfer sheet using a defocused laser to define at least one plurality of discrete pieces that together define a heat transfer decoration. A single pass of the defocused laser may ablate the one or more layers of the heat transfer sheet so as to define the discrete pieces.
Transient infrastructure for ubiquitous network communications applications
The disclosure generally relates to networking infrastructure and, more particularly, to installing transient infrastructure for ubiquitous networking applications. A wireless gateway device is sent to physical premises with a parcel. After the wireless gateway device is delivered to the physical premises, a processor of the wireless gateway device draws power from the energy source to perform operations comprising executing program code stored in non-transitory processor-readable medium to establish a wireless communications connection with a network service through a first type of wireless communications interface. The wireless gateway device performs operations comprising establishing wireless communications with one or more wireless peripheral devices in the physical premises through the second type of wireless communications interface.