A structure that forms a visual representation may include a first outer layer, a second outer layer, and an interlayer being disposed between the first outer layer and the second outer layer. The interlayer may have a first side adjacent to the first outer layer and a second side adjacent to the second outer layer. The interlayer includes a plurality of cuts extending from the first side of the interlayer towards the second side of the interlayer. Each of the plurality of cuts may have an angle with respect to a plane formed by a surface of the first side of the interlayer. Each angle for at least a portion of the plurality of cuts is based on one or more pixel values of at least one image that forms the basis of the visual representation.

A pad removal method includes affixing a first end of a pad guide to a first edge location of a pad. The pad removal method further includes affixing a second end of the pad guide to a second edge location of the pad. The pad removal method further includes moving the first end from a first position, a first distance from the second edge location, to a second position, a second distance from the second edge location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the diameter of the pad.

A pad removal method includes affixing a first end of a pad guide to a first edge location of a pad. The pad removal method further includes affixing a second end of the pad guide to a second edge location of the pad. The pad removal method further includes moving the first end from a first position, a first distance from the second edge location, to a second position, a second distance from the second edge location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the diameter of the pad.

A flexible sound barrier and rigid mounting assembly, and a method of attaching to a vehicle. The sound barrier assembly includes a rigid substrate, and flexible noise barrier and decoupling layers. The decoupling and noise barrier layers are bonded, and an adhesive bonds the decoupling layer to the substrate. The decoupling and noise barrier layers are fixedly held in place by the substrate. The substrate can include slots that fit over mounting studs on the vehicle wall. The noise barrier and decoupling layers can include mounting holes that extend through both layers, where the mounting holes line up with the slots, and fit over the mounting studs. The assembly can be mounted on the mounting studs and stud fasteners can fit through a mounting hole without compressing the noise barrier and decoupling layers and sandwich the rigid substrate surrounding a slot between the stud fastener and the vehicle wall.

A flexible sound barrier and rigid mounting assembly, and a method of attaching to a vehicle. The sound barrier assembly includes a rigid substrate, and flexible noise barrier and decoupling layers. The decoupling and noise barrier layers are bonded, and an adhesive bonds the decoupling layer to the substrate. The decoupling and noise barrier layers are fixedly held in place by the substrate. The substrate can include slots that fit over mounting studs on the vehicle wall. The noise barrier and decoupling layers can include mounting holes that extend through both layers, where the mounting holes line up with the slots, and fit over the mounting studs. The assembly can be mounted on the mounting studs and stud fasteners can fit through a mounting hole without compressing the noise barrier and decoupling layers and sandwich the rigid substrate surrounding a slot between the stud fastener and the vehicle wall.

A multilayer adhesive tape in which an interface separation between layers does not occur even at in extremely low temperature atmosphere is provided. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which attaching force among the first outer adhesive layer, the intermediate adhesive layer, and the second outer adhesive layer is maintained after the multilayer adhesive tape is treated in liquefied nitrogen for 15 seconds.

Described herein is a process for preparing a flexible packaging material. The process may comprise: providing a printed first flexible substrate comprising an ink composition on a surface of a first flexible substrate, the ink composition comprising a first thermoplastic resin; depositing a further composition comprising a cross-linker, a white pigment and a second thermoplastic resin onto the printed ink composition such that the thermoplastic resin of the ink composition is cross-linked; and laminating the first flexible substrate with a second flexible substrate such that the ink composition, the further composition and the cross-linker are disposed between the first and second flexible substrates.

Described herein is a process for preparing a flexible packaging material. The process may comprise: providing a printed first flexible substrate comprising an ink composition on a surface of a first flexible substrate, the ink composition comprising a first thermoplastic resin; depositing a further composition comprising a cross-linker, a white pigment and a second thermoplastic resin onto the printed ink composition such that the thermoplastic resin of the ink composition is cross-linked; and laminating the first flexible substrate with a second flexible substrate such that the ink composition, the further composition and the cross-linker are disposed between the first and second flexible substrates.

A battery module and a method of assembling a battery module are provided. The method includes selectively applying a light-cure adhesive to recesses in a first side of a carrier layer and inserting battery cells into respective recesses. The method further includes exposing the first side of the carrier layer to light to at least partially cure the light-cure adhesive with the carrier layer in a first orientation, moving the carrier layer into a second orientation, and exposing a second opposite side of the carrier layer to light to fully cure the light-cure adhesive. The recesses may include a sidewall having crush points spaced apart along the sidewall and a bottom portion having an opening between a pair of crush points, where adhesive is not disposed between the pair of crush points.

A multi-layer and method of making the same are provided. The multi-layer, such as a sensor, can include a high strength glass overlay and a lamination layer on a substrate layer. The overlay can be less than 250 micrometers thick and have at least one tempered surface incorporating a surface compression layer of at least 5 micrometers deep and a surface compressive stress of at least 200 MPa. The overlay can exhibit a puncture factor of at least 3000 N/μm.sup.2 at B10 (10.sup.th percentile of the probability distribution of failure) in a multi-layer structure, an apparent thickness of less than 0.014 mm, and a pencil hardness greater than 6H. The method can include ion-exchange tempering at least one major surface of a glass sheet, light etching the major surface to remove flaws and laminating the glass sheet on the tempered and lightly etched major surface to a substrate layer.