An accessory unit includes a front flap and a rear cover. The rear cover includes a recessed portion that defines a chamber and a lip that extends about an opening of the chamber. The chamber is configured to receive a consumer electronic device, and the lip is configured to hold the consumer electronic device therein. The rear cover can include a shell formed from glass fiber reinforced plastics and a lip formed from a thermoplastic. The front flap may include segments formed from panels with folding regions therebetween, which allow the front flap to fold. Further, an end region of the front flap hingedly couples the front flap to the rear cover, such that the front flap may be moved between open and closed configurations. Methods of manufacturing the accessory unit are also disclosed.

An accessory unit includes a front flap and a rear cover. The rear cover includes a recessed portion that defines a chamber and a lip that extends about an opening of the chamber. The chamber is configured to receive a consumer electronic device, and the lip is configured to hold the consumer electronic device therein. The rear cover can include a shell formed from glass fiber reinforced plastics and a lip formed from a thermoplastic. The front flap may include segments formed from panels with folding regions therebetween, which allow the front flap to fold. Further, an end region of the front flap hingedly couples the front flap to the rear cover, such that the front flap may be moved between open and closed configurations. Methods of manufacturing the accessory unit are also disclosed.

A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.

A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.

An ultrasonically bonded laminate comprising a monolayer film and a nonwoven substrate at least partially ultrasonically bonded to the monolayer film, wherein the monolayer film comprises a blend of (a) from 50 to 90 wt. % of a linear polyethylene, (b) from 10 to 50 wt. % of polypropylene, and (c) optionally, a low density polyethylene.

An ultrasonically bonded laminate comprising a monolayer film and a nonwoven substrate at least partially ultrasonically bonded to the monolayer film, wherein the monolayer film comprises a blend of (a) from 50 to 90 wt. % of a linear polyethylene, (b) from 10 to 50 wt. % of polypropylene, and (c) optionally, a low density polyethylene.

An accessory unit includes a front flap and a rear cover. The rear cover includes a recessed portion that defines a chamber and a lip that extends about an opening of the chamber. The chamber is configured to receive a consumer electronic device, and the lip is configured to hold the consumer electronic device therein. The rear cover can include a shell formed from glass fiber reinforced plastics and a lip formed from a thermoplastic. The front flap may include segments formed from panels with folding regions therebetween, which allow the front flap to fold. Further, an end region of the front flap hingedly couples the front flap to the rear cover, such that the front flap may be moved between open and closed configurations. Methods of manufacturing the accessory unit are also disclosed.

An accessory unit includes a front flap and a rear cover. The rear cover includes a recessed portion that defines a chamber and a lip that extends about an opening of the chamber. The chamber is configured to receive a consumer electronic device, and the lip is configured to hold the consumer electronic device therein. The rear cover can include a shell formed from glass fiber reinforced plastics and a lip formed from a thermoplastic. The front flap may include segments formed from panels with folding regions therebetween, which allow the front flap to fold. Further, an end region of the front flap hingedly couples the front flap to the rear cover, such that the front flap may be moved between open and closed configurations. Methods of manufacturing the accessory unit are also disclosed.

Flexible films including an electrically conductive layer being sandwiched by two electrically insulating layers in a layered structure are provided. The layered structure extends continuously from at least one first zone to at least one second zone along a lateral direction of the flexible film, and the at least one first zone is positioned around a periphery of the respective at least one second zone. In the at least one first zone the three layers are at least partially intermixed with each other to provide an electrically conductive surface in the at least one first zone on the side of the first major surface of the layered structure, and in the at least one second zone the first major surface remains electrically non-conductive.

Flexible films including an electrically conductive layer being sandwiched by two electrically insulating layers in a layered structure are provided. The layered structure extends continuously from at least one first zone to at least one second zone along a lateral direction of the flexible film, and the at least one first zone is positioned around a periphery of the respective at least one second zone. In the at least one first zone the three layers are at least partially intermixed with each other to provide an electrically conductive surface in the at least one first zone on the side of the first major surface of the layered structure, and in the at least one second zone the first major surface remains electrically non-conductive.