The present disclosure pertains to a window panel for a body structure of a vehicle, especially an airframe of an aircraft or spacecraft, including a first skin which extends over a first side of the panel to form an outer skin of the vehicle body structure; a second skin which extends over a second side of the panel to form an inner skin of the vehicle body structure; and a core, especially a foam core, located between and covered by the first and second skins in a sandwich structure. The window panel includes at least one window aperture formed through the first layer, the core, and the second layer. The core may be confined to or extends over a limited extent, region or part of the panel. Thus, the first skin and/or the second skin may extend over or cover a greater area of the panel than the core.

A display device and a method of manufacturing the display device are provided. The method includes disposing a display panel, including side areas, a front display area, and a sub-region, on a carrier film including first, second, and third release portions; removing the first release portion to expose the side areas; disposing a cover window above the display panel; attaching the front display area to the cover window by pressing the second release portion toward the cover window, and attaching the side areas to the cover window by pressing the side areas exposed by removing the first release portion toward the cover window; removing the second release portion and the third release portion to expose the front display area and the sub-region; and bending the display panel to attach a bottom portion of the sub-region to a bottom portion of the front display area.

A display device and a method of manufacturing the display device are provided. The method includes disposing a display panel, including side areas, a front display area, and a sub-region, on a carrier film including first, second, and third release portions; removing the first release portion to expose the side areas; disposing a cover window above the display panel; attaching the front display area to the cover window by pressing the second release portion toward the cover window, and attaching the side areas to the cover window by pressing the side areas exposed by removing the first release portion toward the cover window; removing the second release portion and the third release portion to expose the front display area and the sub-region; and bending the display panel to attach a bottom portion of the sub-region to a bottom portion of the front display area.

Provided is a method of treating a wafer in the state where the wafer is fixed on a support plate with an adhesive composition. Although the wafer is treated by a chemical, heating, or exothermic treatment, the method achieves sufficient adhesiveness during the step of treating a surface of the wafer and allows detachment of the support plate from the wafer without damaging the wafer or leaving the adhesive on the wafer after the wafer treating step. The method of treating a wafer of the present invention includes the steps of: fixing a wafer on a support plate via an adhesive composition containing a curable adhesive component to be crosslinked and cured by light irradiation or heating; crosslinking and curing the curable adhesive component by light irradiation or heating of the adhesive composition; treating a surface of the wafer fixed on the support plate by a chemical, heating, or exothermic treatment; and detaching the support plate from the treated wafer.

Provided is a method of treating a wafer in the state where the wafer is fixed on a support plate with an adhesive composition. Although the wafer is treated by a chemical, heating, or exothermic treatment, the method achieves sufficient adhesiveness during the step of treating a surface of the wafer and allows detachment of the support plate from the wafer without damaging the wafer or leaving the adhesive on the wafer after the wafer treating step. The method of treating a wafer of the present invention includes the steps of: fixing a wafer on a support plate via an adhesive composition containing a curable adhesive component to be crosslinked and cured by light irradiation or heating; crosslinking and curing the curable adhesive component by light irradiation or heating of the adhesive composition; treating a surface of the wafer fixed on the support plate by a chemical, heating, or exothermic treatment; and detaching the support plate from the treated wafer.

The present disclosure provides flow cells and methods of fabricating flow cells. The method includes combining three portions: a first substrate, a second substrate, and microfluidic channels between the first substrate and the second substrate having walls of a photoresist dry film. Through-holes for inlet and outlet are formed in the first substrate or the second substrate. Patterned capture sites are stamped on the first substrate and the second substrate by a nanoimprint lithography process. In other embodiments, parts of the patterned capture sites are selectively attached to a surface chemistry pattern formed of silicon oxide islands each disposed on an outcrop of a soft bottom layer.

The present disclosure provides flow cells and methods of fabricating flow cells. The method includes combining three portions: a first substrate, a second substrate, and microfluidic channels between the first substrate and the second substrate having walls of a photoresist dry film. Through-holes for inlet and outlet are formed in the first substrate or the second substrate. Patterned capture sites are stamped on the first substrate and the second substrate by a nanoimprint lithography process. In other embodiments, parts of the patterned capture sites are selectively attached to a surface chemistry pattern formed of silicon oxide islands each disposed on an outcrop of a soft bottom layer.

A laminate is made by first making by melt-blowing or spunbonding of multicomponent, thermoplastic, and endless filaments a first nonwoven layer lying generally in a plane and having a predetermined shrinkage capacity or potential parallel to the plane and making of thermoplastic and endless filaments a second nonwoven layer also lying generally in a respective plane and having a shrinkage capacity or potential that is smaller than that of the first nonwoven layer. The two layers are directly juxtaposed flatly on each other, and the directly juxtaposed first and second layer are bonded together only at bonded regions while leaving an array of unbonded regions distributed over a surface of the two bonded-together nonwoven layers. Then only the first nonwoven layer is shrunk so that the second layer bunches in the unbonded regions and is there raised transverse to a plane of the bonded-together layers.

A laminate is made by first making by melt-blowing or spunbonding of multicomponent, thermoplastic, and endless filaments a first nonwoven layer lying generally in a plane and having a predetermined shrinkage capacity or potential parallel to the plane and making of thermoplastic and endless filaments a second nonwoven layer also lying generally in a respective plane and having a shrinkage capacity or potential that is smaller than that of the first nonwoven layer. The two layers are directly juxtaposed flatly on each other, and the directly juxtaposed first and second layer are bonded together only at bonded regions while leaving an array of unbonded regions distributed over a surface of the two bonded-together nonwoven layers. Then only the first nonwoven layer is shrunk so that the second layer bunches in the unbonded regions and is there raised transverse to a plane of the bonded-together layers.

An apparatus for joining substrate portions includes substrate portions being positioned such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate portions at the overlap area. The heated fluid penetrates at least one of the outer surfaces of the substrate portions. The substrate portions are at least partially melted using the heated fluid. The substrate portions are compressed using a pressure applying surface adjacent the fluid orifice to join the substrate portions together at the overlap area.