The present disclosure relates to the technical field of protective case, in particular to a protective case for electronic device and a method for manufacturing the same. The protective case for electronic device includes an inner shell, an outer shell, and a magnetic interlayer that fits and in contact with the inner shell and the outer shell, wherein: the magnetic interlayer includes an interlayer base material and a magnetic part, the magnetic interlayer is provided with a through installation hole, and the magnetic part is fixedly embedded in the installation hole, the thickness of the magnetic part matches with the depth of the installation hole, the interlayer base material includes a hot-melt base material and reinforcing fiber yarn contained in the hot-melt base material, and the hot-melt base material is filled between the magnetic part and the inner side wall of the installation hole.

A support plate, a method of manufacturing the same, and a foldable display device including the same. The support plate is provided on a bottom portion of a back plate bendable about a folding axis. The support plate includes a support layer. The support layer includes one or more prepregs each comprising a resin and carbon fibers. The support plate is provided in a semi-cured state, and is attached to the bottom portion of the back plate without an adhesive. The support plate is enabled to be folded without an open area pattern.

Systems for processing material, taping stations to apply tape to one or more rolls of material, and methods of processing material are disclosed. A system for processing material includes a winding station and a taping station. The winding station includes a winder to wrap material around a mandrel to produce one or more rolls of material. The taping station is arranged downstream of the winding station to receive the one or more rolls of material therefrom and apply tape to the one or more rolls of material.

A ribbon laminated body (1) used for creating a honeycomb core is constituted by a plurality of layers of ribbons (2) laminated, a low-temperature curing adhesion portion, and a high-temperature curing adhesion portion. Between each two adjacent ribbons (2), there exist a low-temperature curing adhesion portion that adhesively bonds the both ribbons (2), which is in contact with the both ribbons (2), and a high-temperature curing adhesion portion that is in contact with the both ribbons (2). At a portion where the low-temperature curing adhesion portion is in contact with a ribbon (2), the shape of the low-temperature curing adhesion portion is a trapezoidal shape, wherein an upper base is overlapped with a part of one long side of the ribbon (2), and a lower base is overlapped with a part of the other long side of the ribbon (2). At a portion where the high-temperature curing adhesion portion is in contact with the ribbon (2), a part of a periphery of the high-temperature curing adhesion portion is in contact with one oblique side of two oblique sides included in one of low-temperature curing adhesion portions.

A support for installing facing materials such as ceramic tiles on a substrate such as floors, walls and ceilings wherein the support plate has a plurality of spaced apart recesses in the plate material, with the recesses being open at the top surface and have solid sidewalls and a base, and a plurality of slots in the non-recessed portions of the plate material extending through the top surface and bottom surface, the slots joining one or more adjacent recesses. The support plate of the invention is used for tile installations between the substrate and such tile. Thin-set mortar that is used to secure the tile to the support plate flows into the recesses and into the slots forming a continuous bond between the mortar and the adjacent slots providing for a strong bond between the support plate, mortar and the tiles.

A gypsum wallboard having a core with a central core layer and one or more densified layers is disclosed. At least one densified layer contains salt absorbent particles of zeolite and/or hydrotalcite to improve adhesion of the gypsum core to a cover sheet. Also, methods of making the gypsum wallboard and a wall system for employing the gypsum wallboard are disclosed.

A frangible laminate includes first, second and third webs, and the second web is positioned between the first and third webs. The forming of the frangible laminate includes adhesively bonding a first plurality of sections of the second web to the first web, applying release material in order to inhibit at least some of any bonding between the first plurality of sections of the second web and the third web, and adhesively bonding a second plurality of sections of the second web to the third web. The frangible laminate is separated into a first laminate and a second laminate, so that the first laminate includes the first web and the first plurality of sections of the second web, and the second laminate includes the third web and the second plurality of sections of the second web.

According to one embodiment, an insulation blanket for insulating a structure includes a first facer layer and a second facer layer. A plurality of intermeshed non-woven glass fibers are disposed between the first and second facer layers and a fumed silica insulating powder is also disposed between the first and second facer layers. The fumed silica insulating powder has an average particle size of between about 2 and 20 nanometers. The insulation blanket includes at least one exposed edge having a cauterized face that forms a barrier on the exposed edge to encase the fumed silica insulating powder within the interior of the insulation blanket, which minimizes degradation of the insulating value due to loss or shedding of the fumed silica insulating powder through the exposed edge. The cauterized edge has a depth of cauterized material of between about 0.05 mm and 3 mm.

Provided are an electroacoustic conversion film web, an electroacoustic conversion film, and a method of manufacturing an electroacoustic conversion film web in which costs can be reduced by reducing the number of operations without damage to thin film electrodes, the points of electrode lead-out portions can be freely determined, and thus high productivity can be achieved. A preparation step of preparing an electrode laminated body in which a single thin film electrode and a single protective layer are laminated and a lamination step of laminating the electrode laminated body and an piezoelectric layer are included. A non-adhered portion that is not adhered to the piezoelectric layer is provided in at least one end portion of the thin film electrode in a case where the electrode laminated body and the piezoelectric layer are laminated in the lamination step.

The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.