A system for applying a material to a substrate comprising: a feed section that comprises a feed roll and configured for advancing a material along a predetermined path; a material applicator roll configured to receive the material from the feed roll and apply a cut length of material to a substrate; a knife element located between the feed section and the material applicator roll; and a non-vacuum anvil roll positioned near the knife element, wherein the knife element and the non-vacuum anvil roll are positioned along the path of the material and engage the material to cut the material into the cut length of material for applying to the substrate, and wherein the material contacts the peripheral surface of the non-vacuum anvil roll only at a cut engagement point.

A laser cuts overlapping ribbons of acoustic material into acoustic devices. An automatically controlled manipulator includes an end effector having groups of placement tools for simultaneously placing multiple acoustic devices in a cellular core. The placement tools include mandrels provided with vacuum pickups for picking up and holding the acoustic devices during transport to the core. A vision system aligns the placement tools with the cells of the core. The end effector includes a thermal radiation device for bonding the acoustic devices to the core.

A laser cuts overlapping ribbons of acoustic material into acoustic devices. An automatically controlled manipulator includes an end effector having groups of placement tools for simultaneously placing multiple acoustic devices in a cellular core. The placement tools include mandrels provided with vacuum pickups for picking up and holding the acoustic devices during transport to the core. A vision system aligns the placement tools with the cells of the core. The end effector includes a thermal radiation device for bonding the acoustic devices to the core.

A method of manufacturing an extended content label involves receiving label stock comprising a liner layer and a face stock layer, and de-laminating the liner layer from the face stock layer. The face stock layer and the liner layer each have a top surface and a bottom surface. The bottom surface of the face stock layer has an adhesive layer that adheres the face stock layer to the liner layer. A first face stock image is printed onto the top surface of the liner layer. The printed face stock image is transferred to the bottom surface of the face stock layer, and a second face stock image is printed onto the top surface of the face stock layer. The transferring the printed face stock image involves re-laminating the face stock layer with the liner layer.

A biocompatible structure includes one or more base structures for regeneration of different tissues. Each base structure includes alternately stacked polymer layers and spacer layers. The polymer layer includes a polymer and tissue forming nanoparticles. The polymer includes polyurethane. The tissue forming nanoparticles includes hydroxypatites (HAP) nanoparticles, polymeric nanoparticles, or nanofibers. The spacer layer includes bone particles, polymeric nanoparticles, or nanofibers. The weight percentage of tissue forming nanoparticles to the polymer in the polymer layer in one base structure is different from that in the other base structures. A method of producing the biocompatible structure includes forming multiple base structures stacked together, coating the stacked multiple base structures, and plasma treating the coated structure.

Weighted transaction cards and methods of manufacturing the same. The weighted transaction cards may include a tungsten member that comprises at least a portion of a layer of the transaction card. The tungsten member may be encapsulated and/or disposed in an opening of a surround to define and inlay. The inlay may be laminated with one or more additional layers according to traditional card manufacturing techniques (e.g., a hot lamination process). The weighted transaction cards may have a weight significantly greater than traditional plastic transaction cards such that the weighted transaction cards.

A simulated brick includes a polymeric core member and a laminate adhered to the core member. The core member and the laminate together define a brick profile portion having first and second lateral sides extending to a planar outer surface to define a first thickness, an offset portion extending from the first lateral side of the brick profile portion to a lateral end surface and having an outer surface defining a second thickness smaller than the first thickness, and a rectangular base surface extending from the second lateral side of the brick profile portion to the lateral end surface of the offset portion. The laminate covers the core member to define the first and second lateral sides and the outer surface of the brick profile portion, and the lateral end surface and the outer surface of the offset portion, and the core member is uncovered by the laminate on the base surface such that the core member defines the base surface.

Composite tape is laminated onto a substrate using a gantry to move a tape laminating head along the length of the substrate. The laminating head is mounted for movement along a beam on the gantry that extends across the width of the substrate. The direction of lamination may be altered by changing the angular orientation of the beam.

An automatic applicator of a sticky back material to a printing sleeve is disclosed. The applicator includes a controller that is programmable with data relating to the size and desired positioning of the sticky back material to the sleeve. The sticky back material is secured to a transport system and cut to the desired size by a cutter, creating a sheet. The sheet is then transported between a pressure roller and the sleeve. The pressure roller applies pressure to the sticky back sheet, applying the sheet to the sleeve. A mandrel grips and rotates the sleeve to apply the sticky back sheet around an exterior surface of the sleeve.

A method of forming an integrated circuit structure is provided. In an embodiment, the method includes bonding top dies onto a bottom wafer and then molding a first molding material onto and in between the top dies and the bottom wafer. The bottom wafer, the top dies, and the first molding material are sawed to form molding units. Each of the molding units includes one of the top dies and a bottom die sawed from the bottom wafer. The molding units are bonded onto a package substrate and a second molding material is molding onto the one of the molding units and the package substrate. Thereafter, the package substrate and the second molding material are sawed to form package-molded units.