Multi-layer forms and methods of producing the same are disclosed. An example apparatus includes means for moving a first substrate in a direction; means for applying adhesive to a first portion of a first side of the first substrate; means for mating a second substrate with the first portion; means for applying adhesive to a third portion of a second side of the first substrate; means for folding the first substrate about a first fold line to couple the third portion to a fourth portion of the second side; means for applying adhesive to a first sub-portion of a second portion of the first side; and means for folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of a second sub-portion of the second portion and to position the first substrate between the second substrate.

There is disclosed a mobile terminal including a display panel, a frame comprising a front surface where the display panel is disposed, a rear case coupled to one surface of the frame, to form an electric/electronic control unit there between the frame and the rear case, a heat spreader module provided between the display panel and the frame, wherein the heat spreader module includes a metallic plate in contact with the display panel, a heat spreading material layer disposed on a rear surface of the metallic plate and an adhesive layer disposed between the heat spreading material layer and the metallic plate to bond the metallic plate and the heat spreading material layer with each other. Even when the frame is partially eliminated, the mobile terminal may support the display panel and securing the heat spreading performance simultaneously, using the heat spreader module having a preset rigidity.

One embodiment of a substrate laminator comprises a housing that includes a cartridge receiver, a substrate transport, a cartridge and a cartridge position adjustment mechanism. The substrate transport mechanism is configured to feed substrates along the processing path in a lengthwise direction. The cartridge is received in the cartridge receiver and includes a ribbon supply. The cartridge position adjustment mechanism is configured to adjust the position of the cartridge in a widthwise direction relative to the substrate processing path.

A method for manufacturing a TEM-lamella is disclosed. The method includes: disposing a self-supporting protective structure on a surface of a substrate; bonding the protective structure to the substrate; cutting out a lamella from the substrate using a particle beam so that the lamella remains bonded to at least a portion of the protective structure; fastening a first tool to the lamella; and moving away the lamella from a residual portion of the substrate by moving the first tool relative to the substrate.

A flexible packaging laminate is formed to have a built-in opening and reclose feature by forming the laminate as a two-part structure having an outer structure joined in face-to-face relation with an inner structure. Score lines are formed in both structures to enable an opening to be formed through the laminate by lifting an opening portion (e.g., a flap or the like) of the two structures out of the plane of the laminate. The score line through the outer structure defines a larger opening than the score line through the inner structure, such that a marginal region of the outer structure extends beyond the edge of the opening portion of the inner structure. A pressure-sensitive adhesive is used to re-adhere the marginal region to an underlying surface of the inner structure adjacent the opening through the laminate.

A method of manufacturing a timber composite (7) is disclosed. The method comprises the steps of applying adhesive to one or more timber layers (23-226), applying pressure to the one or more timber layers, and heating the timber layers. The adhesive penetrates into the one or more timber layers and cures to form the timber composite (7). One or more spacers (332) may be positioned between the timber layers. The invention also related to timber composite (7) obtainable by such method and to decorative panels (1) comprising such timber composite (7) as a top layer.

The technology relates to depositing free-standing electrical devices on a substrate and electrically connecting two or more of the free-standing electrical devices with the aid of a bendable scoring lines. These bendable scoring lines allow the thin-film substrate to be bended, or folded, to form a specific shape. Electrical devices include electrochromic devices or solid state batteries.

In a method for manufacturing a radiation window there is produced a layered structure where an etch stop layer exists between a carrier and a solid layer. A blank containing at least a part of each of the carrier, the etch stop layer, and the solid layer is attached to a radiation window frame. At least a part of what of the carrier was contained in the blank is removed, thus leaving a foil attached to the radiation window frame, wherein the foil contains at least a part of each of the etch stop layer and the solid layer.

Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.

A method is provided for producing a separator by cutting a laminated porous film. The laminated porous film includes a porous base material layer containing polyolefin as a main component and a filler layer containing inorganic particles as a main component. The filler layer is provided on one surface of the porous base material layer; and a resin layer containing resin particles as a main component is provided on the other surface of the porous base material layer. The method includes a step of cutting, using a slit blade, the laminated porous film from the one surface on which the filler layer is provided.