A system and method of producing, large, very thin veneer patterns that can be used to decorate furniture such as table tops, flooring and interior decor or any other flat surface that show a plurality of wood end grain patterns. The process includes cutting a plurality of various diameter pieces of wood such as branches to expose the end grain. The pieces are then arranged in a holder with each piece sticking upward so that looking down, the end grain on each piece can be seen. The holder is then filled with a clear or pigmented resin and allowed to set. The hard resin slab is then removed and sawed in to very thin slices. Each thin slice is a desired veneer that can then be further glued onto a table top or the like. Symmetry patterns can be created by arranging veneers from subsequent layers side-by-side in various configurations.

To provide a method for producing a fuel cell membrane electrode assembly that can prevent the required catalyst layer from being removed, while suppressing damage to the electrolyte membrane. A method for producing a fuel cell membrane electrode assembly MEA includes: a step of bonding a polymer electrolyte membrane PEM and a first catalyst layer-including substrate GDE1; a step of making a cut CL so that the first catalyst layer-including substrate GDE bonded with the polymer electrolyte membrane PEM becomes a predetermined shape; a step of peeling an unwanted portion GDE12 of the first catalyst layer-including substrate GDE1 from the polymer electrolyte membrane PEM; a step of irradiating a laser beam LB2 penetrating the polymer electrolyte membrane PEM without penetrating the first catalyst layer-including substrate GDE1 onto the polymer electrolyte membrane PEM, and removing residue RD of the first catalyst layer-including substrate GDE1 adhering on the polymer electrolyte membrane PEM.

A label assembly including one or more dissolvable thermal direct adhesive labels and methods of assembly and use. According to one embodiment, each label includes a base layer, a thermal direct layer, an adhesive layer, and a barrier layer. The base layer, which has an upper surface and a lower surface, is water-dissolvable and may be made of a water-dissolvable paper. The thermal direct layer is positioned directly over the upper surface of the base layer and functions in the conventional manner to produce markings therein in response to heat. The adhesive layer is water-dissolvable and is positioned below the lower surface of the base layer. The barrier layer, which is positioned directly below the lower surface of the base layer and directly over the adhesive layer, serves to prevent migration of the adhesive layer through the base layer and into contact with the thermal direct layer.

A laminating machine and process for applying an optically clear adhesive film to a glass substrate includes a porous belt assembly with a plurality of vacuum pumps. The vacuum pumps define different, separately adjustable vacuum zones on the surface of the porous belt. The porous belt is driven linearly so that an optically clear adhesive does not move relative to the porous belt, but does move relative to the table, allowing the adhesive to be controlled to a compressive, neutral, or tensile state while being nip-rolled to the substrate. Since there is no motion of the film relative to the belt, scratching, stretch elongation, dimensional errors, and other slip induced damage is eliminated.

A biocompatible structure includes one or more base structures for regeneration of different tissues. Each base structure includes alternately stacked polymer layers and spacer layers. The polymer layer includes a polymer and tissue forming nanoparticles. The polymer includes polyurethane. The tissue forming nanoparticles includes hydroxypatites (HAP) nanoparticles, polymeric nanoparticles, or nanofibers. The spacer layer includes bone particles, polymeric nanoparticles, or nanofibers. The weight percentage of tissue forming nanoparticles to the polymer in the polymer layer in one base structure is different from that in the other base structures. A method of producing the biocompatible structure includes forming multiple base structures stacked together, coating the stacked multiple base structures, and plasma treating the coated structure.

The present disclosure relates to methods and apparatuses for controlling the relative placement of advancing substrates and discrete components in diaper converting lines. The diapers may each include a chassis connected with front and back elastic belts. In controlling the relative placement of these elements during the assembly process, a controller may change the machine direction speed and/or position of certain elements and cross direction speed and/or position of other elements such as the advancing substrates and components in order to help achieve proper placement and orientation. During the assembly process, the registration features are detected, and a controller may change the machine direction speeds of the advancing elastic laminates and/or chassis and/or may change the cross directional and/or machine direction position of the advancing elastic laminates and/or chassis.

Disclosed is a sheets processing system for producing a flat laminated printed item. The system includes a sheet feeding station to feed printed sheets (12) to a laminating station, the laminating station to adhere a laminating material to the printed sheets (12), and a base item application station to apply a base item to the printed sheets (12) being laminated. The system additionally includes a platform to accommodate the sheet feeding station, the laminating station, the base item application station, and a transport roller station, all aligned in a substantially straight line. The system further includes a transport roller station to transport along the platform at least a section of the printed sheets (12) being laminated which is a part of the flat laminated printed item.

Embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the protective films have an absorbance of 50% or more. Other embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B′) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the film to be processed has an absorbance of 50% or more and the protective films have an absorbance of 50% or more.

A patch lamination device includes a laminate feed roller, a laminating roller, and a laminate spreader. The laminate feed roller is configured to feed a patch laminate ribbon along a laminate path. The laminating roller is configured to laminate individual patch laminates of the ribbon to a surface of a card substrate. The laminate spreader is positioned between the laminate feed roller and the laminating roller. The laminate spreader is configured to reduce the formation of trough wrinkles in a patch laminate that is tensioned between the laminate feed roller and the laminating roller during lamination of the patch laminate to a card substrate using the laminating roller.

The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.