Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

A method of welding at least two plastic components together is disclosed. The two plastic components are welded together at respective joining surfaces. The method comprises directing at least one infrared (IR) laser beam along the joining surfaces of the at least two plastic components. The IR laser beam heats the joining surfaces of the at least two plastic components to a welding temperature. The method also includes clamping the at least two plastic components together at the joining surfaces to create a weld.

The present invention discloses means and methods for manufacturing a multilayer of liquid crystal dispersion film using releasable supporting films and means and methods for manufacturing a haze-free and low-cost multi liquid crystal-layer PDLC, LCDP, PSLC or polymer network using reliable supporting films.

A composite workpiece having at least one metallic cover layer and a non-metallic core layer is disclosed. The metallic cover layer and the non-metallic core layer are connected to one another, with one lying on top of the other. The metallic cover layer, in a marking region on a side facing toward the non-metallic core layer, includes a profile, in particular a surface profile, for marking the composite workpiece.

Systems and methods for monitoring the quality of a surface treatment applied to an article in a manufacturing process are provided. A surface treatment may be applied to at least a portion of an article. A thermal profile of the article may be obtained and used to determine temperature indications of different regions of the article to which the surface treatment has been applied. A standard model of the article may be obtained that includes model regions having model temperature ranges. The temperature indications of the article can be compared with the model temperature ranges to determine if any temperature indications are outside of a corresponding model temperature range. The article may be a shoe part. The surface treatments may include the application of heat, plasma, dye, paint, primer, and/or the application of other materials, substances, and/or processes.

A glass composite includes a first glass member and a second glass member. The first glass member and the second glass member are at least partially connected with each other at the surfaces. The glass composite has a light transmittance not lower than 95% of the light transmittance of the one, with the lower light transmittance, of the first glass member and the second glass member.

To provide a method for producing a composite wafer capable of reducing a spurious arising by reflection of an incident signal on a joint interface between a lithium tantalate film and a supporting substrate, in the composite wafer including a supporting substrate having a low coefficient of thermal expansion, and a lithium tantalate film having a high coefficient of thermal expansion stacked on the supporting substrate. The method for producing a composite wafer is a method for producing a composite wafer that produces a composite wafer by bonding a lithium tantalate wafer having a high coefficient of thermal expansion to a supporting wafer having a low coefficient of thermal expansion, wherein prior to bonding together, ions are implanted from a bonding surface of the lithium tantalate wafer and/or the supporting wafer, to disturb crystallinity near the respective bonding surfaces.

Systems and methods for monitoring the quality of a surface treatment applied to an article in a manufacturing process are provided. A surface treatment may be applied to at least a portion of an article. A thermal profile of the article may be obtained and used to determine temperature indications of different regions of the article to which the surface treatment has been applied. A standard model of the article may be obtained that includes model regions having model temperature ranges. The temperature indications of the article can be compared with the model temperature ranges to determine if any temperature indications are outside of a corresponding model temperature range. The article may be a shoe part. The surface treatments may include the application of heat, plasma, dye, paint, primer, and/or the application of other materials, substances, and/or processes.

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Connection pads for coupling fluid-instillation and negative pressure wound therapy (NPWT) apparatuses to wound dressing, and methods and wound dressings for breaching a drape after coupling a wound dressing to a fluid-instillation and/or NPWT apparatus.