Patent classifications
B32B38/0008
Method for manufacturing a vehicle interior trim part as well as a vehicle interior trim part
The present subject matter relates to a method for manufacturing a vehicle interior trim part comprising a decor layer which forms a groove, as well as a decor element which is welded in the groove) of the decor layer, wherein the decor element is brought into the groove and is subsequently fixed in the groove by way of welding. According to the present subject matter, a welding head, e.g. an ultrasound sonotrode, is used for welding, and this comprises a contact side which is equipped with a plurality of projections which are arranged distanced to one another in a row and which taper to their contact surfaces, and wherein the welding head for producing the seam is pressed against a rear side of the decor layer in the region of the groove, in a manner such that the individual projections of the row of projections in a longitudinal directions of the groove come into contact with the rear side of the decor layer in a manner offset to one another, wherein the projections have a width which corresponds at least to 50% of a width of the decor element.
WORKPIECE BONDING METHOD
Provided is a workpiece bonding method that makes it possible to achieve a joining state with a high strength and to obtain a good repeatability of the joining state.
A workpiece bonding method according to the present invention is a workpiece bonding method for bonding two workpieces to each other, each of the two workpieces being composed of a material selected from the group consisting of synthetic resin, glass, silicon wafer, crystal and sapphire, the workpiece bonding method including: a surface activation step of activating a bonded surface of at least one of the workpieces; and a laminating step of laminating the two workpieces such that respective bonded surfaces contact with each other, and a pretreatment step of removing moisture from the bonded surface of the workpiece that is to be subjected to the surface activation step is performed before the surface activation step is performed.
METHODS OF FORMING STRUCTURES FOR DOWNHOLE APPLICATIONS
A method of forming a structure for a downhole application comprises forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate. A downhole structure and a downhole assembly are also described.
Article comprising a protective top layer based on mixed oxide of zirconium and aluminum
An article includes a substrate that is transparent, the substrate being covered on at least one of its faces, totally or partly, with a protective layer based on zirconium and aluminum mixed oxide.
Micro-perforated glass laminates and methods of making the same
Some embodiments of present disclosure are directed to a micro-perforated glass or glass-ceramics laminate, comprising a first substrate laminated to a second substrate by a first polymer interlayer, wherein the first and the second substrates are independently selected from glass or glass-ceramics, and a plurality of micro-perforations, each of the plurality of micro-perforations extending through the first substrate, the first polymer interlayer, and the second substrate. Some embodiments are directed to methods of forming such micro-perforated glass or glass-ceramics laminates.
Triply curable optically clear adhesive
The present invention provides an adhesive composition, which can be cured through three ways: UV-radiation curing, thermal-radiation curing and moisture-curing. The adhesive composition comprises a) an oligomer having an isocyanate group and a (meth)acryloxy group; b) a (meth)acrylic monomer and/or oligomer not having an isocyanate group; c) a photoinitiator; and d) a peroxide.
Laser welding of transparent and opaque materials
Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.
METHOD FOR INCREASING THE ADHESION BETWEEN THE FIRST SURFACE OF A FIRST WEB-TYPE MATERIAL AND A FIRST SURFACE OF A SECOND WEB-TYPE MATERIAL
A method for increasing the adhesion between the first surface of a first web-type material and a first surface of a second web-type material, the first web-type material and the second web-type material being supplied to a lamination nip continuously and with the same direction of the web. In said nip, the first surface of the first web-type material and of the second web-type material are laminated together and both first surfaces are treated with a plasma over the whole surface. The lamination nip is formed by a pressure roller and a counter-pressure roller and at least one of the surfaces of the rollers or both are equipped with a dielectric. The first web-type material comprises an adhesive compound layer arranged in the first web-type material such as to form the first surface of the first web-type material.
METHOD FOR INCREASING THE ADHESION BETWEEN THE FIRST SURFACE OF A FIRST WEB-TYPE MATERIAL AND A FIRST SURFACE OF A SECOND WEB-TYPE MATERIAL
A method for increasing the adhesion between the first surface of a first web-type material and a first surface of a second web-type material, the first web-type material and the second web-type material being supplied to a lamination nip continuously and with the same direction of the web. In said nip, the first surface of the first web-type material and of the second web-type material are laminated together and both first surfaces are treated with a plasma over the whole surface. The lamination nip is formed by a pressure roller and a counter-pressure roller and at least one of the surfaces of the rollers or both are equipped with a dielectric. The plasma or the corona is produced by a nozzle. The first web-type material comprises an adhesive compound layer arranged in the first web-type material such as to form the first surface of the first web-type material.
Method for producing transparent adhesive sheet for optical applications, transparent adhesive sheet for optical applications, and display device using same
A transparent adhesive sheet for optics, which is capable of satisfying both adhesion and rework property, in view of the above problems of prior art. A production method of a silicone-based transparent adhesive sheet for optics for assembling the optical components, includes a step of forming a surface activation treated surface, in which peel strength after laminating onto an adherend increases with time, as compared with peel strength before lamination. The surface activation treatment is performed by using UV-ray irradiation on at least a part or the entire surface of an adhesive face contacting with the adherend of said transparent adhesive sheet for optics.