A waterproof cleaning fabric for daily use includes a fabric layer, a middle layer and a waterproof layer. At least one fabric layer and at least one middle layer are provided, and the middle layer is disposed between the fabric layer and the waterproof layer; the middle layer is made of 100% reactive polyurethane hot melt adhesive which is in a solid state at room temperature, and the thermal resistance is greater than 140° C. According to the waterproof cleaning fabric for daily use and a composite production process therefor, a source generated by “waste gas” is fundamentally eradicated to achieve an entire composite production process that is waste gas-free, hot gas-free and noise-free. A high degree of environmental friendliness of said process is guaranteed, while the reduction of composite production costs is promoted, and the quality of the product is overall improved.

A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.

A method for assembling two substrates by molecular adhesion comprises: a first step (a) of putting first and second substrates in close contact in order to form an assembly having an assembly interface; a second step (b) of reinforcing the degree of adhesion of the assembly beyond a threshold adhesion value at which water is no longer able to diffuse along the assembly interface. The method also comprises a step (c) of anhydrous treatment of the first and second substrates in a treatment atmosphere having a dew point below −10° C., and control of the dew point of a working atmosphere to which the first and second substrates are exposed from the anhydrous treatment step (c) until the end of the second step (b) so as to limit or prevent the appearance of bonding defects at the assembly interface.

An electronic apparatus, includes: a housing; a panel; a first bonding agent disposed along an edge of the housing and configured to join the housing and the panel to each other; and a joining member disposed at part of the edge of the housing and having a joining strength lower than a joining strength of the first bonding agent.

The present invention aims to provide a conductive layered body having excellent solvent resistance and scratch resistance as well as a low haze value and a significantly high light transmittance. The present invention relates to a conductive layered body including, as an outermost layer thereof, a conductive layer containing a conductive fibrous filler, wherein the conductive layered body has a Martens hardness of 150 to 3,000 N/mm.sup.2 as measured at an indentation depth of 100 nm from a surface, and a ratio, in atomic percentage, of a conductive material element constituting the conductive fibrous filler on an outermost surface-side surface of the conductive layer is 0.15 to 5.00 at %.

A process for joining fiber composite materials using self-piercing rivets. The process includes contacting first and second panels. The second panel is a fiber composite material. The process further includes elevating a temperature of only a fastening portion of the second panel. The process also includes placing the first and second panels on a die and joining the first and second panels with one or more rivets while the fastening portion is at an elevated temperature.

An encapsulation method and an encapsulation device are provided. The encapsulation method comprises: forming a binding agent in an encapsulation region of a display substrate; forming an organic thin film on the binding agent; exerting a pressure on the organic thin film and the binding agent by using a pressure exerting device, wherein the organic thin film is not bound to the pressure exerting device; removing the organic thin film; and providing a cover plate on the binding agent and binding the cover plate with the display substrate by the binding agent.

Embodiments generally relate to apparatus and methods for dismantling a hermetically sealed chamber. In one embodiment, an apparatus facilitating the opening of a hermetically sealed chamber in a device comprises a fixture configured to hold the device, and a system configured to create sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. In one embodiment, a method for opening a hermetic seal between first and second elements forming a chamber in a microfluidic chip comprises using a release technique creating sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. The release technique comprises introducing a tool to the vicinity of the interface without any contact between the tool and any material within the chamber. The breaking of the seal results in the complete separation of the first and second elements.

A method of manufacturing a double-sided polarizing plate and a double-sided polarizing plate manufactured using the same are provided. The method of manufacturing a double-sided polarizing plate includes attaching transparent films to both surfaces of a polarizer by means of adhesive layers, irradiating the adhesive layers with active energy rays emitted by an energy source disposed in a single direction with respect to the polarizer, and thermally treating a surface of the transparent film disposed opposite to the energy source at a temperature of 25° C. to 65° C.

An electrochemical sensor comprising a probe immersible in a measured medium and having at least two electrodes of a first electrically conductive material and at least one probe body of a second, electrically non-conductive material. The electrodes are at least partially embedded in the probe body and insulated from one another by the probe body, wherein the at least two electrodes are embodied of at least one conductive material and the probe body of at least one electrically insulating ceramic, wherein the electrodes are embodied of thin, measuring active layers of a conductive material and sit in an end face of the probe body of a ceramic material, and wherein the electrodes are electrically contacted via connection elements extending through the probe body.