A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.

The Application relates to optically transparent electrostatic transducers. In some embodiments, the transducers comprise graphene. Such transducers are capable of functioning as acoustic sensors and/or transmitters as a singulated device or in an array configuration. Also provided are methods of manufacturing and using such transducers.

The invention relates to a method for producing at least one solid layer and comprises at least the steps of: providing a carrier substrate (4) having a sacrificial layer (8) arranged thereon or arranging a sacrificial layer (8) on the provided carrier substrate (4), producing a useful layer (6) by way of chemical or physical gas phase deposition on the sacrificial layer (8) to form a multi-layer arrangement (2), removing the useful layer (6) as a result of a material weakening produced between the useful layer (6) and the carrier substrate (4), said material weakening being brought about by modifications (12) to the sacrificial layer (8) which were produced means of laser beams (10).

Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

A method of producing a CF board and an array board includes: a separation film forming process for forming resin substrates on the separation films; a thin film component forming process for forming TFTs and color filters that axe thin film components on the resin removals of fee resin substrates; a determining process for determining whether levels of adhesion between the separation films and the resin substrates are high or low based on image data obtained through capturing of images of the separation films, and a removing process for removing the resin substrates from the supporting substrates if the levels of adhesion are determined low in the determining process.

A method of producing a CF board and an array board includes: a separation film forming process for forming resin substrates on the separation films; a thin film component forming process for forming TFTs and color filters that axe thin film components on the resin removals of fee resin substrates; a determining process for determining whether levels of adhesion between the separation films and the resin substrates are high or low based on image data obtained through capturing of images of the separation films, and a removing process for removing the resin substrates from the supporting substrates if the levels of adhesion are determined low in the determining process.

Disclosed is a panel reversing apparatus which reverses a panel, the panel reversing apparatus including: a panel support unit which supports the panel; and a rotating unit which rotates the panel support unit so as to reverse a direction, in which one surface of the panel supported by the panel support unit faces, and a direction, in which the other surface of the panel faces, in which the panel support unit includes a single surface contact unit which is in contact with only one surface between the one surface and the other surface of the panel.