Patent classifications
B32B38/18
DEVICE FOR DEPOSITING VENEERS
The invention relates to a device for depositing veneers on a carrier board. In order to create a device and a method by which veneers can be applied to a carrier board particularly easily, quickly and precisely, provided in the region of an upper end of a transporting device is a veneer magazine, with at least two compartments which are designed to store and supply veneer strips, and with means for transferring the veneer strips from the compartments to the transporting device, wherein the transporting device extends from an upper end obliquely downwards in the direction of a lower end in the region of a transporting plane for the carrier board and is designed to transport at least two individual adjacent veneer strips from the upper end to the lower end and to deposit them on the carrier board.
PLANT AND METHOD FOR LAMINATING CORRUGATED CARDBOARD
A plant for laminating cardboard, and in particular corrugated cardboard, by an adhesive plastics film, is provided. The plant has a supply station configured to supply a succession of single rough cardboard sheets in a feeding direction, an application station arranged in the sheet feeding direction and having an application roller configured to unwrap and apply the adhesive plastics film to a rough cardboard sheet so that the adhesive plastics film adheres to each rough cardboard sheet of the succession of rough cardboard sheets to form a succession of coated cardboard sheets and to advance each coated cardboard sheet of the succession of coated cardboard sheets in the feeding direction. A method for laminating cardboard, and in particular corrugated cardboard, using an adhesive plastics film is also provided.
COMPRESSION TOOL AND METHOD OF FORMING GAS TURBINE ENGINE COMPONENTS
An assembly for forming a gas turbine engine according to an example of the present disclosure includes, among other things, a layup tool including a main body extending along a longitudinal axis and a flange extending radially from the main body, the flange defining an edge face slopes towards the main body to an axial face. At least one compression tool has a tool body having a first tool section and a second tool section extending transversely from the first tool section. The first tool section is translatable along a retention member in a first direction substantially perpendicular to the edge face such that relative movement causes the second tool section to apply a first compressive force on a composite article trapped between the axial face of the flange and the second tool section. A method of forming a gas turbine engine component is also disclosed.
LAP SHEAR BONDING FIXTURE
A fixture for lap shear bonding a bottom panel to a top panel comprises a bottom tool, a first spacer, a second spacer, and a top tool. The bottom tool has a quadrilateral shape including a top surface, a bottom surface, and four side surfaces and is configured to retain the bottom panel on the top surface. The first spacer is attached to the top surface of the bottom tool adjacent to one edge. The second spacer is attached to the top surface of the bottom tool adjacent to an opposing edge. The top tool has a quadrilateral shape including a top surface, a bottom surface, and four side surfaces and is configured to retain the top panel on the bottom surface. The top tool is further configured to attach to the first spacer and the second spacer such that the top panel contacts the bottom panel.
LAMINATION DEVICE
A lamination device includes a first jig to which is fixed a window that includes a flat surface and at least one curved surface, a pressure pad disposed on a second jig that faces the first jig, where the pressure pad includes a first surface that corresponds the flat surface of the window and a second surface that corresponds the at least one curved surface of the window, and a pressure sensor array disposed on the pressure pad. The pressure sensor array includes a plurality of first electrodes that overlap the first surface and a plurality of second electrodes that overlap the second surface.
System and method for producing a facing for a board product with strategically placed scores
A system and method for producing a board product made from paper products that have a pre-scored facing in addition to a medium (sometimes called fluting). Conventional corrugated board may feature a cross-corrugated medium and one or more facing that have no score lines that are impressed (at least prior to assembly with the corrugated medium). Such a conventional board product may be inferior because any score lines that are impressed will damage the underlying corrugated medium in some manner. A breakdown in the strength of the underlying medium leads to poor precision when the eventual board product is scored, cut, and folded. A lack of precision in folding a board product leads to gap variation and fishtailing as any articulated portion of the board product may not maintain a precise plane of articulation when folded.
Device and method for attaching protective tape to semiconductor wafer
To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus (1) for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape conveyance mechanism (2) configured to convey the protective tape (PT) temporarily applied to a base material (BM) to a peeling position; a tape holding body (30) capable of holding the protective tape (PT); a holding-body moving mechanism (31) configured to move the tape holding body (30) to the peeling position; and a peeling mechanism (4) configured to peel the base material (BM) from the protective tape (PT) held by the tape holding body (30) at the peeling position.
Device and method for attaching protective tape to semiconductor wafer
To reduce residual stress generated on a protective tape at a time of application of the protective tape to a semiconductor wafer, provided is an application apparatus (1) for applying a protective tape (PT) to a semiconductor wafer (W), including: a tape conveyance mechanism (2) configured to convey the protective tape (PT) temporarily applied to a base material (BM) to a peeling position; a tape holding body (30) capable of holding the protective tape (PT); a holding-body moving mechanism (31) configured to move the tape holding body (30) to the peeling position; and a peeling mechanism (4) configured to peel the base material (BM) from the protective tape (PT) held by the tape holding body (30) at the peeling position.
Display device, and method and apparatus for manufacturing the same
A display device includes a cover window including a curved portion, and a panel member laminated on the cover window. A method of manufacturing a display device includes mounting a cover window including a curved portion on a first jig including a curved portion, mounting a panel member on a second jig that conforms to a surface of the first jig, and laminating the cover window to the panel member by moving a first one of the first jig or the second jig to a first other one of the first jig or the second jig. An apparatus for manufacturing a display device includes a first jig including a mount surface that is partially curved to conform to a surface of a cover window, a second jig including a surface conforming to the mount surface and configured to contact a panel member, and a driving unit.
Cutting method for display panel, display panel and display device
The present application discloses a cutting method for a display panel, a display panel and a display device, the cutting method for a display panel including a cutting stage of a side edge of a binding area and a cutting stage of a side edge of a non-binding area, the cutting stage of a side edge of a non-binding area includes steps of: aligning a cutter according to an alignment mark preset on the side edge of the non-binding area on the display panel, so that a cutter on a second substrate side is closer to a display area of the display panel than a cutter on a first substrate side, and cutting the first substrate and the second substrate by the cutter on the second substrate side and the cutter on the first substrate side respectively.