B32B38/18

PATTERNED LIQUID REPELLENT NANOCELLULOSIC FILM
20230018981 · 2023-01-19 · ·

A textured film is provided which comprises nanocellulose. At least a first surface of the film comprises a patterned, textured surface formed by repeating protruding regions and at least one non-protruding region arranged between said protruding regions. A particular height difference between the protruding and non-protruding regions can give liquid repellent properties. Methods for making the textured film are also provided.

AFFIXING METHOD AND AFFIXING APPARATUS
20230014530 · 2023-01-19 ·

An affixing method includes a pressing step of pressing a tape against a wafer with a tape affixing roller and pressing the wafer against a suction table with the tape affixing roller, an evacuating step of evacuating a vacuum chamber that houses the suction table and the tape affixing roller therein to create a vacuum in the vacuum chamber, and an affixing step of affixing the tape to the wafer with the tape affixing roller by causing the tape affixing roller to roll on the tape while the tape affixing roller is pressing the wafer.

SQUARE SYMMETRIC DOUBLE-DOUBLE LAMINATE STRUCTURES AND METHODS FOR MANUFACTURING AND USING THE SAME
20230015104 · 2023-01-19 ·

Square symmetric composite laminate structures, and sub-modules thereof, are provided, along with methods of forming the same. The square symmetric laminate structures include two or more sub-laminate modules, each comprising: a first ply set consisting of a first ply layer oriented at a first angle and a second ply layer oriented at a second angle, a first sum of the first and second angles being ninety degrees; and a second ply set consisting of a third ply layer oriented at a third angle and a fourth ply layer oriented at a fourth angle, a second sum of the third and fourth angles being ninety degrees; wherein the second ply layer is positioned adjacent the third ply layer and the second and third ply layers are both positioned intermediate the first and fourth ply layers, thereby defining a double-double helix arrangement of the respective ply layers. Associated methods are also provided.

Device and method for bonding substrates

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Method for the production of curved furniture components and component thus obtainable
11697282 · 2023-07-11 · ·

The method for the production of curved furniture components comprises: an overlapping step of a first panel of wooden, plastic or metal material, of at least one intermediate separating layer and of a second panel of wooden, plastic or metal material for obtaining a flat semi-finished product having a perimeter edge; an interposition step of a polyurethane type adhesive between the intermediate layer and the first panel and second panel by hot dispensing of said adhesive on the surfaces of the first and the second panels which are adapted to be associated with the intermediate layer or by hot dispensing of the adhesive on the surfaces of the intermediate layer which are adapted to be associated with said first panel and second panel; a cold shaping step of the semi-finished product for obtaining a curved component; and a spraying step of a water-based auxiliary substance between the intermediate layer and at least one of the first panel and the second panel, subsequent to the interposition of the adhesive.

METHODS AND APPARATUSES FOR ASSEMBLING ELASTIC LAMINATES WITH A ROTATING ROLL AND REMOVABLE LAYER
20230009730 · 2023-01-12 ·

A system for ultrasonic bonding of elastic includes a rotating roll. The rotating roll has an exterior surface. A removable shell layer is attached to the external surface. The removable shell layer includes one or more patterned segments. The patterned segments include a shell channels formed through the removable shell layer to form a pattern.

Multi-part underlayment and method of manufacture

A multipart underlayment having a cap sheet and base sheet combined to form a pocket for securely holding building materials and environmentally-friendly manufacturing method for manufacturing the same.

Multi-part underlayment and method of manufacture

A multipart underlayment having a cap sheet and base sheet combined to form a pocket for securely holding building materials and environmentally-friendly manufacturing method for manufacturing the same.

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF DISPLAY DEVICE
20230009706 · 2023-01-12 ·

A apparatus for manufacturing a display device includes: a stage for supporting a display module including a display panel, a cover window, and a flexible printed circuit board; and an adsorption unit disposed at one side of the stage, the adsorption unit configured to be moved in a horizontal direction such that a distance between the stage and the adsorption unit is adjusted, wherein the adsorption unit is configured to adsorb and support the flexible printed circuit board connected to the display panel.

Micro device transfer head assembly

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.