A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Embodiments provide a coating material including (A) 100 parts by mass of an active-energy-ray-curable resin, (B) 5 to 200 parts by mass of aluminum oxide particles having an average particle diameter of 1 to 100 μm, (C) 0.1 to 20 parts by mass of aluminum oxide microparticles having an average particle diameter of 1 to 100 nm, and (D) 0.1 to 40 parts by mass of a compound having at least two isocyanate groups per molecule, where the active-energy-ray-curable resin (A) includes (a1) 70 to 99% by mass of a polyfunctional (meth)acrylate and (a2) 30 to 1% by mass of an acrylamide compound having at least one hydroxyl group per molecule, and the sum total of the amount of the polyfunctional (meth)acrylate (a1) and the amount of the acrylamide compound (a2) having at least one hydroxyl group per molecule is 100% by mass.

Embodiments provide a coating material including (A) 100 parts by mass of an active-energy-ray-curable resin, (B) 5 to 200 parts by mass of aluminum oxide particles having an average particle diameter of 1 to 100 μm, (C) 0.1 to 20 parts by mass of aluminum oxide microparticles having an average particle diameter of 1 to 100 nm, and (D) 0.1 to 40 parts by mass of a compound having at least two isocyanate groups per molecule, where the active-energy-ray-curable resin (A) includes (a1) 70 to 99% by mass of a polyfunctional (meth)acrylate and (a2) 30 to 1% by mass of an acrylamide compound having at least one hydroxyl group per molecule, and the sum total of the amount of the polyfunctional (meth)acrylate (a1) and the amount of the acrylamide compound (a2) having at least one hydroxyl group per molecule is 100% by mass.

A polymeric film assembly comprising a first solidified interlayer on a polymeric film or laminate comprising the same that is contacted with at least a portion of a surface of an underlying article to provide, for example, desired surface characteristics. At least a portion of the first solidified interlayer becomes a softened interlayer positioned between the polymeric film and the surface of the article when contacted as such. The softened interlayer is then converted to a second solidified interlayer, which second solidified interlayer may be in a different form than or same form as the first solidified interlayer initially provided, for adherence of the polymeric film to at least the portion of the surface of the article. Ease of removal and/or repair of polymeric film and laminates comprising the polymeric film that are so applied is facilitated.

A polymeric film assembly comprising a first solidified interlayer on a polymeric film or laminate comprising the same that is contacted with at least a portion of a surface of an underlying article to provide, for example, desired surface characteristics. At least a portion of the first solidified interlayer becomes a softened interlayer positioned between the polymeric film and the surface of the article when contacted as such. The softened interlayer is then converted to a second solidified interlayer, which second solidified interlayer may be in a different form than or same form as the first solidified interlayer initially provided, for adherence of the polymeric film to at least the portion of the surface of the article. Ease of removal and/or repair of polymeric film and laminates comprising the polymeric film that are so applied is facilitated.

A system for manufacturing a 3D protective film includes a raw material processing device configured to process an intermediate raw material, which is a raw material of an intermediate liquid crystal protection film included in the protective film for protecting a liquid crystal surface of the electronic device, an upper raw material, which is a raw material of a hard coating surface protection film formed on an upper portion of the intermediate liquid crystal protection film, and a lower raw material which is a raw material of an adhesive surface protection film formed on a lower portion of the intermediate liquid crystal protection film, a laminating device configured to form a raw lamination material by laminating the upper raw material, the lower raw material, and the intermediate raw material, and a shape processing device configured to form the pre-formed protective film by processing the raw lamination material.

A 3D printer successively fuses sheet material in a stack to form a three-dimensional object. The sheet material may provide a mesh separating islands of material that will be fused to produce the desired three-dimensional object. The mesh provides support for the island material during the fusing process and may be removed afterwards.

An adhesive application valve comprising an applicator, a Z-axis actuator operably connected to the applicator, wherein the Z-axis actuator and the rotation device are each capable of moving independently of each other to position the applicator in a position to apply an amount of adhesive to a top substrate prior to bonding with a bottom substrate is provided. Furthermore, a machine comprising an end effector, and an adhesive application valve configured to apply an amount of adhesive onto the top substrate, the end effector configured to place the top substrate into a position of engagement with the adhesive application valve, and place the top substrate onto the bottom substrate to facilitate initial contact between the adhesive applied to the top substrate and a fill material applied to the bottom substrate is also provided. A method of optical bonding is further provided.

An adhesive application valve comprising an applicator, a Z-axis actuator operably connected to the applicator, wherein the Z-axis actuator and the rotation device are each capable of moving independently of each other to position the applicator in a position to apply an amount of adhesive to a top substrate prior to bonding with a bottom substrate is provided. Furthermore, a machine comprising an end effector, and an adhesive application valve configured to apply an amount of adhesive onto the top substrate, the end effector configured to place the top substrate into a position of engagement with the adhesive application valve, and place the top substrate onto the bottom substrate to facilitate initial contact between the adhesive applied to the top substrate and a fill material applied to the bottom substrate is also provided. A method of optical bonding is further provided.

A manufacturing apparatus of a display device includes a first jig configured to hold a first member; a second jig located under the first jig and coupled to or separated from the first jig such that the first member is locatable between the first jig and the second jig; fixing parts located at both ends of the second jig and configured to hold a second member between the first member and the second jig, the second jig including a pad; and a stage located under the pad and provided with a groove formed therethrough and having an area smaller than an area of the pad when viewed in a plan view, wherein one portion of the pad, which faces the stage, is configured to be within the groove.