Patent classifications
B32B2041/04
Lamination device
A lamination device that laminates a plurality of types of workpieces includes a plurality of supply mechanisms that supply a workpiece to each of a plurality of supply positions, a movement mechanism including a stator of a linear motor having a predetermined traveling track and a mover of a linear motor that is movable between a plurality of the supply positions along a traveling track, and a control unit that controls at least the mover. The mover includes a lamination stage for laminating the workpiece. The control unit corrects a relative position of the workpiece supplied to the supply positions with respect to the lamination stage, laminates the workpiece whose relative position is corrected on the lamination stage, and controls the mover so as to move to a next one of the supply positions after lamination of the workpiece.
Display device and panel bonding system including the same
Provided is a display device. The display device comprises: a display module including a display panel, wherein the display panel includes a display area having a plurality of pixels and an alignment mark area surrounded by the display area, and a display driver driving at least one of the plurality of pixels in the alignment mark area to form an alignment mark; and a stereoscopic lens including a base disposed on the display module, a plurality of lenses disposed on the base at an angle offset from a side of the display module, and a marking portion formed on one or more of the plurality of lenses to overlap the alignment mark area.
Protective member forming apparatus
A protective member forming apparatus for forming a protective member on the top surface of a substrate by laminating a liquid resin and a cover sheet on a resin film includes: a liquid resin supply unit configured to supply the liquid resin onto the resin film; a pressing unit including a pressing surface, the pressing unit being configured to spread the liquid resin over the resin film by pressing the liquid resin by the pressing surface via the cover sheet; and a determining unit configured to determine the state of the spread liquid resin. The determining unit includes a determining section configured to determine whether or not the liquid resin is spread over a predetermined range with respect to the substrate.
MACHINE CONFIGURED TO FORM A COMPOSITE STRUCTURE
An illustrative example of the present disclosure provides a method. A first set of composite plies including a first outer ply of a first composite structure is laid up. A first intermediate surface of the first outer ply is measured to form a first set of measurements. A laydown surface for a tool path of a composite placement machine is modified to form a modified tool path, wherein modifying the laydown surface comprises modifying the laydown surface such that a laydown surface of the modified tool path matches the first set of measurements. A composite ply is laid down using the composite placement machine and the modified tool path.
Process and system for improving surface quality of composite structures
A process and system for improving surface quality of composite structures, including laying up a first set of composite plies including a first outer ply of a first composite structure. A first intermediate surface of the first outer ply is measured to form a first set of measurements. A laydown surface for a tool path of a composite placement machine is modified to form a modified tool path, wherein modifying the laydown surface comprises modifying the laydown surface such that a laydown surface of the modified tool path matches the first set of measurements. A composite ply is laid down using the composite placement machine and the modified tool path.
Bonding apparatus, bonding system, bonding method and storage medium
There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
PRINTED CIRCUIT BOARD AUTOMATED LAYUP SYSTEM
An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.
Process for producing a surface covering with an embossed printed surface
A process for producing a surface covering with an embossed printed surface is described. A substrate (16) is continuously moved through a production line, and this substrate (16) is first provided, in a printing equipment (12), with a printed pattern and thereafter, in an embossing equipment (14), with an embossed pattern, which is registered with the printed pattern. The printing equipment (12) produces the printed pattern in-line with the production of the embossed pattern. During printing in the printing equipment (12), the printed pattern is stretched or compressed, dynamically responsive to indicators of misalignments between the printed pattern and the embossed pattern, so as to correct or prevent the misalignments. A production line for carrying out this process is also proposed.
Method and apparatus for controlling contact of composite tows
An infrared camera is directed aft of a compaction roller of a composite laying head. Heat is applied to a substrate by a heater mounted forward of the compaction roller. Infrared images are captured of composite tows laid down on a substrate by the compaction roller. Whether the composite tows have sufficient contact is determined using the infrared images.
PROTECTIVE MEMBER FORMING APPARATUS
A protective member forming apparatus for forming a protective member on the top surface of a substrate by laminating a liquid resin and a cover sheet on a resin film includes: a liquid resin supply unit configured to supply the liquid resin onto the resin film; a pressing unit including a pressing surface, the pressing unit being configured to spread the liquid resin over the resin film by pressing the liquid resin by the pressing surface via the cover sheet; and a determining unit configured to determine the state of the spread liquid resin. The determining unit includes a determining section configured to determine whether or not the liquid resin is spread over a predetermined range with respect to the substrate.