An automated bonding sequence system and method for customizing a bonding sequence is provided. The method includes the steps of detecting that a first substrate is in close proximity with the a second substrate, during an optical bonding operation, wherein at least the first substrate includes an amount of adhesive for optically bonding to the second substrate, stopping an automated process of optically bonding of the optical bonding operation, in response to the detecting, recording operator feedback control signals, the operator feedback control signals being received from a controller being operated by an operator to contact the first substrate and the second substrate, analyzing the operator feedback control signals to determine a bonding sequence for automatically optically bonding the first substrate and the second substrate, and resuming, by the processor, the automated process of the optical bonding operation.

A system and methods for indexing an automated fiber placement head to a surface of a substrate are provided. The system comprises a first measurement system comprising a first plurality of sensors configured to scan the surface of the substrate; a second measurement system comprising a second plurality of sensors configured to locate the automated fiber placement head; and a data management device configured to generate a full resolution transformation using measurements from the first measurement system and determine a position of the automated fiber placement head using data from the second measurement system.

An automated bonding sequence system and method for customizing a bonding sequence is provided. The method includes the steps of detecting that a first substrate is in close proximity with the a second substrate, during an optical bonding operation, wherein at least the first substrate includes an amount of adhesive for optically bonding to the second substrate, stopping an automated process of optically bonding of the optical bonding operation, in response to the detecting, recording operator feedback control signals, the operator feedback control signals being received from a controller being operated by an operator to contact the first substrate and the second substrate, analyzing the operator feedback control signals to determine a bonding sequence for automatically optically bonding the first substrate and the second substrate, and resuming, by the processor, the automated process of the optical bonding operation.

A system and methods for indexing an automated fiber placement head to a surface of a substrate are provided. The system comprises a first measurement system comprising a first plurality of sensors configured to scan the surface of the substrate; a second measurement system comprising a second plurality of sensors configured to locate the automated fiber placement head; and a data management device configured to generate a full resolution transformation using measurements from the first measurement system and determine a position of the automated fiber placement head using data from the second measurement system.