A bendable fiberboard panel having a plurality of spaced apart parallel grooves extending partially through the thickness of the panel is prepared using a rotatory tool having a generally circular disc shape with a smooth peripheral edge having a double-double beveled profile. The resulting bendable panel is characterized by having a substantially uniform continuously curved transverse cross-sectional profile and superior strength as compared with traditional cut-scored or crease-scored panels.

Method for cutting an ink sticker situated in a multilayer structure having an ink layer between a protective layer and an ink carrier layer. by positioning the multilayer structure to be cut in front of a femtosecond laser device with the protective layer facing said femtosecond laser device and kiss cutting the ink layer through the protective layer with a laser beam emitted by the femtosecond laser device in order to produce an ink sticker between the protective layer and the uncut ink carrier layer, with the possibility to cut, partially cut or leave intact the protective layer.

A method for fabricating a flexible electronic device, including the steps of: providing channels on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channels; and reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate. The rigid substrate comprises a first surface, a second surface opposite the first surface, and a side wall extending between the first surface and the second surface. The channels are provided on the first surface of the rigid substrate. The channels are in communication with an injection port, the injection port is located on the side wall of the rigid substrate, and a portion of the side wall is located between the injection port and the first surface.

The present invention is an apparatus and method for cutting individual label strips from a roll of label web utilizing a cutter assembly. A label cutter comprises a cutter assembly for continuously and independently controlling the rotational speeds of a rotating cutter shaft, a stationary shaft, and a label feed roller is provided. The length of the label strip is controlled by the distinct speed of rotation of a stationary knife, the stationary knife is rotatably coupled to the stationary shaft. At least one cutter blade is operatively associated to the rotating cutter shaft for cutting the label web. The stationary knife rotates with a to speed of rotation different from the speed of rotation of the cutter blade to produce longer or shorter label length strips. The frequency at which the cutter blade meets the stationary knife is inversely related to the length of the label strip that is produced during cut off.

A holding fixture includes a first blade support assembly and a second blade support assembly. The second blade support assembly is spaced at a distance from the first blade support assembly and includes a base plate removably mounted to a milling machine, an adjustable conic support connectable to the base plate via a spacer block, and a blade adjustment assembly movable to control a pressure applied by the blade adjustment assembly.

A method of manufacturing a display unit including: preparing an optical film; forming a first alignment mark on the optical film; forming a cut-out line, corresponding to a predetermined closed curve layout, on the optical film based on a position of the first alignment mark; preparing a panel having a second alignment mark; aligning the optical film and the panel based on the positions of the first alignment mark and the second alignment mark; and laminating the optical film, after the processing of forming the cut-out line, on the panel.

Disclosed are a composite gypsum board and a method of preparing gypsum board. The board contains at least one set gypsum layer sandwiched between face and back cover sheets. The set gypsum layer is formed from at least stucco and water. The stucco material generally includes a high salt impurity content, for example, when the stucco is calcined from certain sources of low-quality synthetic gypsum. For example, in some embodiments, the salts are chloride salts, e.g., sodium chloride (NaCl), potassium chloride (KCl), magnesium chloride (MgCl.sub.2), and/or calcium chloride (CaCl.sub.2). The board and methods improve the bond between the gypsum layer(s) and at least one of the cover sheets (e.g., the back cover sheet). Also provided are methods and systems relating to drying gypsum board.

A manufacturing method and a manufacturing device of a flexible panel are provided. the flexible panel includes a bending area, and the manufacturing method includes: providing a panel unit including a flexible substrate and a back film which are laminated, the panel unit including a panel area corresponding to the flexible panel and a non-panel area outside the panel area; and removing the non-panel area of the panel unit while peeling off a peelable portion of the back film in the bending area of the flexible panel.

A blade includes an edge to be pressed against an end portion of a carrier film to fold the end portion upwards from a sheet. A clamp mechanism peels the carrier film off from the sheet by moving while clamping the upwardly folded end portion of the carrier film.

In debonding a temporarily adhesive-bonded carrier-workpiece pair by a combination of chemical and mechanical methods, solvents or chemicals are used to remove the adhesives primarily through dissolution, and a thin wire, filament, or blade is used to exert a cutting or wedging action between the carrier and workpiece. The two methods are used together during the debonding process. In the carrier-workpiece pair, the workpiece can be a semiconductor wafer that has been thinned and processed. The carrier and the workpiece are temporarily bonded using an adhesive dissolvable in a selected chemical or solvent. The chemical and mechanical debonding (CMDB) method can be carried out in solvent immersion or in solvent spray to provide high throughput debonding. The dissolved adhesives can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.