A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

A method of removing a backing layer from a panel, made of an uncured pre-impregnated fiber-reinforced polymer, comprises a step of orienting the panel into a backing-separation orientation relative to an edge-engagement tool. The method also comprises a step of positioning the panel into a backing-separation position relative to the edge-engagement tool. The method further comprises a step of moving the edge-engagement tool, when the panel is in the backing-separation orientation and the backing-separation position, so that backing-engagement features of the edge-engagement tool engage the backing layer, at only an edge portion of the backing layer, and just the edge portion of the backing layer separates from the panel. The method additionally comprises a step of gripping the edge portion of the backing layer, and, when gripped, moving the backing layer relative to the panel so that an entirety of the backing layer separates from the panel.

A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film. Methods of using such a system are also disclosed.

Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.

The invention concerns a linerless self-adhesive material obtained starting from a self-adhesive material with a liner, by means of a process that comprises the delamination of the liner from a self-adhesive layer, activation of the liner or self-adhesive layer, transferral of the liner over the self-adhesive layer and re-lamination of the two components so as to produce the linerless self-adhesive material. The liner or the self-adhesive layer is coated with a thermo-adhesive that allows for permanent lamination of the liner located on the self-adhesive layer.

A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film. Methods of using such a system are also disclosed.

A sheet separation device separates a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at a bonding portion of the two-ply sheet. The sheet separation device includes a winding roller and a gripper. The winding roller rotates and winds the two-ply sheet to separate the two-ply sheet. The gripper is disposed in the winding roller and configured to grip a gripped portion of the two-ply sheet at one end of the two-ply sheet without abutting a tip of the gripped portion at the one end of the two-ply sheet on a member.

A solar panel disassembling apparatus for disassembling a solar panel including a glass plate and a stacked film, includes a supporting plate of which is in contact with the glass plate, a moving scraper module including a first body moving in parallel with the supporting plate, a first elevator moving vertically, and a blade connected to the first elevator and changing in height and scraping the stacked film using the blade, and a moving pressing module including a second body moving in parallel with the supporting plate, a second elevator vertically, and a pressing unit connected to the second elevator and changing in height. The moving pressing module is disposed forward in the forward movement direction of the moving scraper module and presses and aligns the stacked film using the pressing unit ahead of the moving scraper module.

A solar module exterior disassembling apparatus for disassembling an exterior of a solar module including a module body, a frame and a junction box attached to the module body includes a positioning plate supporting one surface of the module body from below the solar module and being able to move up and down, a top contact plate over the positioning plate and in contact with the other surface of the module body when the positioning plate is moved up, frame separation blades around the top contact plate and moving in parallel with a surface of the module body between a first position inside the frame and a second position outside the frame, and a pressing actuator including pressing cylinders and pressing outward from the module body and disassembling the module body by moving forward the frame separation blades from the first position to the second position with the pressing cylinders.

Methods of tracing a lengthwise half of a board sports board and applying a substrate film cutout onto the board having the steps of centering a centerline of a tracing scale onto a center of the board, the tracing scale having an off-centerline on both sides of the centerline; aligning a centerline mark of the film with the off-centerline of the tracing scale; flipping the board over such that the board is on top of the film; tracing a trace outline of half of the board onto the film, such that the half of the trace outline is incrementally larger or smaller than the half of the board; removing a release liner from the trace outline to expose an adhesive in the film; wetting the adhesive with a solution of water and liquid soap; flattening the wetted film onto the board with a spreader; and wiping with a wiping cloth.