A cover tape for packing an electronic component includes: a substrate layer; a heat sealing layer placed on one surface side of the substrate layer; and an intermediate layer placed between the substrate layer and the heat sealing layer, and a transmitted image definition based on JIS K 7374, with an optical comb width set to 0.5 mm, is 30% or more.

A detection chip, a method for manufacturing a detection chip, a method for operating a detection chip, and a reaction system are disclosed. The detection chip includes a first substrate, a micro-cavity definition layer, and a heating electrode. The micro-cavity definition layer defines a plurality of micro-reaction chambers. The heating electrode is configured to release heat after being energized. The heating electrode includes a first electrode portion and at least one second electrode portion. Orthographic projections of the plurality of micro-reaction chambers on the first substrate are within an orthographic projection of the first electrode portion on the first substrate, the orthographic projections of the plurality of micro-reaction chambers on the first substrate do not overlap with an orthographic projection of the second electrode portion on the first substrate, and a resistance value of the first electrode portion is greater than a resistance value of the second electrode portion.

An article including a composite including a subsurface structure and a second phase of material forming a coating on the subsurface structure. The coating includes a first region defining a first plurality of microtextures in an outer surface of the coating, where the first plurality of microtextures include an average bore width of less than about 250 micrometers (μm) and a first average bore depth, and a second region positioned adjacent to the first region wherein the coating defines a second plurality of microtextures on the outer surface of the coating, where the second plurality of microtextures include an average bore width of less than about 250 μm and a second average bore depth less than the first average bore depth.

A transparent heat-insulating film is provided, wherein the transparent heat-insulating film includes a base layer including a first surface and a second surface, a hard-coat layer, a silver nanowire layer, and a protective layer including an inner surface and an outer surface. The hard-coat layer and the silver nanowire layer are disposed between the first surface of the base layer and the inner surface of the protective layer. A temperature of the second surface of the base layer is T1 (° C.), a temperature of the outer surface of the protective layer is T2 (° C.), and a temperature difference between T1 and T2 (T1−T2) is ΔT. When T1=50-100° C. and the base layer and the protective layer reach thermal equilibrium, ΔT=0.15T1−0.35T1.

An automotive laminated glazing is provided, comprising an outer glass layer and an inner glass layer, said outer glass layer having a first surface and a second surface and said inner glass layer having a third surface and a fourth surface, wherein the inner glass layer has a thickness of not more than 1.0 mm and is chemically strengthened, and wherein the fourth surface features a low-e coating, obtainable by chemically strengthening a flat glass pane having a thickness of not more than 1.0 mm, then applying the low-e coating, and finally laminating the flat glass pane to a curved glass pane forming the outer layer, thereby cold bending said flat glass pane.

Provided are a flexible window film and a display apparatus comprising same, the flexible window film having a substrate layer, a buffer layer and a hard coating layer that are sequentially layered, wherein the buffer layer comprises, in a thickness direction, a first area in which the amount of an amide group gradually increases from the interface between the hard coating layer and the buffer layer, and a second area in which the amount of an amide group gradually decreases from the interface between the substrate layer and the buffer layer.

An encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same are provided, where the encapsulation film allows forming a structure capable of blocking moisture or oxygen penetrating into an organic electronic device from outside and prevents generation of bright spots in the organic electronic device.

A barrier material comprising (a) at least one layer of cellulosic substrate comprising MFC, and (b) a first barrier layer arranged on at least one surface of said cellulosic substrate, is provided, as well as a method for reducing the water vapour transmission rate (WVTR) of a cellulosic substrate.

Disclosed is a packaging for a flexible secondary battery comprising a first polymer resin layer, a barrier layer formed on the first polymer resin layer to block water and gas, and a second polymer resin layer formed on the barrier layer. The thickness of the barrier layer is 30 to 999 nm. The barrier layer is multi-layered, and comprises graphene, a dispersing agent, and pyrene as a flexible linking agent, in which there is π-π conjugation (interaction) between the graphene and the pyrene. Also disclosed is a flexible secondary battery comprising the packaging.

A freezing packaging film having transparency that produces a color difference (ΔE) of 30 or less on a surface of contents when subjected to frozen storage at −20° C. for 2 weeks, the contents being a reagent containing 0.14 mass % of methylene blue and having L* of 55 to 65, a* of 3 to 9 and b* of 45 to 55 in a L*a*b* color system.