Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a Kurtosis (Rku) of the first surface ranges from 3.0 to 60.0. With the Rku, the LCP film is able to improve the peel strength with a metal foil and ensure that a laminate comprising the same maintains the merit of low insertion loss.

A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR1, SR2, SR3, and SR4 respectively, a relationship SR1<SR3≤SR4<SR2 is satisfied.

A composite includes a liquid crystal polyester that is soluble in a solvent; and liquid crystal polymer particles that are insoluble in a solvent, have a melting point of 270° C. or more, and have a cumulative distribution 50% diameter D.sub.50 of 20 μm or less and a cumulative distribution 90% diameter D.sub.90 of 2.5 times or less the D.sub.50 in a particle size distribution.

An object of the present invention is to provide a polymer film to which a metal-containing layer is stuck to produce a laminate having an excellent peel strength. Another object of the present invention is to provide a laminate and a substrate for high-speed communication. The polymer film of an embodiment of the present invention is a polymer film including a liquid crystal polymer, in which a difference between a melting start temperature and a melting end temperature in differential scanning calorimetry in a depth region up to 10 μm of the polymer film from one surface toward the other surface of the polymer film is 5.0° C. to 50° C.

A method for manufacturing a metal clad laminated plate includes hot pressing a laminated body by a double belt press method. The laminated body includes an insulating film containing the liquid crystal polymer and the metal foil lying on the insulating film. In hot pressing the laminated body, a highest heating temperature is higher than or equal to a temperature lower than a melting point of the insulating film by 5° C. and lower than or equal to a temperature higher than the melting point by 20° C. The highest heating temperature is maintained for longer than or equal to 20 seconds and shorter than or equal to 120 seconds.

A circuit board includes, in order in a stacking direction, a first insulating layer, a second insulating layer in contact with the first insulating layer, and a conductor layer, the first insulating layer includes a liquid crystal polymer as a main component, and the second insulating layer includes a fluoropolymer including at least one of polytetrafluoroethylene and a perfluoroalkoxy alkane and includes a polyimide resin with an imidization rate of about 90% or more, the polyimide resin being present in an amount of about 0.5 parts or more by weight and less than about 20 parts by weight per 100 parts by weight of the fluoropolymer.

A resin composition for a semiconductor package according to an embodiment includes a resin composition comprising a resin and a filler provided in the resin, wherein the resin includes a soluble liquid crystal polymer resin, and wherein the filler has a negative coefficient of thermal expansion (negative CTE) and is provided in the soluble liquid crystal polymer resin.

The present invention relates to a laminate film including a resin layer having a thickness of from 10 μm to 125 μm; and a toner layer formed on one surface of the resin layer, in which the resin layer is formed from a resin material having a glass transition temperature of 130° C. or higher, the toner layer has a plurality of voids, and when a value defined by the following formula (S1) using the void area ratio, which represents the ratio of the area of exposed voids, for the respective faces of the surface of the toner layer and a cross section of the toner layer, is designated as porosity, and when two void area ratios respectively corresponding to the cross sections of the toner layer in two orthogonally intersecting directions are used as the void area ratios of the cross sections of the toner layer, the porosities respectively calculated according to the two void area ratios are both from 0.01% to 0.40%.

[00001]$\begin{array}{cc}\mathrm{Porosity}.Math..Math.\left(\%\right)=\frac{\mathrm{Void}.Math..Math.\mathrm{area}.Math..Math.\mathrm{ratio}.Math..Math.\mathrm{of}.Math..Math.\mathrm{cross}.Math..Math.\mathrm{section}.Math..Math.\left(\%\right)}{100}\times \frac{\mathrm{Void}.Math..Math.\mathrm{area}.Math..Math..Math.\mathrm{ratio}.Math..Math.\mathrm{of}.Math..Math.\mathrm{surface}.Math..Math.\left(\%\right)}{100}\times 100& \end{array}$

Techniques and mechanisms for providing a tunable RF resonator device. In an embodiment, a patterned layer of an adhesive material is disposed on a side of a panel comprising a substrate and a metal layer. A membrane is aligned between the panel and another panel. A laminate is formed with the first panel, the second panel and the membrane, where an intermediate layer of the laminate includes a first portion comprising a liquid crystal channel, and a second portion comprising adhesive material disposed in interstices of the membrane. In another embodiment, the second portion forms at least part of a boundary to the liquid crystal channel.

A display apparatus includes a window member, a display module, and a photocured adhesive layer. The window member includes a base member and a bezel layer overlapping a partial region of a rear surface of the base member, the bezel layer including a photosensitive material having a reduced transmittance with an increased amount of irradiated light. The display module is disposed on the lower side of the window module. The photocured adhesive layer is configured to bind the window member to the display module, and overlaps with the bezel layer on a plane.