B32B2307/20

Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend

The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.

Polyvinyl acetal resin film and film roll thereof, and laminate comprising same
11623985 · 2023-04-11 · ·

The present invention relates to a polyvinyl acetal resin film, comprising a polyvinyl acetal resin material, wherein the polyvinyl acetal resin film has a thickness of 5 to 350 μm, and satisfies the following Formulae (1) and (2) where, comparing one surface and the other surface, a mean value of the 10-point average roughness of a rougher surface A and a mean value of the 10-point average roughness of a smoother surface B are defined as Rz1(a) μm and Rz2(a) μm, respectively:
Rz1(a)>1.1×Rz2(a)  (1)
3>Rz2(a)  (2), a value obtained by dividing the standard deviation of the 10-point average roughness of the surface A by Rz1(a) and a value obtained by dividing the standard deviation of the 10-point average roughness of the surface B by Rz2(a) are each 0 to 0.30, a viscosity of a toluene/ethanol (1:1, mass ratio) solution containing 10%-by-mass of a polyvinyl acetal resin contained in the polyvinyl acetal resin material, which is measured at 20° C. and 30 rpm using a Brookfield-type (B-type) viscometer, is 100 to 1,000 mPa.Math.s, and the amount of a plasticizer in the polyvinyl acetal resin film is 0 to 20% by mass based on a total mass of the polyvinyl acetal resin film.

Resin molded product, resin laminate, cartridge, image-forming apparatus, method for manufacturing resin molded product, method for manufacturing resin laminate, and method for manufacturing cartridge
11619892 · 2023-04-04 · ·

A resin molded product whose main component consists of an ethylene-vinyl acetate copolymer resin and carbon black. The ethylene-vinyl acetate copolymer resin has an MFR of 0.5 g/10 min or more and 20 g/10 min or less. The carbon black has an average primary particle diameter of 55 nm or more and 100 nm or less and a DBP oil absorption amount of 100 mL/100 g or more and 300 mL/100 g or less. The content of vinyl acetate is 2.9 parts by mass or more and 12.3 parts by mass or less based on 100 parts by mass of the main component. The resin molded product has a surface resistivity of 720 Ω/□ or less.

COMPOSITE STRUCTURES WITH EMBEDDED ELECTRICAL GRIDS
20230150251 · 2023-05-18 · ·

A composite structure of a cargo body and a method of making the same are disclosed. The composite structure includes at least one electrical grid embedded within fiber-reinforced polymer (FRP) layers. The embedded electrical grid includes a plurality of conductive fibers and a plurality of insulating fibers integrated into a polymer matrix of the FRP layers. The embedded electrical grid may be used for power distribution, structural strengthening and stiffness, and/or puncture detection.

Electroconductive film, touch panel, and image display device

One aspect of the present invention provides a light-transmitting electroconductive film 10 comprising a light-transmitting base material 11 and an electroconductive part 13 provided on one surface of the light-transmitting base material 11, wherein the electroconductive part 13 includes a light-transmitting resin 15 and plural electroconductive fibers 16 incorporated in the light-transmitting resin 15, and the electroconductive part 13 can conduct electricity from the surface 13A of the electroconductive part 13, and the electroconductive fibers 16 as a whole are unevenly distributed on the light-transmitting base material side than the position HL, which is located at half the film thickness of the electroconductive part 13 in the electroconductive part 13, and the electroconductive part 13 has a surface resistance value of 200 Ω/□ or less, and the electroconductive film 10 has a haze value of 5% or less.

Conductive films

A method of making an electrically-conductive film is provided. The method includes providing a release layer, optionally having a topologically structured surface, and depositing at least one electrically-conductive layer on the release layer whereby the at least one electrically-conductive layer has an outer surface that substantially replicates the topologically structured surface. The electrically-conductive layer can be peeled away from the release layer to obtain the electrically-conductive film. Such electrically-conductive films can be useful in lightning strike applications.

RADAR-ABSORBING MATERIAL HAVING HONEYCOMB SANDWICH STRUCTURE AND STEALTH STRUCTURE USING SAME
20230136149 · 2023-05-04 ·

Various embodiments relate to an electromagnetic wave absorber having a honeycomb sandwich structure, which is capable of absorbing broadband electromagnetic waves using electromagnetic properties of a metal-coated dielectric fiber, may comprise: at least two honeycomb core layers in each of which hexagonal units formed of a material comprising the metal-coated dielectric fiber are continuously arranged; and skin layers which are disposed on top surfaces and bottom surfaces of the at least two honeycomb core layers and each include a bottom layer, a top layer, and an intermediate layer. Various other embodiments are possible.

Formable light weight composite material systems and methods
09849651 · 2017-12-26 · ·

The present invention relates to filled polymeric materials including a polymer and a mass of metallic fibers distributed within the polymer, and to light weight composites which comprise at least a pair of metallic layers and a polymeric layer interposed between the pair of metallic layers, the polymeric layer containing the filled polymeric material. The composite materials of the present invention may be formed using conventional stamping equipment at ambient temperatures. Composite materials of the present invention may also be capable of being welded to other metal materials using a resistance welding process such as resistance spot welding. Preferred composite materials include one or any combination of the following features: metallic fibers that are ribbon fibers; a polymer selected from a polyolefin, a polyamide, or a combination thereof; or a metallic layer (e.g., one or both of the pair of metallic layers) having a surface facing the filled polymeric material that is untreated.

Highly controllable electroactive materials and electroactive actuators capable of pronounced contraction and expansion
09853202 · 2017-12-26 · ·

This invention describes a method for producing highly controllable motion in electroactive materials and electroactive actuators capable of pronounced contraction and expansion, which act as synthetic muscle, tendon, fascia, perimysium, epimysium, and skin that wrinkles, comprising ion-containing, cross-linked electroactive material(s); solvent(s); electrode(s); attachments to levers or other objects; and coating(s). Restriction of movement in undesired direction(s) produces pronounced movement in the desired direction(s). The electroactive material itself or the electroactive actuator may be used individually or grouped to produce movement when activated by electricity. This invention can provide for human-like motion, durability, toughness, speed, and strength. The electroactive materials and electroactive actuators, with highly controllable motion, can be attached to objects and devices to produce motion with no metal pulleys, gears, or motors needed.

Method of manufacturing epitaxy substrate

A method of manufacturing an epitaxy substrate is provided. A handle substrate is provided. A beveling treatment is performed on an edge of a device substrate such that a bevel is formed at the edge of the device substrate, wherein a thickness of the device substrate is greater than 100 μm and less than 200 μm. An ion implantation process is performed on a first surface of the device substrate to form an implantation region within the first surface. A second surface of the device substrate is bonded to the handle substrate for forming the epitaxy substrate, wherein a bonding angle greater than 90° is provided between the bevel of the device substrate and the handle substrate, and a projection length of the bevel toward the handle substrate is between 600 μm and 800 μm.