A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

Vacuum lamination methods for forming conformally coated articles having a preformed lamination layer conformally coated to or on an object such as an LED array are provided. These vacuum lamination methods utilize a single heating step to heat a middle portion of the preformed lamination layer to a flowable condition prior to the preformed lamination layer being conformally coated over the article, such as the array of light emitting diodes disposed on an inner portion of a first side of a submount wafer.

The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.

A decorative panel including a substrate material and a decorative top layer, wherein the decorative top layer includes at least one timber layer with a wood structure, wherein the timber layer is a compressed timber layer with naturally occurring vessels throughout a thickness of the wood structure, the vessels being collapsed.

A decorative panel including a substrate material and a decorative top layer. The decorative top layer is formed by at least one timber layer penetrated with a cured adhesive, and the timber layer has a wood structure with collapsed vessels having opposed walls, the opposed walls being glued together permanently by the cured adhesive.

A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.

The disclosure relates to a sandwich composite board and a preparation method thereof. The sandwich composite board includes, from top to bottom, an upper panel layer, a core material layer, and a lower panel layer, wherein the upper panel layer and the lower panel layer are glass or fiber reinforced resin-based composite sheets; and the core material layer is composed of an aerogel, a resin, and an expandable microsphere foaming agent. Method (1) includes: heating and melting the resin to obtain slurry A, cooling the same, adding the aerogel and the expandable microsphere foaming agent thereto, and uniformly mixing the same to obtain slurry B, then flat-laying the lower panel layer, coating or printing with the slurry B, then laying the upper panel layer and hot press molding the same. Method (2) includes: uniformly mixing an aerogel, a resin and an expandable microsphere foaming agent to obtain mixture A, placing the mixture A into a non-woven bag, sealing to obtain a core material B, flat-laying the lower panel layer, flat-laying the core material B, then laying the upper panel layer, and hot press molding the same.

A floor element for forming a floor covering, the floor element comprising a decorative layer comprising a brittle material, and a resin material that permeates a lower surface of the decorative layer.