Patent classifications
B32B2309/04
Floor panel
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
Floor panel
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
LAMINATION PROCESS
A lamination process is disclosed. The process is useful for silicone based lamination adhesive compositions, in particular those which cure at or around room temperature.
MODIFICATION OF TEXTILE IN SELECTED AREA
A process for strengthening a selected area of a raw textile or manufactured textile product to enhance properties and performance. The process comprising the steps of applying a laminate trimmed to match the selected area, then placed on the textile and heated in a hot press. The laminate can be comprised of a polymer film and a nonsolvent adhesive. The polymer film can be tailored from a blend of hard acrylic and tough polyurethane to adjust for rigidity and strength. The adhesive can be a hot melt or pressure sensitive types as well as any type that provides a secure adhesion.
FLOOR PANEL
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
FLOOR ELEMENT FOR FORMING A FLOOR COVERING, A FLOOR COVERING, AND A METHOD FOR MANUFACTURING A FLOOR ELEMENT
A floor element for forming a floor covering, the floor element comprising a decorative layer comprising a brittle material, and a resin material that permeates a lower surface of the decorative layer.
Composite binding materials
A metal composite including an oxidized base metal and a fibrous composite material coupled by a self-assembled monolayer and adhesive is described. Additionally, a method of constructing a metal composite is described, wherein the method includes oxidizing a metal, depositing a self-assembled monolayer, and adhering a fibrous composite to the monolayer.
Process for manufacturing apron board of high-speed rail equipment cabin using composite material
A process for manufacturing an apron board of a high-speed rail equipment cabin using a composite material is disclosed. The material includes aramid fiber honeycomb, PET foam, 3K twill carbon fiber flame retardant prepreg, unidirectional carbon fiber flame retardant prepreg, glass fiber flame retardant prepreg, aramid flame retardant prepreg, and 300 g/m.sup.2 single component medium temperature curing blue epoxy adhesive. The process includes manufacturing an apron main plate (3); manufacturing apron-board trim strips (1, 2), wherein there are two apron-board trim strips (1) and two apron-board trim strips (2); and obtaining the apron board through the apron main plate (3) and the apron-board trim strips (1, 2), wherein the two apron-board trim strips (1) are respectively stuck at two opposite sides of the apron main plate (3), the two apron-board trim strips (2) are respectively stuck at another two opposite sides of the apron main plate (3).
Floor element for forming a floor covering, a floor covering, and a method for manufacturing a floor element
A floor element for forming a floor covering, wherein the floor element comprises a decorative layer made of a ceramic material and a support layer arranged below the decorative layer, wherein the support layer comprises edges provided with coupling elements configured to allow a mechanical coupling with coupling elements of an adjacent floor element, wherein the floor element comprises an intermediate layer having a resin material that permeates a lower surface of the decorative layer, and wherein the intermediate layer is an adhesive layer that bonds together the decorative layer and the support layer.
Floor panel
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.