The present invention relates to a debondable solvent-borne pressure sensitive adhesive composition comprising a) a (meth)acrylate co-polymer formed from the monomers selected from the group consisting of ethyl (meth)acrylate, methyl acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 3-epoxypropyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, hydrogenated polybutadiene(meth)acrylate, glacial acrylic acid, vinyl acetate, and mixtures thereof; b) an electrolyte selected from the group consisting of 1-butyl-3-methylimidazolium bis(trifluoromethylsolfonyl)imide, 1-ethyl-3-vinylimidazolium methanesulfonate, 1-dodecyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide, tributyl(ethyl) phosphonium diethyl phosphate, trihexyltetradecylphosphonium bis(trifluoromethylsulfonyl)amide and mixtures thereof; c) a cross-linker; and d) a solvent.

A prepreg that is embedded with ultrahigh-temperature particles by coating one or more veil carrier with ultrahigh-temperature particles, and then incorporating the one or more of the modified veil layer with one or more fabric layer to form a reinforced fabric for a prepreg to enable the formation of layups with tailored amounts of the ultrahigh-temperature particles that vary through the thickness of the reinforced fabric to enable a functionally graded composite that can withstand ultrahigh temperatures.

A method for forming an engineered veneer block includes stacking a plurality of laminate layers. The method also includes spreading a bonding agent between each layer of the plurality of laminate layers. The bonding agent includes an adhesive. The adhesive consists essentially of one or more no added formaldehyde adhesives. The method also includes slicing an engineered veneer from the engineered veneer block. The engineered veneer has a thickness in the range of 0.1 millimeters to 0.5 millimeters.

Disclosed is a method of electrochemical delamination of polymeric films from metallic articles. Also disclosed are systems for achieving the same.

The present inventions is directed to a curable and electrochemically debondable adhesive tape comprising an adhesive composition comprising: a) at least one epoxide compound; b) a curing agent consisting of one or more compounds which have at least one epoxide reactive group and which do not possess a disulfide functional group; c) a healing agent consisting of one or more compounds which contain at least one disulfide functional group and optionally at least one epoxide reactive group selected from: hydroxyl; thiol; amine; or carboxyl; d) a toughener; and, d) an electrolyte, wherein the composition is characterized by a molar ratio of epoxide-reactive groups to epoxide groups of from 0.6:1 to 1.3:1.