A method is provided, for dissipating and entrapping super absorbent polymer particles (11, 12, 13, 14) within air-permeable, non-woven structures (100), for use in the construction of absorbent articles (600). The method comprises the steps of: (i) of constructing an air-permeable, non-woven structure (100) comprising at least first (1), second (2) and third (3) layers of non-woven fabric, each said layer having void spaces of differing size defined therein; (ii) dispersing absorbent particles (11, 12, 13, 4) onto an external surface (10) of the highest numbered layer of said air-permeable, non-woven structure (100) formed in step (i); and (iii) dissipating the dispersed absorbent particles (11, 12, 13, 14) within the air-permeable, non-woven structure (100) by applying an external energy source acting upon the absorbent particles (11, 12, 13, 14) in a direction substantially normal to the plane of the external surface (10) of the air-permeable, non-woven structure (100).

An apparatus and method for leveling a bonding device and anvil in an assembly via a closed-loop control system is provided. The assembly includes an anvil, a bonding device positioned adjacent the anvil and configured to interact with the anvil to form the bonds on the web, and an actuator that enables adjustment of an orientation between the bonding device and the anvil. The assembly also includes a closed-loop control system configured to control operation of the actuator, with the closed-loop control system configured to monitor an operational parameter of the assembly indicative of interaction of the bonding device with the anvil, determine whether the bonding device is parallel or substantially parallel with the anvil based on the operational parameter, and when the bonding device is not parallel or substantially parallel with the anvil, cause the actuator to adjust the orientation between the bonding device and the anvil.

A lift-off method for transferring an optical device layer in an optical device wafer to a transfer substrate, the optical device layer being formed on the front side of an epitaxy substrate through a buffer layer. A transfer substrate is bonded through a bonding layer to the front side of the optical device layer of the optical device wafer, thereby forming a composite substrate. A pulsed laser beam having a wavelength transmissive to the epitaxy substrate and absorptive to the buffer layer is applied from the back side of the epitaxy substrate to the buffer layer, thereby breaking the buffer layer, and the epitaxy substrate is peeled from the optical device layer, thereby transferring the optical device layer to the transfer substrate. Ultrasonic vibration is applied to the composite substrate in transferring the optical device layer.

An apparatus for fabricating an elastic nonwoven material generally includes a first bonding module and a second bonding module. The second bonding module is positionable in close proximity to the first bonding module for receiving a first nonwoven fabric, a second nonwoven fabric, and at least one elastic strand therebetween. The second bonding module has a face with a width dimension and a circumferential axis and is rotatable about a rotation axis. The face has a plurality of ridges includes a first ridge and a pair of second ridges positioned on opposing sides of the first ridge along the circumferential axis. The first ridge defines a plurality of interspaced lands and notches, and the second ridges are configured to sever the at least one elastic strand when in close proximity to the first bonding module.

A device for preparation of double fabric for down products comprises a printing means that can print an adhesive in a predetermined printing pattern on fabric; a drying means that can dry or fix the adhesive; a laminating means that can stack and laminate the fabrics on which an adhesive is printed; and a bonding means that can bond the fabrics with a cured adhesive by pressing with a predetermined pressing means and high-frequency heating to cure the adhesive; wherein said printing pattern and the pressing pattern are the same in pattern (shape), can be overlapped on the basis of the center line and have a difference in size (width) of 20% or less. Consequently, double fabric for down products thus manufactured has an excellent adhesiveness and durability and an aesthetically excellent pattern line with good clearness and finishing quality.

A mask and method of making a plurality of masks. The method includes forming a first sheet by joining a first material to a second material and forming a second sheet by joining a third material to a fourth material. The method further includes stacking the first sheet on top of the second sheet and connecting the first sheet and second sheet by joining the first material and the third material. Once the first sheet sand second sheet are joined, a mask or plurality of masks are cut from the stacked first sheet and second sheet, and the first material and the third material form the main body portion of the mask or plurality of masks, and the second material and fourth material form the fastening portion of the mask or plurality of masks.

An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.

An apparatus and method for leveling a bonding device and anvil in an assembly via a closed-loop control system is provided. The assembly includes an anvil, a bonding device positioned adjacent the anvil and configured to interact with the anvil to form the bonds on the web, and an actuator that enables adjustment of an orientation between the bonding device and the anvil. The assembly also includes a closed-loop control system configured to control operation of the actuator, with the closed-loop control system configured to monitor an operational parameter of the assembly indicative of interaction of the bonding device with the anvil, determine whether the bonding device is parallel or substantially parallel with the anvil based on the operational parameter, and when the bonding device is not parallel or substantially parallel with the anvil, cause the actuator to adjust the orientation between the bonding device and the anvil.

A method and a device are disclosed for making thin plastic films having two or more layers, which are subdivided and separated in the form of tubular bags for portioned reception of different products, wherein the plastic films are provided with welding seams running substantially transversely to the longitudinal direction with predetermined spacing between one another to form bag-like containers, and the containers are separated from one another by a cutting or separating process, the method being characterized by the steps: a) welding the films with predetermined spacing by means of an ultrasound welding process, maintaining a defined, film-dependent distance between a processing tool and a counter tool while welding; and b) separating the tubular bags welded in this way by means of a mechanical cutting process, with or without reduced ultrasound excitation at the point of the respective weld seams.

A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.