There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

This document presents a novel method of manufacturing multilayered nonwoven fabrics consisting of submicron fibers, hydroentangled, meltfibrillated, and/or spunlaid web layers. The composite multilayered webs contain one or more submicron fiber webs placed between inner and outer layers of hydroentangled, meltfibrillated, and/or spunlaid web, forming a fabric that may be utilized in the manufacture of articles which serve as barriers, wipes or sorbent materials, or may have other potential applications. The created novel composite multilayered fabric may have increased loft, softness and bending length, may not be solely dependent upon an electrostatic charge to repel small particles and microbes, and may be formed from a broad selection of natural, synthetic, and recycled polymers, including petroleum- and plant-based, allowing polymer selection based on article lifecycle.

A system and method for producing a heat-sealable composite liquid impervious, moisture-eliminating membrane with a metallic antimicrobial surface treatment including a compatibilized thermoplastic laminate structure, an integral inductive-welding element, and a metallic antimicrobial surface treatment. The method is provided with at least one scrim, a film exudate, a quantity of primary adhesive, at least one susceptor, and a quantity of flocking material, wherein the scrim, film exudate, and flocking material are composed of a compatibilized thermoplastic compound. The method is further provided with an optional metallic slurry, defining a thermoplastic-particulate emulsion configured to coat and embed into a subjected membrane section and fibrous materials when exposed to heat. The method is further expanded to apply to extant installations of similar membrane sections, enabling to post-manufacture surface treatment of a surface with the metallic slurry to confer manifold antimicrobial benefits to said surface.

An absorbent article includes a first waist region, a second waist region, and a crotch region disposed between the first and second waist regions; and a chassis having a topsheet, a backsheet, and an absorbent core positioned between the topsheet and the backsheet. The article also includes a side panel having an ultrasonically bonded, gathered laminate. The laminate has an elastomeric layer and a substrate and is joined to the chassis at a chassis attachment bond and positioned in one of the first or second waist regions. The ultrasonically bonded, gathered laminate also includes an ear structural feature comprising a surface modification to the substrate and comprising at least one of the following: embossing, apertures, perforations, slits, melted material or coatings, compressed material, secondary bonds that are disposed apart from a chassis attachment bond, plastic deformation, and folds.

A manufacturing apparatus (10) for manufacturing a semiconductor device includes: a wafer holding device (12), a PU device (14) having a PU head (40) that holds a target chip (100) in a non-contact manner, an energy irradiation device (16) irradiating energy to the target chip (100) from a back surface side of a dicing tape (130) to reduce an adhesive force of the dicing tape (130), and a controller (22). An adhesive layer of the dicing tape (130) is a self-peeling adhesive layer having an adhesive force that decreases with irradiation of the energy and floats the target chip (100) by a small distance. The controller (22) controls a position of the PU head (40) so that the target chip (100) and the PU head (40) do not come into contact with each other even if the target chip (100) floats during a takeoff preparation period.

In one method, a piece of nonwoven PET or PP fabric is formed into a tote bag using a bag forming device. Seams of the tote bag are ultrasonically welded using an ultrasonic bag welding device. The ultrasonic bag welding device includes at least one sonotrode. In another method, BOPP film is received and a full-color graphic is printed on the BOPP film for each tote bag using a printer. The printed BOPP film is received from the printer and nonwoven PP or PET fabric is received from a roll of nonwoven PP or PET fabric using a laminator. The printed BOPP film is laminated to the nonwoven PP or PET fabric. The printed BOPP film laminated to nonwoven PP or PET fabric is received from the laminator and a finished version of each tote bag is produced using an ultrasonic bag welding device.

There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

A method to manufacture an elastic laminate is disclosed. Thermoplastic Elastomeric Material (TEM) is selected from a polymer supply and fed into an extruder. The TEM film is extruded by the extruder by passing the TEM polymer through an extrusion die head to form a TEM film layer on a carrier web provided by a carrier supply. The TEM film layer is allowed to solidify on the carrier web, thereby forming a first laminate. The first laminate is stored in a first storage prior to being delivered to a delamination unit, which delaminates the first laminate by separating the TEM layer from the carrier web. The delaminated TEM layer is stretched at least in its Machine Direction (MD) in a stretching station via a plurality of web guide means. The stretched TEM layer is positioned between a first envelope web and optionally a second envelope web prior to being delivered to a bonding unit, which connects them to form a second bonded laminate. The second bonded laminate is unstretched and stored in a second storage for a predetermined time. The stored second bonded laminate is wound under controlled tension to form a roll or spool, thereby forming the elastic laminate.

In one method, a piece of nonwoven PET or PP fabric is formed into a tote bag using a bag forming device. Seams of the tote bag are ultrasonically welded using an ultrasonic bag welding device. The ultrasonic bag welding device includes at least one sonotrode. In another method, BOPP film is received and a full-color graphic is printed on the BOPP film for each tote bag using a printer. The printed BOPP film is received from the printer and nonwoven PP or PET fabric is received from a roll of nonwoven PP or PET fabric using a laminator. The printed BOPP film is laminated to the nonwoven PP or PET fabric. The printed BOPP film laminated to nonwoven PP or PET fabric is received from the laminator and a finished version of each tote bag is produced using an ultrasonic bag welding device.

The present invention relates to an apparatus for producing a gathered material, wherein the material consists of two material web portions and a thread positioned between the material web portions and the two material web portions are connected to one another at two connecting surfaces, wherein the thread is disposed between the two connecting surfaces such that the thread is connected to the material web portions, wherein the apparatus comprises a sonotrode having a first sealing surface and a counter tool having a second sealing surface, wherein the counter tool is cylindrical with a lateral surface and a cylinder axis and the second sealing surface is disposed on the lateral surface, wherein the sonotrode and the counter tool are disposed with respect to one another in a processing position such that the material web portions and the thread can be guided through a gap formed by the first and the second sealing surface in a feed direction tangential to the lateral surface of the counter tool. To overcome or at least mitigate the described drawbacks, it is proposed according to the invention that the sonotrode comprise a groove which is oriented in feed direction and extends over the entire first sealing surface for receiving the thread.