The card forming a support for a valuable object, particularly a small precious metal ingot incorporated in said card, includes a core with a through aperture in which said valuable object is arranged, said through aperture having larger dimensions than those defined by the contour of said valuable object in the main geometric plane of said card. This valuable object is located in a central area of the through aperture so that a transparent peripheral area surrounds the valuable object inside said through aperture. The valuable object is embedded in a transparent resin which entirely fills the area peripheral to said valuable object between said object and the contour of the through aperture, so that the space remaining in the aperture around the valuable object is entirely filled by the resin.

An electroplating etching apparatus includes a power to output current, and a container configured to contain an electrolyte. A cathode is coupled to the container and configured to fluidly communicate with the electrolyte. An anode is electrically connected to the output, and includes a graphene layer. A metal substrate layer is formed on the graphene layer, and is etched from the graphene layer in response to the current flowing through the anode.

A carrier film of thermoplastic polyester has releasable metal adhesive properties suitable for a metal transfer in which the polyester film is metalized and the metal layer is subsequently transferred to a permanent adhesive-coated substrate. The metal layer is in direct contact with the polyester carrier film and no intermediate release layer is present. Desired metal adhesion is provided by dispersing an suitable surfactant, and optionally, a hydrocarbon wax, uniformly into the polyester film. Surfactant on the outer surface of the carrier film modifies metal adhesion to the polyester such that the metal can be removed in a metal transfer operation.

A carrier film of thermoplastic polyester has releasable metal adhesive properties suitable for a metal transfer in which the polyester film is metalized and the metal layer is subsequently transferred to a permanent adhesive-coated substrate. The metal layer is in direct contact with the polyester carrier film and no intermediate release layer is present. Desired metal adhesion is provided by dispersing a suitable surfactant, and optionally, a hydrocarbon wax, uniformly into the polyester film. Surfactant on the outer surface of the carrier film modifies metal adhesion to the polyester such that the metal can be removed in a metal transfer operation.

A metal recycling method comprises attaching a tape to a metal layer of a semiconductor structure; and separating a part of the metal layer from the semiconductor structure and transferring the part of the metal layer to the tape by a pressure difference.

A material includes a glass sheet coated on at least part of one of the faces thereof with a stack of thin layers, the stack of thin layers being coated on at least part of the surface thereof with an enamel layer not including bismuth, the enamel layer being coated with a non-stick layer.

A method to provide for an enameled glazing including, a glass sheet, an enamel coating on at least a part of a first surface of the glass sheet, a multilayer coating on at least a part of a first surface of the glass sheet and at least partially on top of the enamel coating, such that the enamel coating either comprises no Bi.sub.4Si.sub.3O.sub.12, or, if it comprises Bi.sub.4Si.sub.3O.sub.12, the enamel coating exhibits a crystallinity ratio <5, as measured by XRD, where the crystallinity ratio is the ratio of Bi.sub.4Si.sub.3O.sub.12/Cr.sub.2CuO.sub.4.

The present invention relates to a method to provide for an enameled glazing comprising a glass sheet, an enamel coating, on at least a part of a first surface of the glass sheet, a multilayer coating on at least a part of a first surface of the glass sheet and at least partially on top of the enamel coating, characterized in that the enamel coating either comprises no Bi.sub.4Si.sub.3O.sub.12, or, if it comprises Bi.sub.4Si.sub.3O.sub.12, the enamel coating exhibits a crystallinity ratio <5, as measured by XRD, wherein the crystallinity ratio is the ratio of Bi.sub.4Si.sub.3O.sub.12/Cr.sub.2CuO.sub.4; to a method to provide for said enameled glazing and uses of said glazing.

The present application relates to a high mechanical strength polymer thin film. The high mechanical strength polymer thin film comprises, by mass percentage, 95%-99% of polyester and 1%-5% of an auxiliary agent. The number average molecular weight of the polyester is 13000 Da to 20000 Da. The molecular number of the polyester with the molecular weight smaller than 5000 Da accounts for 0.5%-5% of the total molecular number of the polyester. A molecular weight distribution index of the polyester is 1.6-2.4.