Described herein is a method for joining a first metal pipe with a second metal pipe, the pipes being joined together in an overlapping area by use of a two-component polyurethane adhesive that encapsulates the overlapping area, where the method includes the steps of:

(1) applying the two-component polyurethane adhesive onto an inner surface of a fixture;
(2) inserting one end of the first metal pipe into one end of the second metal pipe so as to form a pipe assembly having the overlapping area between the two ends, and putting the overlapping area of the pipe assembly into the fixture; (3) closing the fixture such that the overlapping area of the pipe assembly is fixed in the fixture, and such that the adhesive therein encapsulates the overlapping area of the pipe assembly; (4) curing the two-component polyurethane adhesive; and (5) optionally, removing the fixture from the pipe assembly.

A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator that oscillates a laser, a Y-axis scanner that executes a high-speed scan with a laser beam emitted from the laser oscillator in a Y-axis direction, an X-axis scanner that executes processing feed of the laser beam emitted from the laser oscillator in an X-axis direction, and a beam condenser. The Y-axis scanner is selected from any of an AOD, a resonant scanner, and a polygon scanner and the X-axis scanner is selected from a galvano scanner and a resonant scanner.

One aspect of the present invention provides a composite sheet which comprises a nitride sintered body having a porous structure and a semi-cured product of a thermosetting resin composition impregnated into the nitride sintered body, the line roughness Rz specified by JIS B 0601:2013 of at least one main surface being 10 μm or less.

In a ceramic/copper/graphene assembly, a ceramic member, a copper member formed of copper or a copper alloy, and a graphene-containing carbonaceous member containing a graphene aggregate are joined. At a joining interface between the copper member and the graphene-containing carbonaceous member, an active metal carbide layer containing a carbide of one or more kinds of active metals selected from Ti, Zr, Nb, and Hf is formed on a side of the graphene-containing carbonaceous member, and a Mg solid solution layer having Mg dissolved in a matrix phase of Cu is formed between the active metal carbide layer and the copper member.

A resin composition including a polyester polyurethane resin (A); and an epoxy resin (B), in which a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to 8,000, and a layered body including a resin composition layer, a layered body, a flexible copper-clad laminate, a flexible flat cable, or an electromagnetic wave shielding film, each using the resin composition.

Disclosed is a preparation method for a copper clad laminate comprising: (1) dissolving a polymer in an organic solvent, heating and stirring to obtain a pre-impregnation liquid; (2) impregnating a liquid crystal polymer cloth in the pre-impregnation liquid, and drying to obtain a liquid crystal polymer impregnated cloth; and (3) laminating the liquid crystal polymer impregnated cloth and a copper foil to prepare the copper clad laminate, wherein the polymer in step (1) is at least one selected from the group consisting of fully aromatic polyesteramide, epoxy resin, and polyimide; and the liquid crystal polymer cloth in step (2) is prepared from a liquid crystal polymer having a melting point greater than 280° C., a dielectric constant less than 3.2, and a dielectric loss tangent angle less than 0.0025. The preparation method for the copper clad laminate has a simple preparation process and a low manufacturing cost.

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

A liquid crystal polymer composite film is formed from a resin composite including one or more liquid crystal polymers and one or more fillers. The liquid crystal polymer composite film has a thickness in the range of 10 μm-200 μm and a ratio of the in-plane dielectric permittivity in the machine direction to the transverse direction in the range of 1.0-1.4 over a frequency range of 1 Ghz to 10 Ghz. A metal-clad laminate includes the liquid crystal polymer composite film and a metal clad layer laminated to a major surface of the liquid crystal polymer composite film. The metal-clad laminate may be included as part of an antenna.

A polyvinyl acetal resin film for laminated glass, a viscosity of toluene/ethanol=1/1 (by mass ratio) solution of a polyvinyl acetal resin in a resin composition constituting the polyvinyl acetal resin film with a concentration of 10% by mass, measured at 30 rpm and 20° C. by using a Brookfield-type (B-type) viscometer, being more than 200 mPa.Math.s, the polyvinyl acetal resin film comprising a plasticizer in an amount of 0 to 20% by mass based on a total mass of the resin composition constituting the polyvinyl acetal resin film, and the polyvinyl acetal resin film having a thickness of 10 to 350 μm.

A copper-coated steel wire includes a core wire made of a steel and a coating layer made of copper or a copper alloy which covers an outer peripheral surface of the core wire. The coating layer includes an intermediate layer which is disposed in a region including the interface with the core wire and has a higher zinc concentration than a remaining region of the coating layer.