Patent classifications
B32B2311/12
Poly-supported copper foil
A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.
Bonds for solar cell metallization
A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
Black plated resin part and method for producing the same
A black plated resin part includes a resin substrate, an underlying plating layer formed on the resin substrate, and a black chromium plating layer formed of trivalent chromium and having a thickness of 0.15 μm or more. The black chromium plating layer is formed on the underlying plating layer. The chromium in the black chromium plating layer is present in the form of metallic chromium, chromium oxide, and chromium hydroxide, and the black chromium plating layer exhibits a b* value of 3.0 or less based on the L*a*b* color system.
Sliding member
A sliding member includes a back-metal layer including an Fe alloy and a sliding layer including a copper alloy including 0.5 to 12 mass % of Sn and the balance of Cu and inevitable impurities. The sliding layer has a cross-sectional structure perpendicular to a sliding surface of the sliding layer. The cross-sectional structure includes first copper alloy grains that are in contact with a bonding surface of the back-metal layer and second copper alloy grains that are not in contact with the bonding surface. The first copper alloy grains has an average grain size D1 and the second copper alloy grains has an average grain size D2. D1 and D2 satisfy the following relations: D1 is 30 to 80 μm; and D1/D2=0.1 to 0.3.
Flexible micrometeoroid shield
A multilayer particle shield for a spacecraft includes an inboard exterior layer configured to be disposed proximal to the spacecraft, an outboard exterior layer configured to be disposed distal from the spacecraft and at least one interior layer disposed between the inboard exterior layer and the outboard exterior layer, wherein the interior layer includes a semi-rigid, porous, compressible spacer.
Metal-clad laminate, printed wiring board and metal foil with resin
A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on at least one principal surface of the insulating layer. The resin composition includes a thermosetting curing agent and a polyphenylene ether copolymer. The polyphenylene ether copolymer has an intrinsic viscosity ranging from 0.03 dl/g to 0.14 dl/g, inclusive. The intrinsic viscosity is measured in methylene chloride at 25° C. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by one of formula (1) and formula (2) at an average number of more than or equal to 0.8 and less than 1.5 per one molecule. Further, the metal foil includes a barrier layer containing cobalt on a first surface of the metal foil. The first surface is in contact with the insulating layer, and has a ten-point average roughness (Rz) of less than or equal to 2.0 μm. In formula (1), R.sup.1 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R.sup.2 represents an alkylene group having 1 to 10 carbon atoms. In formula (2), R.sup.3 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. ##STR00001##
RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.
Cookware with copper bonded layer
Provided is an article of cookware and a method of making the same. The cookware has at least one stainless steel layer and at least one copper layer metallurgically bonded directly to the at least one stainless steel layer via solid state bonding. The at least one stainless steel layer may be a ferritic stainless steel layer, and the at least one copper layer may be a grain stabilized copper. The at least one stainless steel layer may be made from a 400 series stainless steel, such as a 436 stainless steel alloy, a 439 stainless steel alloy, or a 444 stainless steel alloy. The at least one copper layer may be made from a high purity, oxygen free copper alloy, such as a C101 copper alloy, a C102 copper alloy, or a C107 copper alloy.
Hot-stamped body
There is provided a hot-stamped body including: a steel base metal; and a metallic layer formed on a surface of the steel base metal, wherein the metallic layer includes: an interface layer that contains, in mass %, Al: 30.0 to 36.0%, has a thickness of 100 nm to 5 μm, and is located in an interface between the metallic layer and the steel base metal; and a principal layer that includes coexisting MgZn.sub.2 phases and insular FeAl.sub.2 phases, is located on the interface layer, and has a thickness of 3 μm to 40 μm.
Metal-carbon composites and methods for their production
A method for producing a carbon nanotube-metal composite in which carbon nanotubes are layered on a metal substrate, the method comprising: (i) depositing a liquid, in which carbon nanotubes are suspended, onto said metal substrate; (ii) during or after step (i), subjecting said liquid to a shearing force sufficient to spatially confine the liquid to induce at least partial alignment of said carbon nanotubes on said metal substrate; and (iii) removing said liquid to produce said carbon nanotube-metal composite; wherein, after step (iii), the lengthwise dimensions of said carbon nanotubes are adhered to and oriented parallel with said metal surface, and said carbon nanotubes are at least partially aligned with each other. In some embodiments, the liquid is deposited in the form of droplets, and the droplets are subjected to a shearing force to cause them to elongate, which induces at least partial alignment of the carbon nanotubes.