A cooling plate for use in a blast furnace is described. The cooling plate has a copper body having an inner face containing ribs parallel therebetween, having first extremities and separated by grooves having second extremities. At least one of these grooves containing at least a part of a multilayer protrusion extending between its second extremities and having at least one layer made of a wear resistant material that increases locally the wear resistance of the neighboring ribs.

The present invention provides a method for manufacturing a polymer film, the method comprising the steps of: drying a polymer precursor to form a precursor film; and curing the precursor film to form a polymer film, wherein the drying is performed such that the content of a solvent remaining in the precursor film after the drying is 30% or less.

A multi-material component joined by a high entropy alloy is provided, as well as methods of making a multi-material component by joining materials with high entropy alloys to reduce or eliminate liquid metal embrittlement (LME) cracks.

To provide a polyimide film and a metal-clad laminate that are excellent in low hygroscopic dielectric properties, the polyimide film has a dielectric loss tangent of less than 0.010 after being immersed in water at 25° C. for 24 hours.

An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.

A method for producing a black plated resin part includes the steps of electroplating a resin substrate provided with an underlying plating layer in a trivalent chromium plating bath containing thiocyanic acid, to thereby form, on the underlying plating layer, a black chromium plating layer composed of trivalent chromium and having a thickness of 0.15 μm or more; and immersing the resin substrate provided with the black chromium plating layer in warm water at 30° C. or higher for a predetermined time. In the method, the amount of thiocyanic acid contained in the trivalent chromium plating bath, the temperature of the warm water, and the time of immersion of the resin substrate in the warm water are adjusted so that the black chromium plating layer exhibits a b* value of −1.7 or less based on the L*a*b* color system.

A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.

Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.

Described herein is a laminate including at least one first layer of at least one first metal and at least one further layer of a polymer composition (PC). Also described herein is a process for producing the laminate.

An ultrasonic atomization piece and manufacturing process thereof relate to the technical field of ultrasonic atomization. The piece comprises a piezoelectric ceramic sheet and at least one composite plate. The composite plate is fixed on one side of the piezoelectric ceramic sheet and includes a substrate and a conductive layer, the conductive layer is in contact with the piezoelectric ceramic sheet, the substrate is provided with atomizing apertures, and the substrate is a polymer film. Compared with the traditional stainless steel thin sheet, the polymer film is used as the substrate material; the force for the piezoelectric ceramic sheet to generate deformation requires being lower, so the piezoelectric ceramic sheet can pull the polymer film to generate deformation with less energy. The difficulty of drilling apertures is reduced, and metal residues splashing will not occur, thereby eliminating the adverse effect of metal residues on the passage efficiency of liquid.