Materials and methods for mitigating passive intermodulation. A membrane for reducing passive intermodulation includes a first polymeric layer, a second polymeric layer, and a continuous metal layer encapsulated between the first and second polymeric layers. A self-adhesive radio frequency barrier tape includes a waterproof polymeric top layer, a metal-containing layer adhered by an adhesive layer to the polymeric top layer, a pressure sensitive adhesive layer adhered to the metal-containing layer, and a release liner on a bottom surface of the pressure sensitive adhesive layer. A method of mitigating passive intermodulation includes passing a probe over an area of interest, the probe being sensitive to an intermodulation frequency of interest, and identifying a suspected source of passive intermodulation when the amplitude of the probe output exceeds a threshold at the frequency of interest. The method further includes covering the suspected passive intermodulation source with a radio frequency barrier material.

Disclosed herein is a pouch-shaped battery case configured to receive an electrode assembly having a separator interposed between positive and negative electrodes, together with an electrolytic solution, the pouch-shaped battery case including an outer coating layer defining an outer surface of the battery case and configured to protect the electrode assembly from an outside of the battery case, the outer coating layer made of a polymer resin, a metal barrier layer located between the outer coating layer and an inner surface of the battery case, the metal barrier layer having high moisture-blocking efficiency and high thermal conductivity, and an inner sealant layer located between the metal barrier layer and an inner surface of the battery case, the inner sealant layer made of a polymer resin that has high thermal fusibility, the metal barrier layer includes a first metal that has high formability and a second metal that has high rigidity.

The present invention is directed to a curable and one component (1K) debondable adhesive composition comprising: a) epoxy resin; b) a curing agent for said epoxy resin; c) an electrolyte; and, d) an electrically non-conductive filler; wherein said composition comprises at least one of: e) a combination of a solubilizer and a toughener; and, f) electrically conductive particles.

One aspect of the present invention provides a composite sheet which comprises a nitride sintered body having a porous structure and a semi-cured product of a thermosetting resin composition impregnated into the nitride sintered body, the line roughness Rz specified by JIS B 0601:2013 of at least one main surface being 10 μm or less.

A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.

A laminated metal sheet for a metal container lid includes a polyester resin layer formed on a metal sheet. The polyester resin layer is composed of an A and a B layer, wherein the melting point of the A layer is lower than the melting point of the B layer by 20° C. or more, the A layer includes a molten layer where the value of the ratio of a peak intensity I.sub.0° to a peak intensity I.sub.90° is 1.5 or less, the B layer includes an orientation layer where the value of the ratio of the peak intensity I.sub.0° to the peak intensity I.sub.90° is 3.0 or more, the thickness of the A layer is within the range from 5 μm or more to less than 30 μm, and the thickness of the B layer is within the range from 0.5 μm or more to less than 6.0 μm.

An embodiment relates to an ultrasonic additive manufacturing process, comprising joining a foil comprising a bulk metallic glass to a substrate; and forming a cladded composite comprising the foil and the substrate; wherein a thickness of the cladded composite is greater than a critical casting thickness of the bulk metallic glass, wherein the cladded composite comprises a cladding layer of the bulk metallic glass on the substrate and the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.

The invention relates to a cover structure the SMC main body of which is simultaneously pressed and bonded with two additional layers in a bonding press.

A solvent-based polyurethane retort adhesive system for producing laminates including: (A) at least one isocyanate compound, Component A, comprising: a blend of: (i) at least one aliphatic-based isocyanate and (ii) at least one aromatic-based isocyanate; and (B) at least one isocyanate-reactive component, Component B, comprising: (i) at least one phosphate ester compound and (ii) at least one polyether polyol having an average molecular weight of less than 1,500 g/mol; a process for producing the above adhesive; a multi-layer laminate product including the above adhesive; and a process for producing a laminate product using the above adhesive.

A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent.

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In Formula (1), R.sub.1 represents a hydrogen atom or an alkyl group.