Patent classifications
B32B2313/04
Insulation panel for construction and manufacturing method thereof
A multilayer thermal insulation panel for construction and manufacturing method thereof are described. A manufacturing method of a backing layer of a multilayer thermal insulation panel for construction, the method comprising the steps of: providing a reinforcement layer in fibrous material, spreading a first fluid mineral mixture on the reinforcement layer to form a cladding layer of the reinforcement layer; forming a fire-resistant layer comprising expansive graphite on the cladding layer; and drying the backing layer.
Carbon fiber reinforced plastic structure and processing apparatus
A carbon fiber reinforced plastic structure has a low surface roughness and has reduced deformation due to residual stress, changes in temperature, etc., and a processing apparatus that uses the structure, are disclosed. The carbon fiber reinforced plastic structure (CFRP structure) includes a carbon fiber reinforced plastic member (CFRP member), and a resin layer formed on a first surface of the carbon fiber reinforced plastic member, the resin layer including an opposite surface that is opposite to a surface facing the first surface, the opposite surface having a surface roughness that is less than a surface roughness of the first surface of the carbon fiber reinforced plastic member.
CERAMIC/COPPER/GRAPHENE ASSEMBLY AND METHOD FOR MANUFACTURING SAME, AND CERAMIC/COPPER/GRAPHENE JOINING STRUCTURE
In a ceramic/copper/graphene assembly, a ceramic member, a copper member formed of copper or a copper alloy, and a graphene-containing carbonaceous member containing a graphene aggregate are joined. At a joining interface between the copper member and the graphene-containing carbonaceous member, an active metal carbide layer containing a carbide of one or more kinds of active metals selected from Ti, Zr, Nb, and Hf is formed on a side of the graphene-containing carbonaceous member, and a Mg solid solution layer having Mg dissolved in a matrix phase of Cu is formed between the active metal carbide layer and the copper member.
MULTILAYER COMPOSITE WITH THERMAL BARRIER PROPERTIES
The present disclosure relates to a multilayer composite that may include a first barrier layer and a first foam layer. The first foam layer may include a polyurethane-based matrix component, and a flame retardant filler component. The multilayer component may also have a HBF flammability rating as measured according to ASTM D4986.
Nanocomposite surfaces with electrically switchable adhesion
An apparatus for manipulating an object includes a substrate, an electrically conductive layer disposed on the substrate, and a porous medium comprising an electrically conductive material. The apparatus also includes a dielectric layer conformally disposed on the porous medium to insulate the porous medium from the object during use. The porosity of the porous medium is about 90% or greater. The adhesive strength of the porous medium is about 1 kPa or lower, and the modulus of the porous medium is about 1 GPa or lower.
Polyimide-based composite carbon film with high thermal conductivity and preparation method therefor
The present invention discloses a polyimide-based composite carbon film with high thermal conductivity and a preparation method therefor. The preparation method includes: uniformly coating the surface of a polyimide-based carbon film with an aqueous graphene oxide solution, and then covering the same with another polyimide-based carbon film uniformly coated with an aqueous graphene oxide solution; repeating such operation; after the polyimide-based carbon films are dried, bonding the polyimide-based carbon films by means of graphene oxide so as to form a thick film; bonding the polyimide-based carbon films more tightly by means of further low-temperature hot pressing; and finally, obtaining a thick polyimide-based carbon film with high thermal conductivity by repairing defects by means of low-temperature heating pre-reduction and high-temperature and high-pressure thermal treatment. The thick polyimide-based carbon film with high thermal conductivity has a thickness greater than 100 μm and an in-plane thermal conductivity of even reaching 1700 W/mK or above.
COMPOSITE PREPREG AND FIBER-REINFORCED PLASTIC MOLDED BODY
A composite prepreg and a fiber-reinforced plastic molded body are described that are excellent in secondary weldability with another member and exhibit excellent handleability and reinforcing characteristics, where the composite prepreg in which reinforcing fibers are impregnated with a thermoplastic resin and a thermosetting resin, and a thermoplastic resin layer and a thermosetting resin layer that form an interface and joined to each other are formed, wherein the thermoplastic resin layer is present on at least one surface of the composite prepreg, and the thermoplastic resin layer contains continuous reinforcing fibers.
FABRIC CONTAINING UNIDIRECTIONAL REINFORCEMENT FIBRE
A fabric and a method for making the same. The fabric includes a layer of unidirectionally oriented carbon fibre filaments sandwiched between a first layer of glass fibre rovings and a second layer of glass fibre rovings. The first layer of glass fibre rovings and the second layer of glass fibre rovings are linked by a connecting material.
FLEXIBLE PROXIMITY SENSORS INCORPORATING NANOCOMPOSITE MATERIALS, METHODS OF PRODUCING THE SAME, AND METHODS OF MEASURING SENSITIVITY OF THE SAME
Sensors, methods of producing sensors, and methods of measuring sensitivities of sensors are disclosed herein. A sensor includes a nanocomposite material having a thermoplastic polyurethane base. A method of producing a sensor includes embedding a plurality of carbon nanotubes into a thermoplastic polyurethane base and diluting a concentration of the plurality of carbon nanotubes embedded into the thermoplastic polyurethane base.
Ceramic-containing and ceramic composite transaction cards
A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.