A laminated glass, includes an outer pane, an inner pane, at least two lamination layers arranged between the outer pane and the inner pane, and at least one design element, wherein the design element is formed on a partial region of a pane side of the outer pane or the inner pane from a pictorial black print having one or a plurality of unprinted regions, and an opaque, non-black underlay is arranged between the two lamination layers, which underlay is placed underneath the unprinted region(s) of the design element. The laminated glass has a design element with good contrast and good visibility and is suitable in particular as a vehicle window.

A thermal barrier coating includes a bond coat layer deposited on a substrate, and a ceramic layer deposited on the bond coat layer. The ceramic layer includes a first layer having a porosity of 10% or more and 15% or less, and a second layer having a porosity of 0.5% or more and 9.0% or less and deposited on the first layer.

This invention provides methods for the processing of platinum metallized high temperature co-fired ceramic (HTCC) components with minimum deleterious reactions between platinum and the glass constituents of the ceramic-glass body. The process comprises co-firing a multilayer laminate green ceramic-glass body with via structures filled with a platinum powder-based material in a reducing atmosphere with a specified level of oxygen partial pressure. The oxygen partial pressure should be maintained above a minimum threshold value for a given temperature level.

A sensor element (10) having a laminate structure, and extending in an axial direction AX, the sensor element including a first and second ceramic layers (118B, 115) disposed apart from each other in a laminating direction; a third ceramic layer (118) intervening between the first and second ceramic layers in the laminating direction and having a hollow space (10G) formed therein; and an internal space which is the hollow space surrounded by the first ceramic layer, the second ceramic layer, and the third ceramic layer, wherein, at a periphery (10f) of the internal space, a fourth ceramic layer (181) containing as a main component a ceramic material different from that contained as a main component in the first and third ceramic layers intervenes between the first ceramic layer and the third ceramic layer which are exposed to the internal space. Also disclosed is a method for manufacturing the gas sensor element.

A composite of metal and carbon-fiber-reinforced plastic according to the present invention comprising a predetermined metal member, a resin layer positioned at a surface of at least part of the metal member and containing an inorganic filler having a thermal conductivity of 20 W/(m.Math.K) or more, and carbon fiber reinforced plastic positioned on the resin layer and containing a predetermined matrix resin and carbon reinforcing fiber present in the matrix resin, the carbon reinforcing fiber being at least one of pitch-based carbon reinforcing fiber having a thermal conductivity of 180 to 900 W/(m.Math.K) in range or PAN-based carbon reinforcing fiber having a thermal conductivity of 100 to 200 W/(m.Math.K) in range, a content of the inorganic filler in the resin layer being 10 to 45 vol % in range with respect to a total volume of the resin layer, a number density of the inorganic filler present in a region of a width X m from an interface of the resin layer and the carbon fiber reinforced plastic in a direction of the resin layer being 300/mm.sup.2 or more, where X m is an average particle size of the inorganic filler.

Cards made in accordance with the invention include a decorative layer attached to a core layer, where the decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. At least one of the decorative layers is a layer derived from plant matter (e.g., wood). The cards may be dual interface smart cards that can be read in a contactless manner and/or via contacts.

Wear resistant articles are described herein which, in some embodiments, mitigate CTE differences between wear resistant components and metallic substrates. In one aspect, an article comprises a layer of sintered cemented carbide bonded to a layer of iron-based alloy via a metal-matrix composite bonding layer, wherein coefficients of thermal expansion (CTE) of the sintered cemented carbide layer, metal matrix composite bonding layer, and iron-based alloy layer satisfy the relation:

[00001]$x=\frac{\left(.Math.C.Math..Math.T.Math..Math.E.Math..Math.\mathrm{WC}-C.Math..Math.T.Math..Math.E.Math..Math.M.Math..Math.M.Math..Math.C.Math.\right)}{\left(.Math.C.Math..Math.T.Math..Math.E.Math..Math.M.Math..Math.M.Math..Math.C-C.Math..Math.T.Math..Math.E.Math..Math.\mathrm{Fe}.Math.\right)}$

wherein 0.5x2 and CTE WC, CTE MMC and CTE Fe are the CTE values for the sintered cemented carbide, metal matrix composite, and iron-based a

Insulation panel made from an insulation panel precursor comprising at least one modified layered silicate.

A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a capacitance forming unit, a cover, and a side surface. The capacitance forming unit includes ceramic layers that are laminated in a first direction and contain boron, and internal electrodes disposed between the ceramic layers. The cover covers the capacitance forming unit in the first direction. The side surface faces in a second direction orthogonal to the first direction. The side margin covers the side surface in the second direction and has a lower boron concentration than a boron concentration of the ceramic layers.

A gas barrier film includes a substrate, a base inorganic layer, a silicon nitride layer formed using the base inorganic layer as a base, and a mixed layer formed at a boundary surface of the base inorganic layer and the silicon nitride layer, in which the base inorganic layer contains silicon oxide, the mixed layer contains a component derived from the base inorganic layer and a component derived from the silicon nitride layer, and a thickness of the mixed layer is 3 nm or more.