B32B2315/02

CURABLE COMPOSITIONS

The present invention is directed to a curable composition including: an isocyanate-functional prepolymer; an epoxy-containing component present in an amount of at least 10 percent by weight of the composition; and a latent curing agent having an ability to react with at least one of the isocyanate-functional prepolymer and the epoxy-containing component upon exposure to an external energy source. The present invention is also directed to methods of making the compositions, methods of coating a substrate, methods of adhering substrates and coated substrates.

COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
20220359340 · 2022-11-10 · ·

A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 μm or more and 1.2 μm or less.

COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER-CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
20230034784 · 2023-02-02 · ·

A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a Mg—N compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the Mg—N compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces/μm.

Ceramic Surface Modification Materials
20230032108 · 2023-02-02 ·

Porous, binderless ceramic surface modification materials are described, and applications of use thereof. The ceramic surface material is in the form of an interconnected network of porous ceramic material on a substrate. The ceramic material may include a metal oxide, a metal hydroxide, and/or hydrates thereof, or a metal carbonate or metal phosphate, on a substrate surface. The substrate may be in the form of a metal or polymer particulate, powder, extrudate, or flakes.

COMPOSITE ARTICLES PROVIDING FLAME RETARDANCY AND NOISE REDUCTION
20220347981 · 2022-11-03 ·

A thermoplastic composite article comprising a porous core layer and an open cell skin disposed on a first surface of the core layer is described. The composite article comprises a noise reduction coefficient of at least 0.5 as tested by ASTM C423-17 and a flame spread index of less than 25 and a smoke development index of less than 150 as tested by ASTM E84 dated 2009.

Ceramic matrix composite airfoil cooling

Airfoils for gas turbine engines are provided. In one embodiment, an airfoil formed from a ceramic matrix composite material includes opposite pressure and suction sides extending radially along a span and defining an outer surface of the airfoil. The airfoil also includes opposite leading and trailing edges extending radially along the span. The pressure and suction sides extend axially between the leading and trailing edges. The leading edge defines a forward end of the airfoil, and the trailing edge defining an aft end of the airfoil. Further, the airfoil includes a trailing edge portion defined adjacent the trailing edge at the aft end of the airfoil; a plenum defined within the airfoil forward of the trailing edge portion; and a cooling passage defined within the trailing edge portion proximate the suction side. Methods for forming airfoils for gas turbine engines also are provided.

METHODS AND APPARATUS FOR PROCESSING AN ELECTROSTATIC CHUCK

Described are techniques and equipment (apparatus) for processing an electrostatic chuck at controlled process conditions, including, as an example, for processing an electrostatic chuck during a step of curing an adhesive that forms a bond between two layers of the electrostatic chuck.

METHOD FOR COMPRESSING LAMINATE AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT INCLUDING LAMINATE

Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

Panel and method for producing a panel

The invention relates to a panel and a method for producing a panel. The panel is in particular a floor, wall or ceiling panel, and comprises at least one core layer, the core layer comprising an upper core surface and a lower core surface and at least one pair of opposite side edges; wherein the core layer comprises magnesium oxide cement and fibres dispersed in said magnesium oxide cement.

LAMINATED MEMBER
20230107722 · 2023-04-06 · ·

The present invention relates to a laminated member including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer including a resin and lying on the glass member; and a Si—SiC member lying on the bonding member, in which the Si—SiC member has an average linear expansion coefficient α at from 20° C. to 200° C. of from 2.85 ppm/° C. to 4.00 ppm/° C.