A composition includes methyl methacrylate MMA, at least one elastomer or a core-shell polymer, and at least one radical former, as an adhesive, sealant or coaling for gluing, sealing or coaling substrates containing plasticized PVC.

A heat mat with thermostatic control having a reference voltage generating source that provide high voltage DC for a power controller and low voltage for a temperature sensor and hysteresis circuit. The sensor and hysteresis circuit establish a temperature threshold signal that is delivered to the resistance heating element. The resistance heating element is sandwiched between two layers of material with adhesive. Two layers of PVC protects the sandwich. In manufacturing the heat mat, the resistance heating element is placed with adhesive between two layers of material then cured and degassed under vacuum. The thermostatic control is sealed within an overmold housing or flat pack.

A chip card substrate is provided, which includes a plurality of layers. The plurality of layers includes a first polymer layer including a first polymer material, a second polymer layer disposed over the first polymer layer and a second polymer material different from the first polymer material. The plurality of layers further includes a third polymer layer disposed over the second polymer layer and including the first polymer material. The second polymer layer includes a plurality of cutouts at an edge of the second polymer layer so that the first polymer material of the first polymer layer and of the third polymer layer form a coupling through the plurality of cutouts.

The invention relates to a material comprising at least one laminate component containing polymeric fibers wherein the material has a loss tangent of less than 8×10.sup.−3 radians as measured at a frequency chosen from the group of frequencies consisting of 1.8 GHz; 3.9 GHz; 10 GHz; 39.5 GHz; and 72 GHz.

A sound absorbing mat comprising a first polyurethane open cell polyester layer, wherein the first polyurethane open cell polyester layer is at least one quarter of an inch thick, a polyvinyl chloride layer having a top surface and a bottom surface, wherein the polyvinyl chloride layer is at least a quarter inch thick and the bottom surface is fused to the first polyurethane open cell polyester, a second polyurethane open cell polyester layer having a top surface and a bottom surface, wherein the second polyurethane open cell polyester layer is at least three quarters of an inch and the bottom surface of the second polyurethane open cell polyester layer is fused with the top surface of the polyvinyl chloride layer, and a urethane layer, wherein the urethane layer is at least a quarter inch thick and is mated to the top surface of the second polyurethane open cell polyester layer.

The invention concerns a process for the manufacture of surface covering tile (SCT) comprising the steps of: (i) providing a surface layer comprising a film having a melting point of above 200° C.; (ii) printing a decorative pattern on the back side of the surface layer; (iii) providing a substrate layer comprising a polymer and a filler; (iv) bonding the back side of the surface layer onto the substrate layer and embossing the upper side of the surface layer in a hot press at a temperature and a pressure suitable for deforming the substrate layer. The invention also concerns a grained SCT comprising: a substrate layer comprising a polymer and a filler; and a surface layer comprising a film having a melting point of above 200° C., wherein the upper side of said surface layer is embossed and the back side is printed with an ink.

Apparatus, compositions, and systems for ultraviolet (UV) heat-activated laminating adhesives applied via an inkjet printing process are disclosed. A system includes a first inkjet mechanism configured to deposit ink in a particular pattern onto a surface of a rigid medium. A second inkjet mechanism is configured to deposit a laminating adhesive onto the particular pattern printed on the surface of the rigid medium. A pair of stainless steel plates is configured to receive an overlay film layer and the laminating adhesive deposited onto the particular pattern printed on the surface of the rigid medium. The overlay film layer is positioned such that a surface of the overlay film layer faces the laminating adhesive. Pressure and heat are applied to the overlay film layer and the laminating adhesive to laminate the particular pattern printed on the surface of the rigid medium.

A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

A vinyl chloride resin composition with which an increase in surface gloss can be suppressed even in the case of repeating the molding of a vinyl chloride resin molded product using the same mold and also favorable tensile elongation and low surface stickiness can be ensured is provided. A vinyl chloride resin composition comprises: a vinyl chloride resin; a plasticizer; and a silicone oil, wherein a content of the plasticizer relative to 100 parts by mass of the vinyl chloride resin is 80 parts by mass or more, a content of the silicone oil relative to 100 parts by mass of the plasticizer is 0.01 parts by mass or more, and a predetermined weight reduction rate of the silicone oil is 7.0 mass % or less.