A multilayer composite film that includes an outer ETFE layer adhered to a polyethylene terephthalate (PET) layer. These layers are adhered together by a fluoropolymer adhesive. The multilayer composite film also include an infra-red (IR) radiation rejection layer that reflects or absorbs more than 50% of incident IR radiation. A second ETFE layer can be adhered to an inner surface of the structural polymer layer. The composite films are useful in structural applications and can withstand environmental exposure.

An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

A method of thermoforming an article from an integrated transparent conductive film includes heating the integrated transparent conductive film to a formable temperature in a mold, wherein the integrated transparent conductive film comprises a substrate comprising a transparent thermoplastic material, wherein the substrate includes a substrate first surface and a substrate second surface; a transparent conductive layer disposed adjacent to the substrate, wherein the transparent conductive layer includes a transparent conductive layer first surfaced disposed on the substrate first surface; and an electrical circuit etched onto a transparent conductive layer second surface; thermoforming the integrated transparent conductive film to the article comprising the mold shape; cooling the formed article; and removing the formed article form the mold; wherein the formed article has a functional electrical circuit after thermoforming.

A pressure-sensitive adhesive film which is a pressure-sensitive adhesive film comprising a thermoplastic resin, wherein a maximum peak temperature of tan ? is 0? C. or more and 52? C. or less, a shear storage elastic modulus at 20? C. is 3?10.sup.5 Pa or more, and a proportion of an undissolved component in dissolution of 1.0 g of the pressure-sensitive adhesive film in 10 g of isopropyl alcohol is 35% by mass or more and 100% by mass or less.

Method and device for delamination/dismantling of multi-layer systems SM comprising several layers including at least one organic layer, wherein the layers are separated by interfaces, characterized in that it comprises at least the following steps: Mixing the multilayer system with a fluid composed of at least one gas having the particularity of causing the swelling of at least one of the layers and one or more non-reactive liquids having the particularity of allowing the separation of each layer unitarily or of subsets of layers composing the multilayer system without degradation of the constituents of the layers, the gas/liquid fluid being raised in temperature and pressure, Recovering separately at least one or more layers or a subset of undegraded layers.

The invention relates to fluoropolymer filament for use in 3-D printing, and 3-D printed fluoropolymer articles having low warpage, excellent chemical resistance, excellent water resistance, flame resistance, and good mechanical integrity. Additionally, the articles of the invention have good shelf life without the need for special packaging. In particular, the invention relates to filament, 3-D printed polyvinylidene fluoride (PVDF) articles, and in particular material extrusion 3-D printing. The articles may be formed from PVDF homopolymers, copolymers, such as KYNAR resins from Arkema, as well as polymer blends with appropriately defined low shear melt viscosity. The PVDF may optionally be a filled PVDF formulation. The physical properties of the 3-D printed articles can be maximized and warpage minimized by optimizing processing parameters.

A roof panel having an integrated photovoltaic module is described. The roof panel has at least a substrate and an outer panel, which are laminarily bonded to each other by means of a thermoplastic layer, wherein a photovoltaic layer system is embedded in the thermoplastic layer and the substrate contains at least one polymer.

An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

Polyester polymers are described comprising polymerized units comprising a hydroxy functional aromatic group wherein the hydroxy group has been functionalized with an adhesion promoting group. In some embodiments, the polyester polymer comprises polymerized units have the general structure (A) wherein L.sub.1 and L.sub.2 are independently divalent linking groups comprising an ester group; and R.sub.A is an adhesion promoting group bonded to the oxygen atom by means of an ionic or covalent bond. In other embodiments, film articles, laminates are described and methods of making functionalized polyester polymers are described.

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Multilayer packages are provided for packaging products, such as components of electronic devices are provided, and are particularly well suited for the fabrication of carrier tapes. The packages include a container component and at least one cover component, each of which incorporate a layer of a fluoropolymer (fluorine-containing polymer). A multilayer container film is shaped to include pockets extending from one or both planar surfaces and exhibits excellent barrier properties and structural strength.