Provided is an aluminum-resin bonded body that expresses excellent bonding strength and does not show a reduction in the strength after a durability test, thus being able to keep the excellent bonding strength over a long period of time. The aluminum-resin bonded body includes: an aluminum substrate formed of aluminum or an aluminum alloy; an oxygen-containing film containing oxygen, the oxygen-containing film being formed on a surface of the aluminum substrate; and a resin molded body formed of a thermoplastic resin composition containing a thermoplastic resin and an additive, the resin molded body being bonded onto the oxygen-containing film, in which the thermoplastic resin composition contains any one or both of: a thermoplastic resin containing an element having an unshared electron pair in a repeat unit and/or at an end; and an additive containing an element having an unshared electron pair.

A composite comprises a reinforcing fabric and an at least partially cured composition at least partially coating the reinforcing fabric, wherein the reinforcing fabric comprises first fibers wrapped with, woven with, or wrapped and woven with polyimide fibers, and the at least partially cured composition comprises the product of 30 to 70 weight percent of a poly(phenylene ether) having a number average molecular weight of 600 to 2000 AMU, 30 to 70 weight percent of a curable component, and a curing agent, wherein weight percent is based on the combined weight of poly(phenylene ether) and the curable component.

Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

A peeling method is provided. In a first step, a resin layer is formed over a support substrate, openings are formed along two opposite sides of a periphery of the resin layer in a top view, an element layer is formed over the resin layer and positioned on an inner side than the openings in the top view, and the support substrate and a counter substrate are bonded to each other so that an adhesive layer is in contact with the support substrate in the openings, thereby forming a process member. In a second step, an entire surface of the process member is irradiated with light from the support substrate side. In a third step, a blade is inserted into an end portion of the process member from an interface between the support substrate and the resin layer or from the resin layer, and is made to pass through the openings.

The flexible dust shield (10) is a dust cover for repelling dust particles from a photovoltaic solar collector panel, the exposed glass surfaces of a high-rise building faade or the like by action of an electric field. The dust shield (10) includes a pattern of electrodes (12) made from a conductive ink, such as silver ink or carbon ink, which is printed on a flexible substrate (14) made from a thermoplastic film. A cover sheet (16) of thermoplastic film is laminated to the substrate (14) over the pattern of electrodes (12). The electrodes (12) are adapted for attachment to a single phase or multi-phase alternating current signal, which generates an electric field for repelling dust particles.

A panel assembly that includes a core having first and second opposing major surfaces, a first laminate skin secured to the first major surface of the core, a second laminate skin secured to the second major surface of the core, and at least a first layer of polyimide aerogel incorporated into one of the first laminate skin or the second laminate skin.

The instant disclosure provides a polyimide composite film for a flexible display and a method for manufacturing the same. The composite film can be attached to a supporting carrier and includes a double-sided tape, a releasing layer and a transparent polyimide film. The double-sided tape includes a substrate, a surface of the substrate has an adhesive disposed thereon, and the other surface of the substrate has a releasing agent disposed thereon. A releasing layer is attached to the adhesive on the substrate and is removable from the substrate so that the substrate is attachable to the supporting carrier through the adhesive. The method includes providing a transparent polyimide film; providing the double-sided tape mentioned above; and removing the releasing layer on the releasing agent of the substrate for adhering the transparent polyimide film to the releasing agent.

The present invention provides a multilayer body of an inorganic substrate and a heat-resistant polymer film, the multilayer body being suppressed in vibrations during handling. A multilayer body of a heat-resistant polymer film and an inorganic substrate according to the present invention does not substantially use an adhesive and is characterized in that: the heat-resistant polymer film is transparent; the tensile elastic modulus E1 (GPa) and the thickness T1 (?m) of the multilayer body satisfy formula (1); and the storage elastic modulus E2 (GPa) at 280? C. and the thickness T1 (?m) of the multilayer body satisfy formula (2). (1): 25,000?E1?T1 (2): E2?T1?52,000

Provided is an inorganic substrate/heat-resistant polymer film laminate in which vibration during handling is suppressed. A laminate of a heat-resistant polymer film and an inorganic substrate that uses substantially no adhesive is characterized by that a shear peel strength between the heat-resistant polymer film and the inorganic substrate is 0.8 MPa or more and a tensile modulus of the heat-resistant polymer film is 4-9 GPa.

A polyesterimide resin composition, a polyesterimide resin layer, a flexible metal foil laminate, and methods of preparing the polyesterimide resin composition, the polyesterimide resin layer, and the flexible metal foil laminate are provided. The polyesterimide resin composition includes a compound having a structural unit represented by Chemical Formula 1:

##STR00001##

In Chemical Formula 1, m and n are mole fractions, and m+n=1 0.2?m?0.8 and 0.2?n?0.8 are satisfied. Ar1 and Ar2 are the same as or different from each other and are each independently a tetravalent organic group having at least one aromatic ring. R.sub.1, R.sub.2, and R.sub.4 to R.sub.6 each independently include at least one of H, F, CH.sub.3, OCH.sub.3, CF.sub.3, and OCF.sub.3. R.sub.3 is an ester group and includes COO or OOC.