The present invention provides a resin impregnated material and a composite material having excellent dielectric properties, high heat resistance, low stress property and the like at the same time, and a copper-clad laminate using the same. The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by General Formula (I); and (B) a radical polymerization initiator. In General Formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain; Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group; and n represents a number in the range of 1 to 20. ##STR00001##

The purpose of the present invention is to provide: a pellicle frame which is not susceptible to deterioration even if irradiated with short-wavelength light such as excimer light, and which is not susceptible to generation of an outgas or foreign substance; and a pellicle which uses this pellicle frame. In order to achieve the above-described purpose, this pellicle frame for supporting the outer periphery of a pellicle film is configured to comprise a frame and a film that is formed on the surface of the frame and contains a polyimide resin.

The present invention provides a resin composition comprising a specific styrene polymer, a specific inorganic filler, and a curing agent, wherein the styrene polymer is a specific acid-modified styrene polymer, and the resin composition satisfies specific conditions in the form of a film having a thickness of 25 m.

A decorative decal for altering the aesthetics of a barbeque grill, with the decal comprising a flexible and heat resistant substrate having a visually discernible aesthetic element on its first surface and an adhesive on its second surface, with the adhesive suitable for attaching the substrate to the outer surface of the barbeque grill; and a method of use of the decal.

Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young's modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.

[Problem] To provide a technology that allows a film or glass to be bonded to a transport substrate and to be easily separated during the manufacture of a substrate. [Solution] Provided is a method for manufacturing a substrate having an electronic device formed on a surface, the method comprising a formation step for forming an inorganic material layer on at least one of a bonding surface by which the substrate having an electronic device formed on a surface is to be bonded to a transport substrate, and a bonding surface on the transport substrate for transporting the substrate; a bonding step for pressing the substrate and the transport substrate against each other and bonding the substrate and the transport substrate by the inorganic material layer; and a separation step for separating the substrate and the transport substrate.

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200? C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

The invention provides a laminate including a polyimide film and an inorganic substrate, which has a number density of blisters including carbide particles therein of 50/m.sup.2 or less, an average height of blisters of 2 ?m or less, a product of the number density of the blisters (blisters/m.sup.2) and the average height of the blisters (?m) of 20 or less. The inventive laminate can be obtained by laminating the polyimide film and the inorganic substrate after sufficiently purifying and cleaning to remove foreign bodies made of inorganic substance therefrom, followed by heat treating the laminate at a temperature of 350-600? C. and then rapidly cooling it to carbonize and reduce the organic foreign bodies, and also to rapidly cool the gas contained in the blisters, which leads to reduced height of blisters.

An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either R.sub.1 or R.sub.2 shows a phenyl group and the other shows a hydrogen atom; R.sub.3 and R.sub.4 show a divalent residue of aromatic diamine; R.sub.5 and R.sub.6 show a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m1, n0, 1m+n20, and 0.05m/(m+n)1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), R.sub.1 and R.sub.2 show a divalent residue of aromatic diamine; R.sub.3 shows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m1 and n0, and an arrangement of repeating units may be either a block or random).

A polyimide film comprises a polyimide containing: a repeating unit (A) represented by a particular general formula: and a repeating unit (B) represented by a particular general formula, wherein a content ratio of the repeating unit (A) to a total amount of the repeating units (A) and (B) is 10 to 70% by mole, and the polyimide film has a linear expansion coefficient of 55 ppm/K or less, a tensile strength of 125 MPa or more, and a break elongation of 15% or more.