A multilayer particle shield for a spacecraft includes an inboard exterior layer configured to be disposed proximal to the spacecraft, an outboard exterior layer configured to be disposed distal from the spacecraft and at least one interior layer disposed between the inboard exterior layer and the outboard exterior layer, wherein the interior layer includes a semi-rigid, porous, compressible spacer.

A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.

A method for fabricating a display panel including a bending area includes: providing a substrate; forming a first flexible layer on the substrate; forming an organic layer on the first flexible layer, wherein a wavelength of light absorbed by the organic layer is different from a wavelength of light absorbed by the first flexible layer; irradiating a part of the organic layer in the bending area with a laser to make at least a portion of the part of the organic layer a carbonized layer, thereby forming a spacer layer; forming a second flexible layer covering the first flexible layer and the spacer layer, wherein the first flexible layer and the second flexible layer are made of a same material and separated by the spacer layer; and cutting a part of the substrate and a part of the first flexible layer in the bending area.

A glass laminate includes a non-glass substrate with a first surface and a second surface opposite the first surface. A glass sheet is laminated to the first surface of the non-glass substrate. A barrier film is laminated to the second surface of the non-glass substrate and includes a first surface adjacent to the non-glass substrate, a second surface opposite the first surface. A thickness of the barrier film can be at most about 0.5 mm. The second surface of the barrier film can define an outer surface of the glass laminate. The barrier film can be a multi-layer barrier film with a metal layer and a polymer layer. An absolute value of a flatness of the glass laminate determined according to European Standard EN 438 after exposure to 23° C. and 90% relative humidity for 7 days can be at most about 3 mm/m.

To provide a polyimide film and a metal-clad laminate that are excellent in low hygroscopic dielectric properties, the polyimide film has a dielectric loss tangent of less than 0.010 after being immersed in water at 25° C. for 24 hours.

Provided are a backboard support structure, a preparation method therefor, and a display device. The display device includes a display substrate and a backboard support structure; the backboard support structure includes a substrate support film and an adhesive layer arranged in a laminated manner. The backboard support structure is bonded to the non-display side of the display substrate via the adhesive layer, and includes a first bendable region and a first non-bent region. The adhesive layer includes a first portion located in the first bendable region and a second portion located in the first non-bent region; the first portion has a modulus of elasticity of about 1 Kpa-150 Kpa, the second portion has a modulus of elasticity of about 150 Kpa-250 Kpa, and the substrate support film has a modulus of elasticity of about 1 Gpa-10 Gpa.

The present invention relates to an infrared stealth element using a dual band perfect absorption metamaterial. The infrared stealth element includes: a first metal layer; an insulator layer formed on an upper part of the first metal layer; and a second metal layer formed on an upper part of the insulator layer. The second metal layer includes at least one among a metal ring and a metal dot.

A polyimide laminated film includes a porous polyimide layer that has a porosity of from 30% to 90% and pores having a spherical shape and a non-porous polyimide layer that has a porosity of 5% or less.

An ultrasonic atomization piece and manufacturing process thereof relate to the technical field of ultrasonic atomization. The piece comprises a piezoelectric ceramic sheet and at least one composite plate. The composite plate is fixed on one side of the piezoelectric ceramic sheet and includes a substrate and a conductive layer, the conductive layer is in contact with the piezoelectric ceramic sheet, the substrate is provided with atomizing apertures, and the substrate is a polymer film. Compared with the traditional stainless steel thin sheet, the polymer film is used as the substrate material; the force for the piezoelectric ceramic sheet to generate deformation requires being lower, so the piezoelectric ceramic sheet can pull the polymer film to generate deformation with less energy. The difficulty of drilling apertures is reduced, and metal residues splashing will not occur, thereby eliminating the adverse effect of metal residues on the passage efficiency of liquid.

Embodiments disclosed herein relate to composite laminate structures including a polymer layer having sp.sup.2 carbon-containing material and improved heat release properties, and methods of making the same.