A glass article having a first glass layer, a second glass layer disposed adjacent to the first glass layer, and an interface slidably coupling the first glass layer to the second glass layer. The interface has a thickness of from 2 nm to 500 nm. The glass article is characterized by: (a) an absence of failure when the article is held at a parallel plate separation distance of 10 mm for 60 minutes at 25° C. and 50% relative humidity; (b) a puncture resistance of greater than about 6 kgf when the second glass layer is supported by (i) a 50 μm thick pressure-sensitive adhesive having an elastic modulus of less than 1 GPa and (ii) an approximately 100 μm thick polyethylene terephthalate layer having an elastic modulus of less than 10 GPa, and the first glass layer is loaded with a tungsten carbide ball having a 1 mm diameter.

A repair seal that is resistant to cracking and peeling during an attachment procedure and that is not noticeable after repair is provided. In addition, this repair seal is manufactured. Furthermore, a repair structure that is resistant to cracking and peeling during an attachment procedure and that is not noticeable after repair is provided. A repair seal 7 or 8 of the present invention is used for a decorative panel 1 including at least one undercoat layer 1b or 1c, a colored layer 1d, and a clear layer 1e stacked in this order on a substrate 1a. The repair seal 7 or 8 includes a repair multilayer body 70 and an adhesive layer 71. The repair multilayer body 70 includes a transparent or translucent resin base material sheet 70a, a repair colored layer 70b disposed on a front surface of the base material sheet 70a and formed from the same paint as the colored layer 1d, and a repair clear layer 70c formed from the same paint as the clear layer 1e. The adhesive layer 71 is disposed on a back surface of the base material sheet 70a and is transparent or translucent.

A multilayer protective covering can protect a surface from lightning strikes. The covering includes a bottom conductive layer affixed to the surface and having a first opening that is aligned with a grounding connection so that the grounding connection is exposed through first opening and not in contact with the bottom conductive layer. The covering also includes a dielectric layer affixed to the bottom conductive layer and having second opening aligned with the grounding connection so that the grounding connection is exposed through second opening and not in contact with the dielectric layer. The covering additionally includes a top conductive layer affixed to the dielectric layer and covering the grounding connection. The top conductive layer directs electrical current from a lightning strike on the surface to the grounding connection.

Heat sink and method of manufacturing a graphene based heat sink, the method comprising: providing a first and second graphene film; arranging a layer of nanoparticles on a surface of the first and second graphene film to improve an adhesion strength between the graphene films; attaching the second graphene film to the first graphene film by means of an adhesive and the layer of nanoparticles; forming a laminated graphene film comprising a number of graphene film layers by repeating the steps, wherein the laminated graphene film is formed to have an anisotropic thermal conductivity; assembling a plurality of laminated graphene films by applying pressure and heat to cure the adhesive to form a graphene block; and removing selected portions of the graphene block to form a heat sink comprising fins extending from a base plate of the heat sink.

Provided are a glass multilayer structure, a method of producing the same, and a flexible display panel including the same. Specifically, a glass substrate multilayer structure including a flexible glass substrate and a polyimide-based shatterproof layer formed on one surface of the flexible glass substrate, and a flexible display panel including the same are provided.

Provided are a glass multilayer structure, a method of producing the same, and a flexible display panel including the same. Specifically, a glass substrate multilayer structure including: a flexible glass substrate, a polyimide-based shatterproof layer formed on one surface of the flexible glass substrate, and an epoxy siloxane-based hard coating layer formed on the shatterproof layer, and a flexible display panel including the same are provided.

Heat sink and method of manufacturing a graphene based heat sink, the method comprising: providing a first and second graphene film; arranging a layer of nanoparticles on a surface of the first and second graphene film to improve an adhesion strength between the graphene films; attaching the second graphene film to the first graphene film by means of an adhesive and the layer of nanoparticles; forming a laminated graphene film comprising a number of graphene film layers by repeating the steps, wherein the laminated graphene film is formed to have an anisotropic thermal conductivity; assembling a plurality of laminated graphene films by applying pressure and heat to cure the adhesive to form a graphene block; and removing selected portions of the graphene block to form a heat sink comprising fins extending from a base plate of the heat sink.

The present invention provides a flexible organic light emitting diode (OLED) module stacked structure and a manufacturing method of the flexible OLED module stacked structure. The structure includes a substrate, a thin film transistor (TFT) array layer, an OLED element layer, a thin film encapsulation layer, a cover plate, and a foam layer. The thin film encapsulation layer is disposed on the OLED element layer, and entirely covers the OLED element layer. The foam layer is disposed on one side of the substrate away from the TFT array layer. The protective film in place of a back plate is used and removed, and the foam layer is used to provide a support and buffering function, so an overall thickness is reduced, and less ash is produced.

A flexible display motherboard includes a carrier substrate, a flexible substrate and a display device disposed on the flexible substrate, where a plurality of heating resistors are arranged between the carrier substrate and the flexible substrate, and a binding force between the heating resistor and the carrier substrate is greater than a binding force between the heating resistor and the flexible substrate; the flexible substrate has an extension portion filled between adjacent heating resistors, and a molecular chain structure of the extension portion forms a hydrogen bond with the molecular chain structure of the carrier substrate; the heating resistor is used for heating the carrier substrate and the flexible substrate, so that heat generated by the heating resistor breaks the hydrogen bond.

A flexible substrate with a high optical transparency (>80% from 400 to 750 nm) that is retained after exposure to 300° C., near-zero birefringence (<±0.001), and a relatively low CTE (<60 ppm/° C.) is disclosed. The substrate may be manufactured as single layer, polyimide films and as a multi-layer laminate comprising a polyimide layer and a thin glass layer. The polyimides may include alicyclic dianhydrides and aromatic, cardo diamines. The films formed of the polyimides can serve as flexible substrates for optical displays and other applications that require their unique combination of properties.