The invention provides a laminate including a polyimide film and an inorganic substrate, which has a number density of blisters including carbide particles therein of 50/m.sup.2 or less, an average height of blisters of 2 μm or less, a product of the number density of the blisters (blisters/m.sup.2) and the average height of the blisters (μm) of 20 or less. The inventive laminate can be obtained by laminating the polyimide film and the inorganic substrate after sufficiently purifying and cleaning to remove foreign bodies made of inorganic substance therefrom, followed by heat treating the laminate at a temperature of 350-600° C. and then rapidly cooling it to carbonize and reduce the organic foreign bodies, and also to rapidly cool the gas contained in the blisters, which leads to reduced height of blisters.

To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.

A thermoplastic polymer advanceable by solid state polymerization is blended with at least one dissimilar thermoplastic polymer. The blend is solid state polymerized to provide a modified polymer alloy blend having at least one physical or chemical property different from that of the blend before solid state polymerization. The modified polymer alloy blend may be coextruded with a layer of thermoplastic extrusion polymer having a melt viscosity similar to that of the modified polymer alloy.

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance. The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

There is provided a fishing rod preventing or suppressing deviation or inclination of a fitting on a surface of a rod body. The fishing rod includes an elongated cylindrical rod body, a fitting having a mounting portion and mounted to an outer peripheral surface of the rod body via the mounting portion, a first layer formed by winding a first sheet so as to enclose the mounting portion and the rod body, the first sheet being made of a fiber-reinforced resin or a resin having a thermal shrinkage rate of 2.5% or lower, and a second layer formed by winding a second sheet made of a fiber-reinforced resin on an outer side of the first sheet, wherein a temperature at which a loss tangent of the first sheet has a maximum value is different from a temperature at which a loss tangent of the second sheet has a maximum value.

Method of manufacturing a vertically aligned laminated graphene based thermally conductive film. The method comprising: attaching first and second graphene film using a layer of nanoparticles and an adhesive; forming a layered film comprising a predetermined number of graphene film layers by repeating the steps of arranging a layer of nanoparticles, arranging an adhesive and attaching a graphene film; and laminating the layered film by applying pressure and heat to cure the adhesive, thereby forming a laminate film; cutting the laminate film at an angle in relation to a surface plane of the film to form the vertically aligned laminated graphene based thermally conductive film.

The present invention employs a polyimide film, which has a coefficient of thermal expansion (CTE) that is a negative number at a temperature equal to or greater than 350 C., as a debonding layer for separating a flexible substrate and a carrier substrate, and thus can easily separate a flexible substrate from a carrier substrate by using a detaching phenomenon caused by a difference in residual stress between the flexible substrate and the debonding layer after a high-temperature process for producing an element on the flexible substrate. Therefore, the present invention can separate the flexible substrate without causing chemical or physical damage to the element formed on the flexible substrate, thereby minimizing problems that may occur during a stripping process.

A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.

An example display device includes a display element having at least one portion which can be changed into a curved shape; and a flexible window member stacked onto the display element, wherein the thickness of a portion of the window member is less than that of the other portions.

An embodiment of the present inventive concept provides a display device including: a mother substrate on which a plurality of display modules are located; and a mother film located on a rear surface of the mother substrate, wherein the mother film may include a first layer, and a second layer disposed between the first layer and the mother substrate, the second layer has a thickness of from about 40 m to about 60 m, and a thickness of the first layer may be greater than that of the second layer.