Fiber sheets each including internal pores therein are prepared. A fibrous body including the fiber sheets is formed by stacking the fiber sheets and joining the fiber sheets to each other at joining regions. Silica xerogel is put into the internal pores of each of the fiber sheets of the fibrous body by impregnation. The put silica xerogel is hydrophobized while a space is formed between the fiber sheets in a non-joining region between the joining regions of the fibrous body. This method provides a heat-insulating device resistant to a force in surface directions and having a predetermined thickness.

A heat-conducting sheet 1 comprising a first heat-conducting layer 1a and a second heat-conducting layer 1b, which each comprise a polymer matrix 2 and an anisotropic filler 3, and wherein the anisotropic filler is oriented in a thickness direction. The first and second heat-conducting layers 1a and 1b are laminated via an interface 5 in which a filling ratio of the anisotropic filler 3 is lower than that of the first and second heat-conducting layers 1a and 1b.

The Internet of Things (IoT)-based receiver according to an aspect of the present disclosure includes a signal receive unit that receives a signal from a base station, which supports one IoT mode among a plurality of IoT modes, a mode determination unit determinates the IoT mode that is supported by the base station based on the received signal, and a function unit that processes a function related to IoT-based communication, supports each of the plurality of IoT modes, and operates based on the IoT mode, which is supported by the base station, among the plurality of IoT modes that is determined by the mode determination unit.

A shielding material fabricating apparatus according to the present invention includes: a mixing unit mixing a resin and a carbon fiber; an extrusion unit extruding a mixture obtained in the mixing unit; and a cutting unit cutting an extrudate extruded from the extrusion unit. The shielding material fabricating apparatus according to the present invention is capable of: reducing a manufacturing time and promoting simplification of a process when fabricating an electromagnetic wave shielding material; improving performance in mixing the resin and the carbon fiber, thereby fabricating an electromagnetic wave shielding material having a superior shielding rate; and cutting a metal-plated carbon fiber and simultaneously making the resin impregnated therein without a delay in time, thereby making it possible to use a long fiber as it is in a non-pelletized state.

Provided is a resin composition comprising a polymaleimide compound (A) represented by the following general formula (1), a modified polyphenylene ether (B) having a terminal modified with a substituent containing a carbon-carbon unsaturated double bond, and a filler (C):

##STR00001##

wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group; and n is an average value and represents 1<n5.

A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.

Film laminates containing a layer of a lower melting polyaryletherketone and a layer of a higher melting polyaryletherketone adhered to each other are resistant to heat, wear, moisture, weathering and chemicals and are useful for producing articles such as laminated electronic circuits, flexible heaters, insulated wire and cable, radio frequency identification tags and labeled articles.

A touch sensor panel includes a base layer, a touch sensor layer, and a first insulating layer in this order. The touch sensor layer includes a patterned conductive layer. A water vapor transmission rate Pc of the base layer at a temperature of 40 C. and a humidity of 90% RH is not higher than 900 g/(m.sup.224 hr). A water vapor transmission rate Pa of the first insulating layer at a temperature of 40 C. and a humidity of 90% RH is not higher than 900 g/(m.sup.224 hr).

The present disclosure relates to insulation. Teachings thereof may be embodied in a solid insulation material, especially in tape form, the use thereof in a vacuum impregnation process and to an insulation system produced therewith, and also an electrical machine comprising the insulation system, especially for the medium- and high-voltage sector, namely for medium- and high-voltage machines, especially rotating electrical machines in the medium- and high-voltage sector, and to semifinished products for electrical switchgear. For example a solid insulation material with an anhydride-free impregnating agent may include: a carrier; a barrier material; a curing catalyst; and a tape adhesive. The curing catalyst and the tape adhesive are inert toward one another but react under the conditions of a vacuum impregnation process if combined with an anhydride-free impregnating agent having gelation times of 1 h to 15 h at impregnation temperature. The tape adhesive is free of oxirane groups and includes at least two free hydroxyl groups.

Various embodiments may include a solid insulation material, e.g. in tape form, the use thereof in a vacuum impregnation process, and/or an insulation system produced therewith and also an electrical machine having the insulation system, for the medium- and high-voltage sector. Some examples include rotating electrical machines in the medium- and high-voltage sector and also semifinished products for electrical switchgear. The solid insulation material and the insulation system produced therewith are characterized in that it can be produced in an anhydride-free manner, wherein the curing catalyst is, for example, an adduct of a 1H-imidazole and/or 1H-imidazole derivative with a compound containing oxirane groups.